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ISL54000, ISL54001, ISL54002
EW DESIGNS
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October 17, 2007
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1-888-INTERS
FN6458.2
Integrated Audio Amplifier Systems
Features
The Intersil ISL54000, ISL54001, ISL54002 family of devices
are integrated audio power amplifier systems that combine
stereo BTL 8 amplifiers in a single package. The devices are
designed to operate from a single +2.7V to +5V power supply.
All devices are offered in a 20 Ld 4x4 thin QFN package.
Targeted applications include handheld equipment such as
cell-phones, MP3 players, and games/toys.
• Pb-Free (RoHS Compliant)
The ISL54000, ISL54001, ISL54002 parts contain two class
AB bridge-tied (BTL) type power amplifiers for driving stereo
8 speakers. Each BTL is capable of delivering 800mW (typ)
with 0.4% THD+N and 941mW (typ) with 1% THD+N of
continuous average power into an 8BTL speaker load
when using a 5V supply.
• Low Power Shutdown
The ISL54001 and ISL54002 feature a 2:1 stereo input
multiplexer front-end. This allows selection between two
stereo sources. In addition the ISL54002 has the capability
of mixing the stereo inputs.
• TTL Logic-Compatible
• Class AB 941mW Stereo BTL Speaker Amplifiiers
• Single Supply Operation . . . . . . . . . . . . . . . . .+2.7V to +5.5V
• THD+N at 1kHz, 800mW into 8 . . . . . . . . . . . . . . . . . .0.4%
• THD+N at 1kHz, 941mW into 8 . . . . . . . . . . . . . . . . . . . 1%
• Thermal Shutdown Protection
• “Click and Pop” Suppression Circuitry
• 2:1 Stereo Input Mux (ISL54001, ISL54002)
• Mixing of Two Stereo Inputs (ISL54002)
• Available in 20 Ld 4x4 Thin QFN
Applications
All devices in this family feature low power shutdown,
thermal overload protection and click/pop suppression. The
click and pop circuitry eliminates audible transients during
audio source changes and transitioning in and out of
shutdown.
• Battery powered, Handheld, and Portable Equipment
- Cellular/mobile Phones
- PDA’s, MP3 Players, DVD Players, Cameras
- Laptops, Notebooks, Palmtops
- Handheld Games and Toys
• Desktop Computers
ISL54002 Typical Application Circuit and Block Diagram
0.1µF
RIGHT AUDIO 1
0.22µF
IN1R
0.22µF
IN2R
0.22µF
IN1L
RIGHT AUDIO 2
VDD
OUTR+
BTL
MUX/MIXER
OUTR-
LEFT AUDIO 1
OUTL+
0.22µF
LEFT AUDIO 2
MUX/MIXER
IN2L
BTL
OUTL-
CLICK AND POP
THERMAL
PROTECTION
BIAS
REF
SD
MICRO
CONTROLLER
INS
CREF
1µF
LOGIC CONTROL
MIX
GND
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL54000, ISL54001, ISL54002
ISL54000 ISL54001 ISL54002
NAME
FUNCTION
NC
NC
INR
NC
Pin Descriptions
ISL54000
(20 LD 4X4 TQFN)
TOP VIEW
GND
Pinouts
3, 6, 8, 12 3, 6, 8, 12 3, 6, 8, 12
VDD
System Power Supply
20
19
18
17
16
PIN
14 SD
VDD
3
13 NC
GND
4
12 VDD
OUTR+
5
11 INL
6
7
8
9
10
REF
2
GND
OUTL+
VDD
15 NC
OUTR-
1
VDD
OUTL-
GND
IN2R
INS
IN1R
NC
ISL54001
(20 LD 4X4 TQFN)
TOP VIEW
20
19
18
17
16
14 SD
VDD
3
13 IN2L
GND
4
12 VDD
OUTR+
5
11 IN1L
6
7
8
9
10
REF
2
GND
OUTL+
VDD
15 NC
OUTR-
1
VDD
OUTL-
GND
IN2R
INS
IN1R
MIX
ISL54002
(20 LD 4X4 TQFN)
TOP VIEW
20
19
18
17
16
14 SD
VDD
3
13 IN2L
GND
4
12 VDD
OUTR+
5
11 IN1L
6
7
8
9
10
REF
2
GND
OUTL+
VDD
15 NC
OUTR-
1
VDD
OUTL-
2
4, 9, 20
4, 9, 20
4, 9, 20
GND
Ground Connection
11
-
-
INL
Left Channel Audio
Input 1
-
11
11
IN1L
Left Channel Audio
Input 1
-
13
13
IN2L
Left Channel Audio
Input 2
17
-
-
INR
Right Channel Audio
Input 1
-
17
17
IN1R
Right Channel Audio
Input 1
-
19
19
IN2R
Right Channel Audio
Input 2
2
2
2
OUTL+
Positive Speaker
Output
5
5
5
OUTR+
Positive Speaker
Output
1
1
1
OUTL-
Negative Speaker
Output
7
7
7
OUTR-
Negative Speaker
Output
14
14
14
SD
Shutdown, High to
disable amplifiers,
Low for normal
operation.
-
18
18
INS
Input Select
-
-
16
MIX
Mixer, High to mix
Right and Left Audio
Inputs, Low to pass
Audio Inputs without
mixing
10
10
10
REF
Common-mode Bias
Voltage, Bypass with
a 1µF capacitor to
GND
13, 15,
16, 18, 19
15, 16
15
NC
No Connect
FN6458.2
October 17, 2007
ISL54000, ISL54001, ISL54002
Ordering Information
PART
NUMBER
PART
MARKING
ISL54000 Truth Table
TEMP.
RANGE
(°C)
PACKAGE
(Pb-Free)
Tape & Reel
PKG.
DWG. #
ISL54000IRTZ* 540 00IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A
(Note)
(Pb-free)
ISL54001IRTZ* 540 01IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A
(Note)
(Pb-free)
ISL54002IRTZ* 540 02IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A
(Note)
(Pb-free)
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets; molding compounds/die attach materials
and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which
is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
3
SD
OUTR+
OUTR-
OUTL+
OUTL-
1
Disabled
Disabled
Disabled
Disabled
0
INR
INR
INL
INL
ISL54001 Truth Table
SD
INS
OUTR+
OUTR-
OUTL+
OUTL-
1
X
Disabled
Disabled
Disabled
Disabled
0
0
IN1R
IN1R
IN1L
IN1L
0
1
IN2R
IN2R
IN2L
IN2L
ISL54002 Truth Table
SD MIX INS
OUTR+
OUTR-
OUTL+
OUTL-
1
X
X
Disabled
Disabled
Disabled
Disabled
0
0
0
IN1R
IN1R
IN1L
IN1L
0
0
1
IN2R
IN2R
IN2L
IN2L
0
1
X
IN1R +
IN2R
IN1R +
IN2R
IN1L +
IN2L
IN1L +
IN2L
FN6458.2
October 17, 2007
ISL54000, ISL54001, ISL54002
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V
Input Voltages
In_R, In_L, SD, INS, MIX . . . . . . . . . . . . . . -0.3V to (VDD + 0.3V)
Output Voltages
OUT_+, OUT_-. . . . . . . . . . . . . . . . . . . . . . -0.3V to (VDD + 0.3V)
Continuous Current (VDD, OUT_, GND) . . . . . . . . . . . . . . . . 750mA
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>200V
Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1kV
Thermal Resistance (Typical, Notes 1, 2) JA (°C/W) JC (°C/W)
20 Ld 4x4 TQFN Package . . . . . . . . . .
45
6.5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. JC, the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
2. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 5V Supply
PARAMETER
Test Conditions: VDD = +5V, GND = 0V, VINH = 2.4V, VINL = 0.8V, SD = MIX = INS = VINL,
CREF = 1µF, RL is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified
(Note 3).
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 4, 5)
Full
2.7
-
5.5
V
25
-
4.6
12
mA
Full
-
5.5
-
mA
25
-
28
50
µA
Full
-
31
-
µA
TYP
MAX
(Notes 4, 5) UNITS
GENERAL
Power Supply Range, VDD
INS = MIX = VINL or VINH, RL = NoneInputs AC
coupled to ground (0.1µF)
Quiescent Supply Current, IDD
Shutdown Supply Current, ISD
SD = VINH, INS = MIX = VINL or VINH, RL = 8
BTLInputs AC coupled to ground (0.1µF)
Input Resistance, RIN
INS = 0V or VDD
25
-
100
-
k
Thermal Shutdown, TSD
INS = MIX = 0V or VDD
25
-
150
-
°C
25
-
10
-
°C
INS = 0V or 5V, MIX = 0V or 5V
Full
-
1
-
ms
Measured OUT_+ and OUT_-, Input AC coupled to
ground (0.1µF)
25
-
38
-
mV
Full
-
49
-
mV
Thermal Shutdown Hysteresis
SD to Full Operation, TSD(ON)
BTL AMPLIFIER DRIVER
Output Offset Voltage, VOS
Power Supply Rejection Ratio,
PSRR
VRIPPLE = 200mVP-P, RL = 8 FRIPPLE = 217Hz
Input AC coupled to ground
FRIPPLE = 1kHz
(0.1µF)
25
-
49
-
dB
25
-
47
-
dB
Output Power, POUT
RL = 8 THD + N = 1%, f = 1kHz
25
-
941
-
mW
RL = 8THD + N = 10%,f kHz
25
-
1.23
-
W
25
-
0.4
-
%
Total Harmonic Distortion + Noise, RL = 8POUT = 800mW, f = 1kHz
THD + N
RL = 8POUT = 800mW, f = 20Hz to 20kHz
25
-
0.7
-
%
Max Output Voltage Swing, VOUT
RL = 8VSIGNAL = 5VP-P, f = 1kHz
25
7.2
7.7
-
VP-P
Signal to Noise Ratio, SNR
RL = 8POUT = 900mW, f = 1kHz
25
-
85
-
dB
Output Noise, NOUT
A - Weight filter, BW = 22Hz to 22kHz
25
-
125
-
µVRMS
4
FN6458.2
October 17, 2007
ISL54000, ISL54001, ISL54002
Electrical Specifications - 5V Supply
PARAMETER
Test Conditions: VDD = +5V, GND = 0V, VINH = 2.4V, VINL = 0.8V, SD = MIX = INS = VINL,
CREF = 1µF, RL is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified
(Note 3). (Continued)
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 4, 5)
TYP
MAX
(Notes 4, 5) UNITS
Crosstalk
RCH to LCH, LCH to RCH
RL = 8POUT = 800mW, f = 1kHz, Signal coupled
from the input of active amplifier to the output of an
adjacent amplifier with its input AC coupled to ground.
25
-
80
-
dB
Off-Isolation
SD = VINH, POUT = 800mW, f = 10kHz, Signal
coupled from input to output of a disabled amplifier.
25
-
130
-
dB
Channel Gain Matching
RCH to LCH
RL = 8VINxR = VINxL = 3.88VP-P (Connect to the
same source)
25
-
+-0.1
-
dB
Channel Phase Matching
RCH to LCH
RL = 8VINxR = VINxL = 3.88VP-P (Connect to the
same source)
25
-
0.01
-
°
Input Leakage Current, ISD, IINS,
IMIX
VDD = 5V, SD = 0V, INS = 0V, MIX = 0V
25
-3
1.9
3
µA
Full
-
1.9
-
µA
Input Leakage Current, ISD, IINS,
IMIX
VDD = 5V, SD = VDD, INS = VDD, MIX = VDD
25
-1
0.02
-1
µA
Full
-
0.02
-
µA
VINH
Full
2.4
-
-
V
VINL
Full
-
-
0.8
V
LOGIC INPUT
Electrical Specifications - 3.6V Supply Test Conditions: VDD = +3.6V, GND = 0V, VINH = 1.4V. VINL = 0.4V, SD = MIX = INS = GSO =
GS1 = VINL, CREF = 1µF. RL is terminated between OUT_+ and OUT_ -, Unless Otherwise
Specified (Note 3).
TEMP
(°C)
MIN
(Notes 4, 5)
TYP
25
-
2.7
12
mA
Full
-
3
-
mA
25
-
13
50
µA
Full
-
15
-
µA
25
-
25
-
mV
Full
-
40
-
mV
25
-
49
-
dB
25
-
47
-
dB
RL = 8THD + N = 1%, f = 1kHz
25
-
310
-
mW
RL = 8THD + N = 10%, f = 1kHz
25
-
528
-
mW
Total Harmonic Distortion + Noise,
THD + N
RL = 8POUT = 200mW, f = 1kHz
25
-
0.4
-
%
RL = 8POUT = 200mW, f = 20Hz to 20kHz
25
-
0.4
-
%
Max Output Voltage Swing, VOUT
RL = 8VSIGNAL = 3.6VP-P, f = 1kHz
25
-
5.8
-
VP-P
25
-3
1.9
3
µA
Full
-
1.9
-
µA
PARAMETER
TEST CONDITIONS
MAX
(Notes 4, 5) UNITS
GENERAL
Quiescent Supply Current, IDD
INS = 0V or VDD, MIX = 0V or VDD, RL = NoneInput
AC coupled to ground (0.1µF)
Shutdown Supply Current, ISD
INS = 0V or VDD, MIX = 0V or VDD, RL = 8BTL
Input AC coupled to ground (0.1µF)
BTL AMPLIFIER DRIVER, HD = VINH, HO = VINH, UNLESS OTHERWISE SPECIFIED
Output Offset Voltage, VOS
Measured between OUT_+ and OUT_-, Input AC
coupled to ground (0.1µF)
Power Supply Rejection Ratio, PSRR VRIPPLE = 200mVP-P, RL = 8 FRIPPLE = 217Hz
Input AC coupled to ground
FRIPPLE = 1kHz
(0.1µF)
Output Power, POUT
LOGIC INPUT
Input Leakage Current, ISD, IINS, IMIX VDD = 5V, SD = 0V, INS = 0V, MIX = 0V
5
FN6458.2
October 17, 2007
ISL54000, ISL54001, ISL54002
Electrical Specifications - 3.6V Supply Test Conditions: VDD = +3.6V, GND = 0V, VINH = 1.4V. VINL = 0.4V, SD = MIX = INS = GSO =
GS1 = VINL, CREF = 1µF. RL is terminated between OUT_+ and OUT_ -, Unless Otherwise
Specified (Note 3). (Continued)
TEMP
(°C)
MIN
(Notes 4, 5)
TYP
25
-1
0.02
1
µA
Full
-
0.02
-
µA
VINH
Full
1.4
-
-
V
VINL
Full
-
-
0.4
V
PARAMETER
TEST CONDITIONS
Input Leakage Current, ISD, IINS, IMIX VDD = 5V, SD = VDD, INS = VDD, MIX = VDD
MAX
(Notes 4, 5) UNITS
NOTES:
3. VIN = input voltage to perform proper function.
4. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
5. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
ISL54000 Typical Application Circuit and Block Diagram
0.1µF
VDD
0.22µF
RIGHT AUDIO
INR
OUTR+
BTL
OUTR-
0.22µF
INL
OUTL+
LEFT AUDIO
BTL
OUTL-
CLICK AND POP
THERMAL
PROTECTION
BIAS
REF
MICRO
CONTROLLER
CREF
1µF
SD
LOGIC CONTROL
GND
6
FN6458.2
October 17, 2007
ISL54000, ISL54001, ISL54002
ISL54001 Typical Application Circuit and Block Diagram
0.1µF
0.22µF
RIGHT 1 AUDIO
0.22µF
RIGHT 2 AUDIO
0.22µF
LEFT 1 AUDIO
VDD
IN1R
OUTR+
BTL
MUX
IN2R
OUTR-
IN1L
OUTL+
0.22µF
LEFT 2 AUDIO
BTL
MUX
IN2L
OUTL-
CLICK AND POP
THERMAL
PROTECTION
BIAS
REF
SD
MICRO
CONTROLLER
INS
CREF
1µF
LOGIC CONTROL
GND
ISL54002 Typical Application Circuit and Block Diagram
0.1µF
0.22µF
RIGHT 1 AUDIO
0.22µF
VDD
IN1R
OUTR+
MUX/MIXER
IN2R
BLT
OUTR-
RIGHT 2 AUDIO
0.22µF
IN1L
LEFT 1 AUDIO
OUTL+
0.22µF
LEFT 2 AUDIO
MUX/MIXER
IN2L
BLT
OUTL-
CLICK AND POP
THERMAL
PROTECTION
BIAS
REF
SD
MICRO
CONTROLLER
INS
CREF
1µF
LOGIC CONTROL
MIX
GND
7
FN6458.2
October 17, 2007
ISL54000, ISL54001, ISL54002
Detailed Description
The Intersil ISL54000, ISL54001, ISL54002 family of devices
are integrated audio power amplifier systems designed to
drive 8 speaker loads. They can operate with a supply
voltage of +2.7V to +5V and provide good quality audio, while
requiring minimal external components. Its low 0.4% THD+N
while driving 800mW into an 8 speaker ensures clean, low
distortion amplification of the audio signals. The devices are
offered in a 20 Ld 4x4 TQFN package. Targeted applications
include handheld equipment such as cell-phones, MP3
players, and games/toys.
The ISL54000, ISL54001, ISL54002 parts contain two class
AB bridge-tied (BTL) type power amplifiers for driving stereo
8 speakers. When powered with a 5V supply, each BTL is
capable of delivering 941mW (typ) of continuous average
power to an 8speaker load with 1% THD+N performance.
When the speaker load is connected across the positive and
negative terminals of the BTL driver, the voltage is doubled
across the load and the power is quadrupled.
The ISL54001 and ISL54002 feature a 2:1 stereo input
multiplexer front-end. This allows selection between two
stereo sources. The INS control pin determines which stereo
input is active. Applying a logic “0” to the INS control pin
selects stereo input 1 (R1 and L1). Applying a logic “1” to the
INS control pin selects stereo input 2 (R2 and L2).
The ISL54002 has the capability of mixing the two stereo
inputs. When in MIX Mode (MIX = “1”) the ISL54002 mixes
the R1 input with the R2 input and sends the combined
signal to the OUTR_ BTL driver and it mixes the L1 input
with the L2 input and sends the combined signal to the
OUTL_ BTL driver.
All devices in this family feature low power shutdown,
thermal overload protection and click/pop suppression. The
click and pop circuitry prohibits switching between input
channels until the audio input signals are at their lowest
point, which eliminates audible transients in the speakers
when changing audio input sources. The click/pop circuitry
also keeps speaker transients to an inaudibile level when
entering and leaving shutdown.
Typical application circuits and block diagrams for each
device in the family are on page 6 and 7.
DC Bias Voltage
required to calculate the capacitor value is shown in
Equation 1:
C  1  6.28  f  100k
(EQ. 1)
The 100k is the impedance looking into the input of the
ISL54000, ISL54001, and ISL54002 devices.
BTL Speaker Amplifiers
The ISL54000, ISL54001, and ISL54002 contain two
bridge-tied load (BTL) amplifiers designed to drive a speaker
load differentially. The output from one BTL is OUTL+ and
OUTL-. The output of the other BTL is OUTR+ and OUTR-.
A single BTL driver consists of inverting and non-inverting
power op amps. The AC signal out of each op amp are equal
in magnitude but 180° out-of-phase, so the AC signal at
OUTL+ and OUTL- have the same amplitude but are 180°
out-of-phase. The same is true of OUTR+ and OUTR-. The
speaker load gets connected between the + terminal and
- terminal outputs.
Driving the load differentially using a BTL configuration
doubles the output voltage across the speaker load and
quadruples the power to the load. In effect you get a gain of
two due to this configuration at the load as compared to
driving the load with a single-ended amplifier with its load
connected between a single amplifier’s output and ground.
The outputs of each BTL are biased at VDD/2. When the
load gets connected across the + and - terminal of the BTL,
the mid supply DC bias voltage at each output gets
cancelled out eliminating the need for large bulky output
coupling capacitors.
Low Power Shutdown
With a logic “1” at the SD control pin the device enters the
low power shutdown state. When in shutdown the output
amplifiers go into an high impedance state and supply
current is reduced to 26µA (typ).
In shutdown mode before the amplifiers enter the high
impedance/low current drive state, the bias voltage of VDD/2
remains connected at the output through a 100k resistor.
This resistor is not present during active operation of the
drivers but gets switched in when the SD pin goes high and
disconnected when the SD pin goes low.
The ISL54000, ISL54001, ISL54002 have internal DC bias
circuitry, which DC offsets the incoming audio signal at
VDD/2. When using a 5V supply, the DC offset will be 2.5V.
When using a 3.6V supply, the DC offset will be 1.8V.
Leaving the DC bias voltage connected through this 100k
resistor reduces the transient that is generated across the
speaker, while going into or out of shutdown, to a level that
does not produce clicking or popping in the speaker.
Since the signal gets biased internally at VDD/2, the audio
signals need to be AC coupled to the inputs of the device.
The value of the AC coupling capacitor depends on the low
frequency range required for the application. A capacitor of
0.22µF will pass a signal as low as 7.2Hz. The formula
QFN Thermal Pad Considerations
8
The QFN package features an exposed thermal pad on its
underside. This pad lowers the package’s thermal resistance
by providing a direct heat conduction path from the die to the
PCB. Connect the exposed thermal pad to GND by using a
FN6458.2
October 17, 2007
ISL54000, ISL54001, ISL54002
large copper pad and multiple vias to the GND plane. The
vias should be plugged and tented with plating and solder
mask to ensure good thermal conductivity.
Best thermal performance is achieved with the largest
practical copper ground plane area.
PCB Layout Considersations and Power
Supply Bypassing
To maintain the highest load dissipation and widest output
voltage swing the power supply PCB traces and the traces
that connect the output of the drivers to the speaker loads
should be made as wide as possible to minimize losses due
to parasitic trace resistance.
Proper supply bypassing is necessary for high power supply
rejection and low noise performance. A filter network
consisting of a 10µF capacitor in parallel with a 0.1µF
capacitor is recommended at the voltage regulator that is
providing the power to the ISL54000, ISL54001, and
ISL54002 IC.
Local bypass capacitors of 0.1µF should be put at each VDD
pin of the ISL54000, ISL54001, ISL54002 devices. They
should be located as close as possible to the pin, keeping
the length of leads and traces as short as possible.
A 1µF capacitor from the REF pin (pin 10) to GND is needed
for optimum PSRR and internal bias voltage stability.
1.0
0.9 VDD = 5V
0.8 BTL
0.7 RL = 8
PO = 800mW
0.6
1.0
0.9 VDD = 3.6V
0.8 BTL
0.7 RL = 8
0.6 PO = 200mW
0.5
0.5
THD+N (%)
THD+N (%)
Typical Performance Curves TA = +25°C, Unless Otherwise Specified.
0.4
0.3
0.2
0.1
0.4
0.3
0.2
20
50
100
200
500 1k
2k
FREQUENCY (Hz)
5k
0.1
10k 20k
20
100
200
500
1k
2k
5k
10k 20k
FREQUENCY (Hz)
FIGURE 1. THD+N vs FREQUENCY
FIGURE 2. THD+N vs FREQUENCY
10.0
10.0
VDD = 5V
5.00 BTL
RL = 8
2.00 f = 1kHz
VDD = 3.6V
5.00 BTL
RL = 8
2.00 f = 1kHz
1.00
1.00
THD+N (%)
THD+N (%)
50
0.50
0.20
0.50
0.20
0.10
0.10
0.05
0.05
0.02
0.02
0.01
10m
20m
50m
100m
200m
500m
OUTPUT POWER (W)
FIGURE 3. THD+N vs OUTPUT POWER
9
1
0.01
10m
20m
40m
70m 100m
200m
600m
OUTPUT POWER (W)
FIGURE 4. THD+N vs OUTPUT POWER
FN6458.2
October 17, 2007
ISL54000, ISL54001, ISL54002
-40
V
= 5V
-45 DD
PO = 800mW
-50
-55
-60
-65
-70
-75
-80
-85
-90
-95
-100
-105
-110
-115
-120
20
50
100
OFFISOLATION (dB)
CROSSTALK (dB)
Typical Performance Curves TA = +25°C, Unless Otherwise Specified. (Continued)
RCH TO LCH
LCH TO RCH
VDD = 5V
PO = 800mW
200
500
1k
2k
5k
-80
-85
-90
-95
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
-155
-160
20
10k 20k
50
100
POWER DISSIPATION (mW)
1k
2k
5k
10k 20k
700
VDD = 5V
BTL
600 RL = 8
500
400
300
200
100
2k
5k
10k 20k
FIGURE 7. PSRR vs FREQUENCY
400
500
FIGURE 6. OFFISOLATION vs FREQUENCY
POWER DISSIPATION (mW)
PSRR (dB)
FIGURE 5. CROSSTALK vs FREQUENCY
-20
-22 VDD = 5V
-24
-26 BTL
-28 VRIPPLE = 200mVP-P
-30
-32
-34
-36
-38
-40
-42
-44
-46
-48
-50
-52
-54
-56
-58
-60
-62
-64
-66
-68
-70
10
20
50 100 200
500 1k
FREQUENCY (Hz)
200
FREQUENCY (Hz)
FREQUENCY (Hz)
0
0
250
500
POUT (mW)
750
1000
FIGURE 8. POWER DISSIPATION vs OUTPUT POWER
Die Characteristics
VDD = 3.6V
SUBSTRATE POTENTIAL (POWERED UP):
350 BTL
RL = 8
GND
300
PROCESS:
250
Submicron CMOS
200
150
100
50
0
0
100
200
300
POUT (mW)
400
500
FIGURE 9. POWER DISSIPATION vs OUTPUT POWER
10
FN6458.2
October 17, 2007
ISL54000, ISL54001, ISL54002
Thin Quad Flat No-Lead Plastic Package
(TQFN)
Thin Micro Lead FramePlastic Package
(TMLFP)
L20.4x4A
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220WGGD-1 ISSUE I)
MILLIMETERS
SYMBOL
MIN
NOMINAL
MAX
NOTES
A
0.70
0.75
0.80
-
A1
-
0.02
0.05
-
A2
-
0.55
0.80
9
A3
b
0.20 REF
0.18
D
0.30
5, 8
4.00 BSC
D1
D2
0.25
9
-
3.75 BSC
1.95
2.10
9
2.25
7, 8
E
4.00 BSC
-
E1
3.75 BSC
9
E2
1.95
e
2.10
2.25
7, 8
0.50 BSC
-
k
0.20
-
-
-
L
0.35
0.60
0.75
8
N
20
2
Nd
5
3
Ne
5
3
P
-
-
0.60

-
-
12
9
9
Rev. 0 11/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &  are present when
Anvil singulation method is used and not present for saw
singulation.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
11
FN6458.2
October 17, 2007
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