MATERIAL DECLARATION SHEET 8-SOIC Package Type (210 mil) Product Line Compliance Date November 31, 2004 RoHS Compliant Yes (-S suffix) MSL 1 Bourns TISP® products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP9110LDMR-S No. 1 2 3 Construction Element (subpart) Encapsulation Leadframe Chip Homogeneous Material Epoxy Resin Copper Alloy Silicon Material weight [g] 0.077397 0.047605 0.006475 4 Die Attach Silver epoxy 0.001536 5 6 Bond wires Terminal Finish Copper Matte Tin 0.000985 0.002137 Total Weight 0.135604 Headquarters Riverside CA Homogeneous Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Fused Silica (SiO2) Epoxy resin Phenol resin Epoxy Cresol Novolac Carbon Black 60676-86-0 85.00 6.00 6.00 48.514 3.425 3.425 29690-82-2 2.50 1.427 13333-86-4 0.50 0.285 Copper 7440-50-8 95.11 33.391 Iron 7439-89-6 2.24 0.787 Zinc 7440-66-6 0.03 0.010 Phosphorous 7723-14-0 0.10 0.034 Silver 7440-22-4 2.52 0.884 Silicon 7440-21-3 96.70 4.617 Aluminium 7429-90-5 2.48 0.119 Nickel 7440-02-0 0.69 0.033 Gold 7440-57-5 0.12 0.006 Silver 7440-22-4 75.00 0.850 Epoxy 9003-36-5 25.00 0.283 Copper 7440-50-8 99.99 Matte Tin 7440-31-5 100.00 0.335 1.570 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Subpart mass of total wt. (%) 57.076 35.106 4.775 1.133 0.335 1.570 Rev Jan 2013 page 1 of 1