DSL70 Data Sheet (794 KB, EN)

DSL70
Silicon TVS diodes Array
• ESD / transient protection of e.g. ADSL, VDSL,
ISDN, WAN, LAN, I²C Bus, Microcontroller Inputs,
Video and other high-speed data lines in telecom
applications:
IEC61000-4-2 (ESD): ± 15 kV (Air / Contact)
IEC61000-4-4 (EFT): 4 kV / 80 A (5/50 ns)
IEC61000-4-5 (Lightning): 27 A (8/20 µs)
• Very low capacitance
• Extremly low reverse current < 5 nA
• Pb-free (RoHS compliant) package
DSL70
3
4
D3
D2
D4
D1
1
2
Type
Package
Configuration
Marking
DSL70
SOT143
2 channel, rail to rail
E4s
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
Value
Unit
ESD contact discharge per diode1)
VESD
15
kV
Peak pulse current (tp = 8 / 20 µs)2)
Ipp
27
A
Peak pulse power (tp = 8 / 20 µs)
Ppk
245
W
Operating temperature range
Top
-55...125
°C
Storage temperature
Tstg
-65...150
1V
ESD according to IEC61000-4-2
2I
pp according to IEC61000-4-5
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DSL70
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics -
Reverse working voltage
VRWM
-
-
50
V
Reverse current
IR
-
-
5
nA
VR = 50 V
Forward clamping voltage1)
V
VFC
IPP = 1 A, tP = 8/20 µs
-
1
1.5
IPP = 10 A, tP = 8/20 µs
-
2.5
3
IPP = 24 A, tP = 8/20 µs
-
5
6
IPP = 27 A, tP = 8/20 µs
-
6
9
Diode capacitance
pF
CT
VR = 0 V, f = 1 MHz, between I/0 and GND
-
2.5
5
VR = 0 V, f = 1 MHz, between I/0 pins
-
1.25
2.5
1I
PP according to IEC61000-4-5
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DSL70
Power derating curve Ppk = ƒ (T A)
Forward clamping voltage VFC = ƒ(IPP)
tp = 8 / 20 µs
8
110
V
6
80
VFC
Ppk or Ipp
90
70
5
60
4
50
3
40
30
2
20
1
10
0
0
25
50
75
100
°C
0
0
150
5
10
15
20
25
A
35
IPP
TA
Diode capacitance CT = ƒ (VR)
f = 1MHz
3
I/O to GND
CT
pF
1
0
0
5
10
15
20
V
30
VR
3
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DSL70
Application example DSL70
dual channel, rail to rail configuration
Connector
Protected signal line
Protected signal line
Vcc
I/O ESD sensitive
I/O
device
3
4
D3
D4
D2
1
D1
2
The protection diode should be placed
very close to the location where the
ESD or other transients can occur to
keep loops and inductances as small
as possible. Pin 1 should be connected
directly to a ground plane on the board.
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Package SOT143
DSL70
2
0.1 MAX.
10˚ MAX.
1
1 ±0.1
0.2
0.8 +0.1
-0.05
0.4 +0.1
-0.05
A
5
0...8˚
0.2 M A
0.25 M B
1.7
0.08...0.1
1.3 ±0.1
3
2.4 ±0.15
4
B
10˚ MAX.
2.9 ±0.1
1.9
0.15 MIN.
Package Outline
Foot Print
1.2
0.8
0.9
1.1
0.9
0.8 1.2 0.8
0.8
Marking Layout (Example)
RF s
56
Manufacturer
Pin 1
2005, June
Date code (YM)
BFP181
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
2.6
8
4
Pin 1
3.15
1.15
5
2011-06-17
DSL70
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
 2009 Infineon Technologies AG
All Rights Reserved.
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The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
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endangered.
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2011-06-17
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