ESD5V0S... Silicon TVS Diodes • ESD / transient protection of data and power lines in 3.3 V / 5 V applications according to: IEC61000-4-2 (ESD): ± 30 kV (contact) IEC61000-4-4 (EFT): 80 A (5/50 ns) IEC61000-4-5 (surge): 40 A/600 W (8/20 µs) • Max. working voltage: 5 V • Low clamping voltage • Low reverse current • Pb-free (RoHS compliant) package Applications • Uni or bi-directional operation possible (see application example page 5) • Mobile communication • Consumer products (STB, MP3, DVD, DSC...) • LCD displays, camera • Notebooks and desktop computers, peripherals - ESD5V0S1U-03W ESD5V0S2U-06 3 1 2 Type ESD5V0S1U-03W ESD5V0S2U-06 Package SOD323 SOT23 D1 D2 1 2 Configuration 1 line, uni-directional 2 lines, uni-directional 1 Marking yellow E E5 2011-06-17 ESD5V0S... Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit ESD contact discharge1) VESD 30 kV Peak pulse current (tp = 8 / 20 µs)2) Ipp 40 A Peak pulse power (tp = 8 / 20 µs) 2) Ppk 600 W Operating temperature range Top -55...125 °C Storage temperature Tstg -65...150 Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Characteristics - Reverse working voltage VRWM - - 5 Breakdown voltage V(BR) 5.5 6.7 8 V I(BR) = 1 mA Reverse current µA IR VR = 3.3 V - - 5 VR = 5 V - - 20 Clamping voltage (positive transient) V VCL IPP = 5 A, tp = 8/20 µs2) - 7.5 9.5 IPP = 24 A, tp = 8/20 µs2) - 9 12 IPP = 40 A, tp = 8/20 µs2) - 11 14 IPP = 5 A, tp = 8/20 µs2) - 1.5 3 IPP = 24 A, tp = 8/20 µs2) - 3 5 IPP = 40 A, tp = 8/20 µs2) - 4 6 - 430 500 Forward clamping voltage (negative transients) VFC Diode capacitance CT pF VR = 0 V, f = 1 MHz 1V ESD according to IEC61000-4-2 2I pp according to IEC61000-4-5 2 2011-06-17 ESD5V0S... Power derating curve Ppk = ƒ (T A) Clamping voltage Vcl = ƒ(Ipp) tp = 8 / 20 µs (positive transients) 110 14 V % 12 11 80 10 VCL Ppk or Ipp 90 70 9 8 60 7 50 6 40 5 30 4 3 20 2 10 1 0 0 25 50 75 °C 100 0 0 150 5 10 15 20 25 A 30 TA 40 Ipp Forward clamping voltage VFC = ƒ (IPP) tp = 8 / 20 µs (negative transient) Reverse current IR = ƒ(VR ) TA = Parameter 10 -5 14 V A 12 10 -6 11 9 IR VFC 10 10 -7 8 7 6 TA = 125°C 85°C 25°C -40°C 10 -8 5 4 10 -9 3 2 1 0 0 5 10 15 20 25 30 A 10 -10 0 40 Ipp 1 2 3 V 5 VR 3 2011-06-17 ESD5V0S... Diode capacitance CT = ƒ (VR) f = 1MHz 450 CT pF 350 300 250 200 150 0 1 2 3 V 5 VR 4 2011-06-17 ESD5V0S... Application example ESD5V01U-03W single channel, uni-directional Connector Protected signal line I/O ESD sensitive device 1 2 The protection diode should be placed very close to the location where the ESD can occur to keep loops and inductances as small as possible. Application example ESD5V0S2U-06 dual channel, uni-directional Connector Protected signal line 2 1 Protected signal line I/O I/O ESD sensitive device The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pin 3 should be connected directly to a ground plane on the board. 3 Application example ESD5V0S2U-06 single channel, bi-directional Connector Protected signal line ESD sensitive device I/O 1 3 2 5 Pin 2 should be connected directly to a ground plane on the board. Pin 3 is not connected. 2011-06-17 Package SOD323 6 ESD5V0S... 2011-06-17 Package SOT23 ESD5V0S... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 7 2011-06-17 ESD5V0S... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 8 2011-06-17