RB500V-40 Taiwan Semiconductor Small Signal Product Low VF SMD Schottky Barrier Diode FEATURES - Low power loss, high current capability, low VF - Surface mount device type - Moisture sensitivity level (MSL): 1 - Packing code with suffix "G" means green compound (halogen-free) SOD-323F MECHANICAL DATA - Case: Flat lead SOD-323F small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Polarity: Indicated by cathode band - Weight: 4.85 ± 0.5 mg - Marking Code: S9 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Power Dissipation PD 200 mW Peak Reverse Voltage VRM 45 V Reverse Voltage VR 40 V Mean Forward Current IO 0.1 A IFSM 1.0 Non-Repetitive Peak Forward Surge Current 60Hz for 1 Cyc. Thermal Resistance (Junction to Ambient) (Note) Junction and Storage Temperature Range RθJA 500 TJ ,TSTG -40 to +125 A o C/W o C SYMBOL MIN MAX UNIT Reverse Breakdown Voltage IR = 100 μA V(BR) 45 - V Forward Voltage IF = 10 mA VF - 0.45 V Reverse Leakage Current VR = 10 V IR - 1 μA VR = 10V , f = 1.0 MHz CJ - 6.0 pF PARAMETER Junction Capacitance Note: Valid provided that electrodes are kept at ambient temeprature. Document Number: DS_S1412013 Version: C14 RB500V-40 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 1 Forward Current Derating Curve IO, Average Rectified Current (mA) 120 100 80 60 40 20 0 0 25 50 75 100 125 150 IF, Instantaneous Forward Current (mA) Fig. 2 Typical Forward Characteristics 100 10 TA=125°C TA=75°C TA=25°C TA=-25°C 1 0.1 0 200 TA, Ambient Temperature (oC) 600 800 1000 Fig. 4 Total Capacitance VS. Reverse Fig. 3 Typical Reverse Characteristics 100 1000 f=1MHz TA=125°C 100 10 CT, Total Capacitance (pF) IR, Instantaneous Reverse Current (μA) 400 VF, Instantaneous Forward Voltage (V) TA=75°C 1 TA=25°C 0.1 0.01 0 10 20 30 VR, Instantaneous Reverse Voltage (V) Document Number: DS_S1412013 40 10 1 0 5 10 15 20 25 30 35 40 VR, Reverse Voltage (V) Version: C14 RB500V-40 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PACKING PACKING CODE SUFFIX (Note 1) CODE SUFFIX PART NO. RB500V-40 -xx RR R9 G PACKAGE SOD-323F PACKING 3,000 / 7" Reel 10,000 / 13" Reel Note 1: Part No. Suffix „-xx “ would be used for special requirement EXAMPLE PART NO. PART NO. RB500V-40 RR RB500V-40 RR RB500V-40 RRG RB500V-40 RR G Multiple manufacture source Green compound RB500V-40-B0 RRG RB500V-40 RR G Defined manufacture source Green compound Document Number: DS_S1412013 SUFFIX -B0 PACKING CODE PACKING CODE PREFERRED P/N SUFFIX DESCRIPTION Multiple manufacture source Version: C14 RB500V-40 Taiwan Semiconductor Small Signal Product PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) Min Max Min Max A 1.15 1.35 0.045 0.053 B 2.30 2.80 0.091 0.110 C 0.25 0.40 0.010 0.016 D 1.60 1.80 0.063 0.071 E 0.80 1.10 0.031 0.043 F 0.05 0.25 0.002 0.010 SUGGEST PAD LAYOUT Unit (mm) Unit (inch) Typ. Typ. A 0.63 0.025 B 0.83 0.033 C 1.60 0.063 D 2.86 0.113 DIM. Document Number: DS_S1412013 Version: C14 RB500V-40 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1412013 Version: C14