369AE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DPAK−5 (TO−252, 5 LEAD)
CASE 369AE
ISSUE A
DATE 14 AUG 2013
SCALE 1:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. THERMAL PAD CONTOUR OPTIONAL, WITHIN
DIMENSIONS SHOWN.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15mm PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
A
E
b2
A
B
c2
D1
D
H
DETAIL A
1
2 3
4
E1
5
DIM
A
A1
b
b2
c
c2
D
D1
E
E1
e
H
L
L1
L2
c
e
SIDE VIEW
b
0.12
TOP VIEW
M
BOTTOM VIEW
C A B
H
C
A1
0.10 C
L
L2
5.04
REF
2.74
REF
L1
GUAGE
PLANE
DETAIL A
MILLIMETERS
MIN
MAX
2.10
2.50
0.00
0.13
0.40
0.60
5.14
5.54
0.40
0.60
0.40
0.60
5.40
6.30
4.80
5.10
6.35
6.80
4.75
5.05
1.27 BSC
9.50
10.20
1.39
1.78
2.50
2.90
0.51 BSC
GENERIC
MARKING DIAGRAM*
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
ALTERNATE
CONSTRUCTION
XXXXXXG
ALYWW
5.70
1
6.00
10.50
5X
2.10
5X
1.27
PITCH
0.80
A
L
Y
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON53250E
ON SEMICONDUCTOR STANDARD
1
http://onsemi.com
DPAK−5 (TO−252, 5 LEAD)
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON53250E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
14 OCT 2010
A
ADDED ADDITIONAL BOTTOM VIEW OPTION. REQ. BY J. LIU.
14 AUG 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
August, 2013 − Rev. A
Case Outline Number:
369AE