BAS85_C14.pdf

BAS85
Taiwan Semiconductor
Small Signal Product
CREAT BY ART
Hermetically Sealed Glass Fast Switching Schottky Barrier Diodes
FEATURES
- Low forward voltage drop
- Ideal for automated placement
- Hermetically sealed glass
- Compression bonded construction
- All external surfaces are corrosion
resistant and leads are readily solderable
- Solder hot dip tin (Sn) lead finish
MINI MELF
MECHANICAL DATA
- Polarity: Indicated by black cathode band
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
SYMBOL
VALUE
UNIT
PD
200
mW
VRRM
30
V
VR
30
V
Average Forward Rectified Current
IF(AV)
200
mA
Peak Forward Surge Current
IFSM
4
TJ
TSTG
Power Dissipation
Repetitive Peak Reverse Voltage
Maximum DC Blocking Voltage
Operating Junction Temperature
Storage Temperature Range
PARAMETER
SYMBOL
MIN
30
Breakdown Voltage
IR=10μA
BV
Reverse Leakage Current
VR=25V
IR
Forward Voltage
C
-65 to +125
o
C
TYP
MAX
2
IF=1.0mA
0.32
VF
0.40
IF=30mA
0.50
IF=100mA
0.80
(Note 1)
trr
UNIT
V
0.24
VR=1V, f=1.0MHz
CJ
Junction Capacitance
Note 1: Reverse recovery test conditions : IF=IR=10mA, RL=100Ω, IRR=1mA
Document Number: DS_S1412007
125
IF=0.1mA
IF=10mA
Reverse Recovery Time
A
o
5
μA
V
ns
10
pF
Version: C14
BAS85
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX (Note 1)
BAS85
PACKING CODE
PACKING CODE
L0
-xx
PACKAGE
SUFFIX
G
L1
PACKING
10K / 13" Reel
MINI MELF
2.5K / 7" Reel
Note 1: Part No. Suffix „-xx “ would be used for special requirement
EXAMPLE
PREFERRED P/N
PART NO.
BAS85 L0G
BAS85
BAS85-L0 L0G
PART NO.
SUFFIX
PACKING CODE
PACKING CODE
SUFFIX
L0
BAS85
-L0
L0
DESCRIPTION
G
Multiple manufacture
source
Halogen free
G
Define manufacture
source
Halogen free
PACKAGE OUTLINE DIMENSION
C
DIM.
B
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
3.30
3.70
0.130
0.146
B
1.40
1.60
0.055
0.063
C
0.20
0.50
0.008
0.020
A
SUGGEST PAD LAYOUT
Unit (mm)
Unit (inch)
Typ.
Typ.
A
1.25
0.049
B
2.00
0.079
C
2.50
0.098
D
5.00
0.197
DIM.
Document Number: DS_S1412007
Version: C14
BAS85
Taiwan Semiconductor
Small Signal Product
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_S1412007
Version: C14
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