TI S P ® T el ec om O ver v ol ta ge P r ote ctor s. TISP® products in SMD pack ages meet the requir ements of JEDEC J-STD-020 MSL 1 when ass embled using the following s older pr ofile. Lead Free SMD Solder Reflow Profile Profile Feature Condition Preheat 150 oC (Tsmin) to 200 oC (Tsmax) Time 60 - 150 s. Average Ramp-Up Rate (Tsmax to tp) 3 oC/second max. Time maintained above liquidus ( tL ) 217 oC 60 - 150 s Time within 5 oC of Peak Temperature (tp) 20 - 40 s 260 oC +0/-5 oC max Peak temperature (tp) 6 oC/second max Ramp-Down Rate Time from 25 oC to Peak Temperature 8 minutes max SDA01 300 tp Ramp-up 250 Ramp-down Ts max Temperature (°C) 200 tL Ts min 150 100 Preheat 50 0 0 30 60 90 120 150 180 210 240 270 300 330 360 Time (Seconds) TSP Lead Free SMD Profile Rev2 Oct 06 390 420 450 480