SS22M - SS24M Taiwan Semiconductor CREAT BY ART 2A, 20V - 40V Surface Mount Schottky Barrier Rectifiers FEATURES - Very low profile - typical height of 0.68mm - Low power loss, high efficiency - Ideal for automated placement - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 MECHANICAL DATA Case: Micro SMA Molding compound, UL flammability classification rating 94V-0 Micro SMA Moisture sensitivity level: level 1, per J-STD-020 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.006 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL Marking code SS22M SS23M SS24M D E F 20 30 40 UNIT Maximum repetitive peak reverse voltage VRRM Maximum average forward rectified current IF(AV) 2 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 25 A VF 0.60 V Maximum instantaneous forward voltage (Note 1) @ 2.0A / TJ=25°C @ 2.0A / TJ=125°C Maximum reverse current @ rated VR TJ=25°C TJ=125°C Typical junction capacitance (Note 2) Typical thermal resistance Operating junction temperature range Storage temperature range V 0.55 150 μA 15 mA CJ 35 pF RθJL RθJC RθJA 15 20 105 °C/W TJ -55 to +150 °C TSTG -55 to +150 °C IR Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Measured at 1 MHz and Applied Reverse Voltage of 4.0 V D.C. Document Number: DS_D1410055 Version: J15 SS22M - SS24M Taiwan Semiconductor CREAT BY ART ORDERING INFORMATION PART NO. PART NO. PACKING CODE PACKING CODE SUFFIX SS2xM (Note 1, 2) PACKAGE PACKING Micro SMA 3,000 / 7" Plastic reel SUFFIX H RS G Note 1: "x" defines voltage from 20V (SS22M) to 40V (SS24M) Note 2: Whole series with green compound EXAMPLE PREFERRED PART NO. PART NO. PART NO. SS24MHRSG PACKING CODE SUFFIX SS24M H PACKING CODE DESCRIPTION SUFFIX RS AEC-Q101 qualified Green compound G RATINGS AND CHARACTERISTICS CURVES FIG.1 MAXIMUM FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT (A) 2.4 2 1.6 1.2 0.8 0.4 0 80 90 100 110 120 130 140 PEAK FORWARD SURGE CURRENT (A) (TA=25°C unless otherwise noted) FIG. 2 MAXIMUM FORWARD SURGE CURRENT 40 8.3ms Single Half Sin Wave 30 20 10 0 1 150 10 NUMBER OF CYCLES AT 60 Hz LEAD TEMPERATURE (°C) FIG. 3 TYPICAL FORWARD CHARACTERISTICS FIG. 4 TYPICAL REVERSE CHARACTERISTICS INSTANTANEOUS REVERSE CURRENT (mA) INSANTANEOUS FORWARD CURRENT (A) 10 TJ=150°C TJ=125°C 1 TJ=25°C 0.1 0 0.2 0.4 0.6 0.8 FORWARD VOLTAGE (V) Document Number: DS_D1410055 100 1 1.2 100 TJ=150°C 10 1 TJ=125°C 0.1 0.01 TJ=25°C 0.001 SS22M SS23M-SS24M 0.0001 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Version: J15 SS22M - SS24M Taiwan Semiconductor CREAT BY ART FIG. 5 TYPICAL JUNCTION CAPACITANCE FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE 1000 TRANSIENT THERMA IMPEDANCE(℃/W) CAPACITANCE (pF) 1000 100 10 100 10 1 1 0.1 1 10 100 0.01 0.1 1 10 100 T-PULSE DURATION(s) REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS Micro SMA Unit (mm) DIM. Unit (inch) Min Max Min Max A 2.30 2.70 0.091 0.106 B 2.10 2.30 0.083 0.091 C 0.63 0.73 0.025 0.029 D 0.10 0.20 0.004 0.008 E 1.15 1.35 0.045 0.053 F 0.65 0.85 0.026 0.034 G 1.15 1.35 0.045 0.053 H 0.75 0.95 0.030 0.037 I 1.10 1.50 0.043 0.059 J 0.55 0.75 0.022 0.030 K 0.55 0.75 0.022 0.030 L 0.65 0.85 0.026 0.034 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.1 0.043 B 2.0 0.079 C 0.5 0.020 D 0.8 0.031 E 1.0 0.039 MARKING DIAGRAM P/N = Marking code YW = Date Code Document Number: DS_D1410055 Version: J15 SS22M - SS24M Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1410055 Version: J15