DATASHEET

ISL55013
ESIGNS
NEW D
R
O
F
D
PART
E
MMEND PLACEMENT
O
C
E
R
E
DR
N OT
MENDE L55014 Data Sheet
R E C OM
IS
®
February 13, 2007
FN6283.0
MMIC Silicon Bipolar Broadband Amplifier
Features
The ISL55013 is a high performance gain block featuring a
Darlington configuration using high fT transistors and
excellent thermal performance. They are an ideal choice for
DVB-S LNB cable receiver applications.
• Input impedance of 50Ω
Other members of the family include:
• Noise figure of 5.0dB
ISL55012 and ISL55015 match a 75Ω source to a 50Ω load.
ISL55013 and ISL55014 match a 50Ω source to a 50Ω load.
• OIP3 of 31dBm
Ordering Information
• Pb-free available (RoHS compliant)
PART
NUMBER
(Note)
• Output impedance of 50Ω
• Gain of 11.8dB @1GHz
• Low input and output return losses
Applications
PART
MARKING
ISL55013IEZ-T7 CCH
TAPE &
REEL
PACKAGE
(Pb-Free)
7” (3k pcs) 6 Ld SC-70
PKG.
DWG. #
• LNB and LNB-T (HDTV) amplifiers
P6.049
• IF gain blocks for satellite and terrestrial STBs
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
• PA driver amplifier
Typical Application Circuit
Pinout
• Wireless data, satellite
• Bluetooth/WiFi
• Satellite locator and signal strength meters
(6 LD SC-70)
TOP VIEW
+5V
24Ω
0.1µF
100pF
100pF
3
4
6
68pF
100nH
GND
1
6
OUT
GND
2
5
GND
IN
3
4
VSP
0.1µF
68pF
1, 2, 5
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2007. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
ISL55013
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
Supply Voltage from VSP to GND . . . . . . . . . . . . . . . . . . . . . . . . 6V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . VS+ +0.3V to GND -0.3V
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +135°C
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .6000V
Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .300V
Thermal Resistance (Typical)
θJA (°C/W)
6 Ld SC-70 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
200
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only.
Electrical Specifications
PARAMETER
VSP = +5V, ZRSC = ZLOAD = 50Ω, TA = +25°C, 24Ω VSP to OUT, unless otherwise specified.
DESCRIPTION
CONDITIONS
MIN
TYP
MAX
UNIT
5.5
V
VSP
Supply Voltage
To operate below 5V, the 24Ω resistor to
supply should be reduced
3.0
Gt
Small Signal Gain
1.0GHz
10.6
11.8
13.1
dB
1.5GHz
10
11.2
12.5
dB
2.0GHz
9.8
11.2
12.3
dB
1.0GHz
15.9
17.4
18.9
dBm
2.0GHz
15.5
17
18.5
dBm
P1dB
OIP3
Output Power at 1dB Compression
Output Third Order Intercept Point
1.0GHz
31.5
dBm
2.0GHz
28.3
dBm
OIP2
Output Second Order Intercept Point
Input tones at 1.0GHz and 1.1GHz, at Input
Power = -15dBm, Output tone 2.1GHz
49.1
dBm
BW
3dB Bandwidth
3dB below Gain @ 500MHz
2.8
GHz
IRL
Input Return Loss
1.0GHz
15.8
dB
ORL
Output Return Loss
1.0GHz
15.9
dB
RISOL
Reverse Isolation
2.0GHz
17.8
dB
NF
Noise Figure
2.0GHz
5.0
dB
ID
Device Operating Current
2
54
62.3
69
mA
FN6283.0
February 13, 2007
ISL55013
Device Test Setup
AGILENT _8753ES
VNA
50Ω
50Ω
CONNECTORLESS
PLATFORM
50Ω
PIN 3
DC BLOCK
PICOSECOND LABS
MODEL 5542
PIN 6
50Ω
DUT
BIAS TEE
5V
PICOSECOND LABS
MODEL 5508-110
24Ω
I1
I2
IDEVICE
INPUT
REFERENCE
PLANE
OUTPUT
REFERENCE
PLANE
5V
POWER
SUPPLY
Typical Performance Curves 50Ω environment
18
15
15
ORL (dB)
18
IRL (dB)
12
9
12
9
6
6
3
3
0
0.5G
1.0G
1.5G
2.0G
FREQUENCY (Hz)
2.5G
0
0.5G
3.0G
FIGURE 1. INPUT RETURN LOSS vs FREQUENCY
1.0G
1.5G
2.0G
FREQUENCY (Hz)
2.5G
3.0G
FIGURE 2. OUTPUT RETURN LOSS vs FREQUENCY
0
14
-2
-4
-6
S11 (dB)
S21 (dB)
12
10
8
-8
-10
-12
-14
-16
6
0.5G
1.0G
1.5G
2.0G
FREQUENCY (Hz)
2.5G
FIGURE 3. |S21| vs FREQUENCY
3
3.0G
-18
0.5G
1.0G
1.5G
2.0G
FREQUENCY (Hz)
2.5G
3.0G
FIGURE 4. |S11| vs FREQUENCY
FN6283.0
February 13, 2007
ISL55013
Typical Performance Curves 50Ω environment (Continued)
-8
-16
-10
S22 (dB)
S12 (dB)
-17
-18
-19
-20
0.5G
-12
-14
-16
1.0G
1.5G
2.0G
FREQUENCY (Hz)
2.5G
-18
0.5G
3.0G
2.0G
2.5G
3.0G
FIGURE 6. |S22| vs FREQUENCY
20
34
10
32
FUNDAMENTAL (1GHz AND 1.1GHz)
0
30
HD (dBm)
-10
28
26
-20
-30
-40
-50
24
-60
22
IM2 (2.1GHz)
-70
20
0.5G
1.0G
1.5G
2.0G
2.5G
-80
-25
3.0G
-20
FREQUENCY (Hz)
FIGURE 7. OIP3 vs FREQUENCY
-15
-10
INPUT POWER (dBm)
-5
0
FIGURE 8. IM2 vs INPUT POWER
19
1dB OUTPUT COMPRESSION
POINT (dBm)
6
5
NOISE FIGURE (dB)
1.5G
FREQUENCY (Hz)
FIGURE 5. |S12| vs FREQUENCY
OIP3 (dBm)
1.0G
4
3
2
1
0
0.5G
1.0G
1.5G
2.0G
2.5G
FREQUENCY (Hz)
FIGURE 9. NOISE FIGURE vs FREQUENCY
4
3.0G
18
17
16
15
14
13
12
11
10
0.5G
1.0G
1.5G
2.0G
2.5G
3.0G
FREQUENCY (Hz)
FIGURE 10. P1dB vs FREQUENCY
FN6283.0
February 13, 2007
ISL55013
1.8
0.6
1.6
0.7
1.4
1.2
0.8
0.9
1.0
Typical Performance Curves 50Ω environment (Continued)
0.5
2.0
0.2
0.4
3.0
0.4
0.6
0.3
0.8
4.0
1.0
1.0
5.0
0.2
6.0
0.8
7.0
0.6
8.0
9.0
10
0.1
50
20
10
5.0
4.0
3.0
2.0
1.8
1.6
1.4
0.9
0.8
0.7
0.6
0.5
0.4
1.2
0.5 GHz
20
0.4
2.2
0.5 GHz
0.6
S11
0.8
1.0
0.2
6.0
0.3
1.0
0.2
7.0
0.2
50
8.0
9.0
10
3 GHz
5.0
0
2.2
1.0
50
1.0
3 GHz
0.1
20
0.2
0.1
0.4
S22
1.0
4.0
0.8
0.3
3.0
0.6
0.4
1.8
2.0
0.5
0.4
1.2
1.0
0.8
0.9
1.4
0.7
1.6
0.6
0.2
RF Café 2002
FIGURE 11. S11 AND S22 vs FREQUENCY
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
5
FN6283.0
February 13, 2007
ISL55013
Small Outline Transistor Plastic Packages (SC70-6)
0.20 (0.008) M
VIEW C
C
P6.049A
CL
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
e
b
6
INCHES
5
4
CL
CL
E1
E
1
2
3
e1
C
D
CL
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.031
0.039
0.80
1.00
-
A1
0.001
0.004
0.025
0.10
-
A2
0.034
0.036
0.85
0.90
-
b
0.006
0.012
0.15
0.30
-
b1
0.006
0.010
0.15
0.25
-
c
0.004
0.008
0.10
0.20
6
c1
0.004
0.006
0.10
0.15
6
D
0.073
0.085
1.85
2.15
3
E
E1
A
A2
A1
SEATING
PLANE
e
-C-
e1
L
0.10 (0.004) C
MILLIMETERS
0.084 BSC
0.045
0.053
2.1 BSC
1.15
0.0256 Ref
0.018
1.35
-
1.30 Ref
0.26
-
0.46
0.016 Ref.
0.400 Ref.
-
L2
0.006 BSC
0.15 BSC
-
WITH
N
PLATING
b1
R
0.004
-
0.10
-
α
0o
8o
0o
8o
c1
4
L1
b
c
3
0.65 Ref
0.0512 Ref
0.010
-
6
6
5
Rev. 0 7/05
NOTES:
BASE METAL
1. Dimensioning and tolerance per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC70 and JEDEC MO203AB.
4X θ1
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength L measured at reference to gauge plane.
R1
5. “N” is the number of terminal positions.
R
GAUGE PLANE
SEATING
PLANE
L
C
L1
α
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only
L2
4X θ1
VIEW C
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
6
FN6283.0
February 13, 2007
Similar pages