DMR-Package (8-SOIC) MDS

MATERIAL DECLARATION SHEET
8-SOIC
Package Type
(210 mil)
Product Line
Compliance Date
November 31, 2004
RoHS Compliant
Yes
(-S suffix)
MSL
1
Bourns TISP® products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP9110LDMR-S
No.
1
2
3
Construction
Element (subpart)
Encapsulation
Leadframe
Chip
Homogeneous
Material
Epoxy Resin
Copper Alloy
Silicon
Material
weight [g]
0.077397
0.047605
0.006475
4
Die Attach
Silver epoxy
0.001536
5
6
Bond wires
Terminal Finish
Copper
Matte Tin
0.000985
0.002137
Total Weight
0.135604
Headquarters Riverside CA
Homogeneous
Material\
Substances
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Fused Silica (SiO2)
Epoxy resin
Phenol resin
Epoxy Cresol
Novolac
Carbon Black
60676-86-0
85.00
6.00
6.00
48.514
3.425
3.425
29690-82-2
2.50
1.427
13333-86-4
0.50
0.285
Copper
7440-50-8
95.11
33.391
Iron
7439-89-6
2.24
0.787
Zinc
7440-66-6
0.03
0.010
Phosphorous
7723-14-0
0.10
0.034
Silver
7440-22-4
2.52
0.884
Silicon
7440-21-3
96.70
4.617
Aluminium
7429-90-5
2.48
0.119
Nickel
7440-02-0
0.69
0.033
Gold
7440-57-5
0.12
0.006
Silver
7440-22-4
75.00
0.850
Epoxy
9003-36-5
25.00
0.283
Copper
7440-50-8
99.99
Matte Tin
7440-31-5
100.00
0.335
1.570
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
Subpart
mass of total
wt. (%)
57.076
35.106
4.775
1.133
0.335
1.570
Rev Jan 2013 page 1 of 1
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