523AN

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UQFN8, 1.6x1.6, 0.5P
CASE 523AN−01
ISSUE O
8
1
SCALE 4:1
A
B
D
ÏÏ
ÏÏ
PIN ONE
REFERENCE
2X
0.10 C
ÎÎÎ
ÏÏÏ
ÎÎÎ
EXPOSED Cu
E
A1
DATE 26 NOV 2008
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
MOLD CMPD
A3
DETAIL B
DIM
A
A1
A3
b
D
E
e
L
L1
L3
OPTIONAL
CONSTRUCTION
2X
0.10 C
TOP VIEW
L1
(A3)
DETAIL B
L3
A
0.05 C
b
(0.10)
0.05 C
SIDE VIEW
C
A1
SEATING
PLANE
(0.15)
DETAIL A
OPTIONAL
CONSTRUCTION
GENERIC
MARKING DIAGRAM*
1
8X
8X
L3
L
XX MG
e
5
3
1
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
7
8
DETAIL A
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.60 BSC
0.50 BSC
0.35
0.45
−−−
0.15
0.25
0.35
8X
b
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
SOLDERING FOOTPRINT*
1.70
0.50
PITCH
1
0.35
7X
0.25
1.70
8X
0.53
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON36348E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
8 PIN UQFN, 1.6X1.6, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON36348E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY YW LEE.
DATE
26 NOV 2008
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2008
November, 2008 − Rev. 01O
Case Outline Number:
523AN
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