No. 1 2 3 4 5 6 7 8 9 10 11 12 Construction Element(subpart) Housing Terminal block washer 1 screw 1 Pin P. Standoff P. Standoff thread Bolt retainer link washer 2 washer 3 washer 4 Homogeneous Material Valox 420 SEO Material weight [g] 8.7 Nylon insulation – PA66 1.26 Terminal body 1.7 Terminal finish 0.007 Zinc screw 1 Wire protector 0.2 Wire protector finish 0.001 Stainless steel 0.1 Stainless steel Tin plate Brass Tin plate Alloy C36000 Tin plate Alloy C36000 Phosphate - oil finish spring steel Tin plate Brass Stainless steel Tin plate Brass Tin plate Brass 0.2 0.2 6.3 2.0 0.1 0.3 0.05 0.05 0.5 Homogeneous Material\ CASRN Substances if applicable Materials Mass % Material Mass % of total unit wt. PBT 30965-26-5 55 6.96 glass fiber 65997-17-3 30 3.80 antimony trioxide 1309-64-4 4 0.51 TBBPA polycarbonate secret 11 1.39 Polyamide 66 32131-17-2 100 1.83 Copper 7440-50-8 70 1.73 Zinc 7440-66-6 30 0.74 Nickel 7440‐02‐0 10 0.00 Tin 7440-31-5 90 0.01 Zinc 7440-66-6 100 1.45 Copper 7440-50-8 70 0.20 Tin 7440-31-5 30 0.09 Tin 7440-31-5 100 0.00 Iron 7439-89-6 87 0.13 Chrome 7440-47-3 13 0.02 Iron 7439-89-6 72 0.21 Chrome 7440-47-3 17.6 0.05 Nickel 7440‐02‐0 10.4 0.03 copper 7440-50‐8 93.1 0.27 zinc 7440-66-6 5 0.01 Tin 7440‐31‐5 1.9 0.01 Copper 7440-50‐8 65.7 6.02 Zinc 7440-66-6 33 3.02 Lead 7439-92-1 1 0.09 Tin 7440‐31‐5 0.3 0.03 Copper 7440-50‐8 61.1 1.78 Zinc 7440-66-6 35.5 1.03 Lead 7439-92-1 3 0.09 Tin 7440‐31‐5 0.4 0.01 Iron 7439-89-6 92 0.13 Zinc 7440-66-6 8 0.01 copper 7440-50‐8 69.1 0.30 zinc 7440-66-6 28 0.12 Tin 7440‐31‐5 2.9 0.01 Iron 7439-89-6 72 0.05 Chrome 7440-47-3 17.6 0.01 Nickel 7440‐02‐0 10.4 0.01 copper 7440-50‐8 70 0.05 zinc 7440-66-6 28 0.02 Tin 7440‐31‐5 2.0 0.00 copper 7440-50‐8 70 0.51 zinc 7440-66-6 29.1 0.21 Tin 7440‐31‐5 0.9 0.01 Iron 13 14 15 16 screw 2 Clamp 1 Clamp 2 Filler material Dice High melting point solder 17 Lead frame clip Tin/lead plate rolled steel Tin/lead plate rolled steel Epoxy Silicon with metal Tin-lead solder Copper alloy 3.7 12.1 7.2 9 0.004650 0.002325 0.039900 Mold compound Epoxy material 0.045570 Plating cover Tin solder 0.000930 Semiconductor Device Silicon chip 0.01 Lead frame 18 Stainless steel Copper alloy with silver plating 0.05 7439-89-6 79 4.25 Chrome 7440-47-3 15 0.81 Nickel 7440‐02‐0 6 0.32 Iron 7439-89-6 98.6 17.35 Tin 7440‐31‐5 1.2 0.21 Lead 7439-92-1 0.2 0.04 Iron 7439-89-6 98 10.26 Tin 7440‐31‐5 1.7 0.18 Lead 7439-92-1 0.3 0.03 Bishenol A/Epicholorohydrin 25068-38-6 28.0 3.67 2 N-butyl glycidyl 02426-08-6 8.0 1.05 Aluminum trihydrate 21645-51-2 20.0 2.62 Decabromodiphenyl oxide 01163-19-5 12.0 1.57 Zinc borate 013332-07-6 4.0 0.52 Antimony trioxide 01309-64-4 4.0 0.52 Fumed silica 07631-86-9 4.0 0.52 Amides 68443-08-3 8.0 1.05 Aminoethyl 00140-31-8 5.0 0.65 Nonylphenol 25154-52-3 5.0 0.65 Tetraethylenepentamine 00112-57-2 2.0 0.26 Silicon 7440-21-3 98.0 0.01 Nickel 7440‐02‐0 2.0 0.00 Lead 7439-92-1 93.6 0.00 tin 7440‐31‐5 5.0 0.00 silver 7440-22-4 1.4 0.00 copper 7440-50‐8 97.8 0.06 Iron 7439-89-6 2.1 0.00 silica 7631-86-9 70.0 0.05 Subpart mass of total wt. (%) 12.65 1.83 2.47 0.01 1.45 0.29 0.00 0.15 0.29 0.29 9.16 2.91 0.15 0.44 0.07 0.07 0.73 5.38 17.60 10.47 13.09 0.01 0.00 0.06 epoxy resin 68928-70-1 20.0 0.01 antimony trioxide 1309-64-4 4.9 0.00 Phenolic resin 29690-82-2 5.1 0.00 Tin 7440‐31‐5 100.0 0.00 0.00 doped silicon 7440-21-3 100.0 0.01 0.01 copper 7440-50‐8 97.3 0.07 Chromium III 7440-47-3 0.3 0.00 0.07 0.07 Lead frame Bondwire Copper alloy with silver plating Gold wire 0.05 0.00 18 Die attach Mold compound Epoxy resin 0.00 0.04 Matte tin plate Matte tin 0.00 Dice Silicon with metal 0.004650 High melting point solder 19 Adhesive Lead frame clip Mold compound Plating cover PCB material Tin plate Tin-lead solder Copper alloy Epoxy material Tin solder FR4 Tin/lead 0.002325 0.039900 0.045570 0.000930 3.6 0.23 20 Solder ink 21 23 24 0.23 electronic copper copper 0.45 Solder Paste Solder paste 96.5 Sn, 3.5 Ag 0.1 lateral electrodes 22 ink Kovar 1.36 Substrate Ceramic 0.84 Central electrode Copper 0.47 Filler material Cusil 0.4 Tin plate Tin 0.04 lateral electrodes Kovar 0.48 Substrate Ceramic 0.46 Filler material Cusil 0.2 Tin plate Tin 0.05 Sealant Silicone elastomer total 4.9 68.8 Tin 7440‐31‐5 0.3 0.00 zinc 7440-66-6 0.2 0.00 Silver 7440-22-4 2.0 0.00 Gold 7440-57-5 100 0.00 Di-ester resin secret 3 0.00 Functionaziled ester secret 7 0.00 polymeric compound secret 3 0.00 Silver 7440-22-4 87 0.00 Silica fused 60676-86-0 90.5 0.05 epoxy resin secret 4.7 0.00 Phenolic resin secret 4.7 0.00 Carbon black 1333-86-4 0.1 0.00 Tin 7440‐31‐5 100 0.00 Silicon 7440-21-3 98.0 0.01 Nickel 7440‐02‐0 2.0 0.00 Lead 7439-92-1 93.6 0.00 tin 7440‐31‐5 5.0 0.00 silver 7440-22-4 1.4 0.00 copper 7440-50‐8 97.8 0.06 Iron 7439-89-6 2.1 0.00 silica 7631-86-9 70.0 0.05 epoxy resin 68928-70-1 20.0 0.01 antimony trioxide 1309-64-4 4.9 0.00 Phenolic resin 29690-82-2 5.1 0.00 Tin 7440‐31‐5 100.0 0.00 Copper 7440-50-8 20 1.05 Epoxy resin 26265-08-7 40 2.09 Continuous filament fiber glass 65997-17-3 40 2.09 Tin 7440‐31‐5 63 0.21 lead 7439-92-1 37 0.12 Phenolic resin 61788-97-4 32 0.10 DBE 95481-62-2 25 0.08 Barium sulfate 7727-43-7 25 0.08 Silica 10279-57-9 3 0.01 DPHA 29570-58-9 15 0.05 Copper 7440-50-8 100 0.65 Tin 7440‐31‐5 96.5 0.14 Silver 7440-22-4 3.5 0.01 Iron 7439-89-6 58 1.15 nickel 7440‐02‐0 42 0.83 Alumina 1344-28-1 95 1.16 Silicon dioxide 1344-28-1 5 0.06 Copper 7440-50‐8 100 0.68 silver 7440-22-4 72 0.42 Copper 7440-50‐8 28 0.16 Tin 7440‐31‐5 100 0.06 Iron 7439-89-6 58 0.40 nickel 7440‐02‐0 42 0.29 Alumina 1344-28-1 95 0.64 Silicon dioxide 1344-28-1 5 0.03 silver 7440-22-4 72 0.21 Copper 7440-50‐8 28 0.08 Tin 7440‐31‐5 100 0.07 dimethyl siloxane 70131-67-8 60 4.28 Trimethylated silica 68909-20-6 30 2.14 Methyltrimethoxysilane 1185-55-3 10 0.71 0.07 0.00 0.00 0.05 0.00 0.01 0.00 0.06 0.07 0.00 5.24 0.33 0.33 0.65 0.15 1.98 1.22 0.68 0.58 0.06 0.70 0.67 0.29 0.07 7.13 100.00