2DTA-10

MATERIAL DATA SHEET
Material #
2DTA-10-Q24RLF
Product Line
Integrated Passive & Active Devices
Date
2004/5/27
RoHS Compliant?
Yes
COMPONENT DETAILS
No.
Construction
element
Material group
Material
weight [g]
1
Lead Frame
Lead Frame
0.0744
2
Wafer
Silicon
0.01434
3
Gold Bond wire
Conductor
0.000352
4
Silver paste
Die Attach
0.000808
5
Molding
Component
Outer
0.0401
Total weight
Headquarters Riverside CA
Materials
Cu
Sn
Silicon
CAS
if applicable
7440-50-8
7440-31-5
7440-57-5
Epoxy
Silica fused
Epoxy resin
Phenol resin
95.53%
4.46%
98~99%
1~2%
Other material
Au
SI
Ag
Average mass
[%]
99%
1%
78~82%
18~22%
60676-86-0
75-95%
6-10%
2-6%
Sum [%]
Traces
100
100
100
100
100
0.1300
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