DATASHEET

ISL55005
IGNS
W DES
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MENDE LACEMENT P
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015 Sheet
MENDE 12, ISL55Data
RECOM
ISL550
®
May 22, 2006
MMIC Silicon Bipolar Broadband Amplifier
Features
The ISL55005, ISL55007, ISL55008 and ISL55009,
ISL55010, ISL55011 constitute a family of high performance
gain blocks featuring a Darlington configuration using high ft
transistors and excellent thermal performance. They are an
ideal choice for DVB-S LNB cable receiver applications.
• Input impedance of 75Ω
ISL55005, ISL55007, ISL55008 offer higher OIP3
performance while the ISL55009, ISL55010, ISL55011 offer
lower operating supply currents.
• Low input and output return losses
ISL55005 and ISL55009 match a 75Ω source to a 50Ω load.
ISL55007 and ISL55010 match a 75Ω source to a 75Ω load.
ISL55008 and ISL55011 match a 50Ω source to a 50Ω load.
Applications
FN6199.0
• Output impedance of 50Ω
• Noise figure of 3.6dB
• OIP3 of 17dBm
• Pb-free plus anneal available (RoHS compliant)
• LNB and LNB-T line amplifiers
• IF gain blocks for satellite and terrestrial HDTV STBs
• PA driver amplifier
Ordering Information
PART
NUMBER
(Note)
PART
MARKING
ISL55005IEZ-T7 CSA
• Wireless data, satellite
TAPE &
REEL
PACKAGE
(Pb-Free)
7” (3k pcs) 6 Ld SC-70
PKG.
DWG. #
• Bluetooth/WiFi
• Satellite locator and signal strength meters
P6.049
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
Typical Application Circuit
Pinout
6 LD SC-70
+3.3V
0.1µF
100pF
100pF
3
4
6
68pF
0.1µF
GND
1
6
OUT
GND
2
5
GND
IN
3
4
VSP
100nH
68pF
1, 2, 5
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2006. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
ISL55005
Absolute Maximum Ratings (TA = 25°C)
Supply Voltage from VSP to GND . . . . . . . . . . . . . . . . . . . . . . . . 6V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . VS+ +0.3V to GND -0.3V
Power Dissipation . . . . . . . . . . . . See Packging Information Section
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .3000V
Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .300V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are
at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
Gt
P1dB
OIP3
VSP = +3.3V, Zrsc = Zload = 50Ω, TA = 25°C, unless otherwise specified.
DESCRIPTION
CONDITIONS
Small Signal Gain
Output Power at 1dB Compression
Output Third Order Intercept Point
MIN
TYP
MAX
UNIT
1.0GHz
16.2
17.2
18.2
dB
1.5GHz
16.0
17.0
18.0
dB
2.0GHz
15.6
16.6
17.6
dB
1.0GHz
5.5
7.5
9.5
dBm
2.0GHz
4.9
6.4
7.9
dBm
1.0GHz
18.0
dBm
2.0GHz
17.3
dBm
BW
3dB Bandwidth
3dB below Gain @ 500MHz
3.0
GHz
IRL
Input Return Loss
1.0GHz Zrsc = 75Ω, Zload = 50Ω
14.5
dB
ORL
Output Return Loss
1.0GHz Zrsc = 75Ω, Zload = 50Ω
17.6
dB
RISOL
Reverse Isolation
2.0GHz
21.8
dB
NF
Noise Figure
2.0GHz
3.6
dB
ID
Device Operating Current
17.5
20.6
23.5
mA
Device Test Setup
Agilent _8753ES
VNA
50Ω
50Ω
CONNECTORLESS
PLATFORM
50Ω
PIN 3
DC BLOCK
PIN 6
PICOSECOND LABS
MODEL 5542
50Ω
DUT
BIAS TEE
3.3V
PICOSECOND LABS
MODEL 5508-110
I1
I2
IDEVICE
INPUT
REFERENCE
PLANE
2
OUTPUT
REFERENCE
PLANE
3.3V
POWER
SUPPLY
FN6199.0
May 22, 2006
ISL55005
Typical Performance Curves Zsrc = 75Ω, Zload = 50Ω
16
16
12
12
ORL (dB)
20
IRL (dB)
20
8
4
8
4
0
0.5
1.0
1.5
2.0
Frequency (GHz)
2.5
0
0.5
3.0
FIGURE 1. INPUT RETURN LOSS vs FREQUENCY
1.0
1.5
2.0
Frequency (GHz)
2.5
3.0
FIGURE 2. OUTPUT RETURN LOSS vs FREQUENCY
18.0
-8.0
17.2
-8.6
16.4
-9.2
S11 (dB)
S21 (dB)
Typical Performance Curves 50Ω environment
15.6
14.8
-9.8
-10.4
14.0
0.5
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
-11.0
0.5
3.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
FIGURE 4. |S11| vs FREQUENCY
-21.0
-9.0
-21.4
-9.8
-21.8
-10.6
S22 (dB)
S12 (dB)
FIGURE 3. |S21| vs FREQUENCY
1.0
-22.2
-22.6
-11.4
-12.2
-23.0
0.5
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
FIGURE 5. |S12| vs FREQUENCY
3
3.0
-13.0
0.5
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
FIGURE 6. |S22| vs FREQUENCY
FN6199.0
May 22, 2006
ISL55005
Typical Performance Curves 50Ω environment (Continued)
8.0
1dBm Output Compression Point
(dBm)
21
7.6
20
7.2
OIP3 (dBm)
19
6.8
18
6.4
17
1.5
2.0
FREQUENCY (GHz)
2.5
6.0
0.5
3.0
FIGURE 7. OIP3 vs FREQUENCY
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
FIGURE 8. P1dB vs FREQUENCY
5
Noise Figure (dB)
4
3
2
1
0
0.5
1.0
1.5
2.0
FREQUENCY (GHz)
2.5
3.0
1.8
0.6
1.6
0.7
1.4
1.2
0.8
0.9
1.0
FIGURE 9. NOISE FIGURE vs FREQUENCY
2.0
0.2
0.4
0.4
3.0
0.6
0.3
0.8
4.0
1.0
5.0
1.0
0.2
6.0
0.8
7.0
0.6
8.0
9.0
10
0.1
0.4
20
50
10
20
3.0
2.0
1.8
1.6
1.4
1.2
0.9
0.5
0.4
0.8
0.6
1.0
0.8
0.2
2.2
1.0
3 GHz
S11
4.0
0.3
4.0
20
7.0
0.2
2.2
0.5 GHz
1.0
5.0
0.7
0.4
6.0
0.6
0.5 GHz
8.0
9.0
10
0
1.0
0.2
3 GHz
0.1
50
50
0.1
0.2
S22
5.0
1.0
0.5
1.0
0.8
0.3
0.6
3.0
0.4
0.4
1.8
2.0
0.5
1.4
1.2
1.0
0.9
0.8
0.7
1.6
0.6
0.2
16
0.5
RF Café 2002
FIGURE 10. S11 AND S22 vs FREQUENCY
4
FN6199.0
May 22, 2006
ISL55005
Packaging Information
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
POWER DISSIPATION (W)
0.3
0.25
0.2
0.15
176mW
θ
JA
0.1
SC
7
=5 0-6
67
°C
/W
0.05
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
5
FN6199.0
May 22, 2006
ISL55005
Small Outline Transistor Plastic Packages (SC70-6)
0.20 (0.008) M
VIEW C
C
P6.049
CL
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
e
b
6
INCHES
5
4
CL
CL
E1
E
1
2
3
e1
C
D
CL
A
A2
A1
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.031
0.043
0.80
1.10
-
A1
0.000
0.004
0.00
0.10
-
A2
0.031
0.039
0.00
1.00
-
b
0.006
0.012
0.15
0.30
b1
0.006
0.010
0.15
0.25
c
0.003
0.009
0.08
0.22
6
c1
0.003
0.009
0.08
0.20
6
D
0.073
0.085
1.85
2.15
3
E
0.071
0.094
1.80
2.40
-
E1
0.045
0.053
1.15
1.35
3
SEATING
PLANE
e
-C-
e1
L
0.10 (0.004) C
MILLIMETERS
0.0256 Ref
0.65 Ref
0.0512 Ref
0.010
0.018
-
1.30 Ref
0.26
-
0.46
L1
0.017 Ref.
0.420 Ref.
L2
0.006 BSC
0.15 BSC
WITH
b
N
PLATING
b1
R
0.004
-
0.10
-
R1
0.004
0.010
0.15
0.25
α
0o
8o
0o
8o
c
c1
6
4
6
5
Rev. 2 9/03
BASE METAL
NOTES:
1. Dimensioning and tolerance per ASME Y14.5M-1994.
4X θ1
2. Package conforms to EIAJ SC70 and JEDEC MO203AB.
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
R1
4. Footlength L measured at reference to gauge plane.
R
5. “N” is the number of terminal positions.
GAUGE PLANE
SEATING
PLANE
L
C
L1
4X θ1
α
L2
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only
VIEW C
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
6
FN6199.0
May 22, 2006
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