1840 Series

No.
1
2
3
4
5
6
7
8
9
10
11
12
Construction
Element(subpart)
Housing
Terminal block
washer 1
screw 1
Pin
P. Standoff
P. Standoff thread
Bolt retainer
link
washer 2
washer 3
washer 4
Homogeneous
Material
Valox 420 SEO
Material weight
[g]
8.7
Nylon insulation –
PA66
1.26
Terminal body
1.7
Terminal finish
0.007
Zinc screw
1
Wire protector
0.2
Wire protector
finish
0.001
Stainless steel
0.1
Stainless steel
Tin plate Brass
Tin plate Alloy
C36000
Tin plate Alloy
C36000
Phosphate - oil
finish spring steel
Tin plate Brass
Stainless steel
Tin plate Brass
Tin plate Brass
0.2
0.2
6.3
2.0
0.1
0.3
0.05
0.05
0.5
Homogeneous Material\
CASRN
Substances
if applicable
Materials
Mass %
Material Mass % of
total unit wt.
PBT
30965-26-5
55
6.96
glass fiber
65997-17-3
30
3.80
antimony trioxide
1309-64-4
4
0.51
TBBPA polycarbonate
secret
11
1.39
Polyamide 66
32131-17-2
100
1.83
Copper
7440-50-8
70
1.73
Zinc
7440-66-6
30
0.74
Nickel
7440‐02‐0
10
0.00
Tin
7440-31-5
90
0.01
Zinc
7440-66-6
100
1.45
Copper
7440-50-8
70
0.20
Tin
7440-31-5
30
0.09
Tin
7440-31-5
100
0.00
Iron
7439-89-6
87
0.13
Chrome
7440-47-3
13
0.02
Iron
7439-89-6
72
0.21
Chrome
7440-47-3
17.6
0.05
Nickel
7440‐02‐0
10.4
0.03
copper
7440-50‐8
93.1
0.27
zinc
7440-66-6
5
0.01
Tin
7440‐31‐5
1.9
0.01
Copper
7440-50‐8
65.7
6.02
Zinc
7440-66-6
33
3.02
Lead
7439-92-1
1
0.09
Tin
7440‐31‐5
0.3
0.03
Copper
7440-50‐8
61.1
1.78
Zinc
7440-66-6
35.5
1.03
Lead
7439-92-1
3
0.09
Tin
7440‐31‐5
0.4
0.01
Iron
7439-89-6
92
0.13
Zinc
7440-66-6
8
0.01
copper
7440-50‐8
69.1
0.30
zinc
7440-66-6
28
0.12
Tin
7440‐31‐5
2.9
0.01
Iron
7439-89-6
72
0.05
Chrome
7440-47-3
17.6
0.01
Nickel
7440‐02‐0
10.4
0.01
copper
7440-50‐8
70
0.05
zinc
7440-66-6
28
0.02
Tin
7440‐31‐5
2.0
0.00
copper
7440-50‐8
70
0.51
zinc
7440-66-6
29.1
0.21
Tin
7440‐31‐5
0.9
0.01
Iron
13
14
15
16
screw 2
Clamp 1
Clamp 2
Filler material
Dice
High melting point solder
17
Lead frame clip
Tin/lead plate rolled
steel
Tin/lead plate rolled
steel
Epoxy
Silicon with metal
Tin-lead solder
Copper alloy
3.7
12.1
7.2
9
0.004650
0.002325
0.039900
Mold compound
Epoxy material
0.045570
Plating cover
Tin solder
0.000930
Semiconductor Device
Silicon chip
0.01
Lead frame
18
Stainless steel
Copper alloy with
silver plating
0.05
7439-89-6
79
4.25
Chrome
7440-47-3
15
0.81
Nickel
7440‐02‐0
6
0.32
Iron
7439-89-6
98.6
17.35
Tin
7440‐31‐5
1.2
0.21
Lead
7439-92-1
0.2
0.04
Iron
7439-89-6
98
10.26
Tin
7440‐31‐5
1.7
0.18
Lead
7439-92-1
0.3
0.03
Bishenol A/Epicholorohydrin
25068-38-6
28.0
3.67
2 N-butyl glycidyl
02426-08-6
8.0
1.05
Aluminum trihydrate
21645-51-2
20.0
2.62
Decabromodiphenyl oxide
01163-19-5
12.0
1.57
Zinc borate
013332-07-6
4.0
0.52
Antimony trioxide
01309-64-4
4.0
0.52
Fumed silica
07631-86-9
4.0
0.52
Amides
68443-08-3
8.0
1.05
Aminoethyl
00140-31-8
5.0
0.65
Nonylphenol
25154-52-3
5.0
0.65
Tetraethylenepentamine
00112-57-2
2.0
0.26
Silicon
7440-21-3
98.0
0.01
Nickel
7440‐02‐0
2.0
0.00
Lead
7439-92-1
93.6
0.00
tin
7440‐31‐5
5.0
0.00
silver
7440-22-4
1.4
0.00
copper
7440-50‐8
97.8
0.06
Iron
7439-89-6
2.1
0.00
silica
7631-86-9
70.0
0.05
Subpart mass of
total wt. (%)
12.65
1.83
2.47
0.01
1.45
0.29
0.00
0.15
0.29
0.29
9.16
2.91
0.15
0.44
0.07
0.07
0.73
5.38
17.60
10.47
13.09
0.01
0.00
0.06
epoxy resin
68928-70-1
20.0
0.01
antimony trioxide
1309-64-4
4.9
0.00
Phenolic resin
29690-82-2
5.1
0.00
Tin
7440‐31‐5
100.0
0.00
0.00
doped silicon
7440-21-3
100.0
0.01
0.01
copper
7440-50‐8
97.3
0.07
Chromium III
7440-47-3
0.3
0.00
0.07
0.07
Lead frame
Bondwire
Copper alloy with
silver plating
Gold wire
0.05
0.00
18
Die attach
Mold compound
Epoxy resin
0.00
0.04
Matte tin plate
Matte tin
0.00
Dice
Silicon with metal
0.004650
High melting point solder
19
Adhesive
Lead frame clip
Mold compound
Plating cover
PCB material
Tin plate
Tin-lead solder
Copper alloy
Epoxy material
Tin solder
FR4
Tin/lead
0.002325
0.039900
0.045570
0.000930
3.6
0.23
20
Solder ink
21
23
24
0.23
electronic copper
copper
0.45
Solder Paste
Solder paste 96.5
Sn, 3.5 Ag
0.1
lateral electrodes
22
ink
Kovar
1.36
Substrate
Ceramic
0.84
Central electrode
Copper
0.47
Filler material
Cusil
0.4
Tin plate
Tin
0.04
lateral electrodes
Kovar
0.48
Substrate
Ceramic
0.46
Filler material
Cusil
0.2
Tin plate
Tin
0.05
Sealant
Silicone elastomer
total
4.9
68.8
Tin
7440‐31‐5
0.3
0.00
zinc
7440-66-6
0.2
0.00
Silver
7440-22-4
2.0
0.00
Gold
7440-57-5
100
0.00
Di-ester resin
secret
3
0.00
Functionaziled ester
secret
7
0.00
polymeric compound
secret
3
0.00
Silver
7440-22-4
87
0.00
Silica fused
60676-86-0
90.5
0.05
epoxy resin
secret
4.7
0.00
Phenolic resin
secret
4.7
0.00
Carbon black
1333-86-4
0.1
0.00
Tin
7440‐31‐5
100
0.00
Silicon
7440-21-3
98.0
0.01
Nickel
7440‐02‐0
2.0
0.00
Lead
7439-92-1
93.6
0.00
tin
7440‐31‐5
5.0
0.00
silver
7440-22-4
1.4
0.00
copper
7440-50‐8
97.8
0.06
Iron
7439-89-6
2.1
0.00
silica
7631-86-9
70.0
0.05
epoxy resin
68928-70-1
20.0
0.01
antimony trioxide
1309-64-4
4.9
0.00
Phenolic resin
29690-82-2
5.1
0.00
Tin
7440‐31‐5
100.0
0.00
Copper
7440-50-8
20
1.05
Epoxy resin
26265-08-7
40
2.09
Continuous filament fiber glass
65997-17-3
40
2.09
Tin
7440‐31‐5
63
0.21
lead
7439-92-1
37
0.12
Phenolic resin
61788-97-4
32
0.10
DBE
95481-62-2
25
0.08
Barium sulfate
7727-43-7
25
0.08
Silica
10279-57-9
3
0.01
DPHA
29570-58-9
15
0.05
Copper
7440-50-8
100
0.65
Tin
7440‐31‐5
96.5
0.14
Silver
7440-22-4
3.5
0.01
Iron
7439-89-6
58
1.15
nickel
7440‐02‐0
42
0.83
Alumina
1344-28-1
95
1.16
Silicon dioxide
1344-28-1
5
0.06
Copper
7440-50‐8
100
0.68
silver
7440-22-4
72
0.42
Copper
7440-50‐8
28
0.16
Tin
7440‐31‐5
100
0.06
Iron
7439-89-6
58
0.40
nickel
7440‐02‐0
42
0.29
Alumina
1344-28-1
95
0.64
Silicon dioxide
1344-28-1
5
0.03
silver
7440-22-4
72
0.21
Copper
7440-50‐8
28
0.08
Tin
7440‐31‐5
100
0.07
dimethyl siloxane
70131-67-8
60
4.28
Trimethylated silica
68909-20-6
30
2.14
Methyltrimethoxysilane
1185-55-3
10
0.71
0.07
0.00
0.00
0.05
0.00
0.01
0.00
0.06
0.07
0.00
5.24
0.33
0.33
0.65
0.15
1.98
1.22
0.68
0.58
0.06
0.70
0.67
0.29
0.07
7.13
100.00
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