TSF10U60C Taiwan Semiconductor Trench Schottky Rectifier FEATURES - Patented Trench Schottky technology - Excellent high temperature stability - Low forward voltage - Lower power loss/ high efficiency - High forward surge capability - Compliant to RoHS directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition ITO-220AB MECHANICAL DATA Case: ITO-220AB Molding compound, UL flammability classification rating 94V-0 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: As marked Mounting torque: 0.56 Nm max. Weight: 1.7g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage per device Maximum average forward rectified current per diode Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode Voltage rate of change (rated VR) Breakdown voltage ( IR =1.0mA, Ta =25°C ) IF = 5A IF = 10A IF = 5A Maximum instantaneous reverse current per diode at rated reverse voltage TSF10U60C UNIT VRRM 60 V 10 IF(AV) IFSM 150 A dV/dt 10000 V/μs VBR TJ = 25°C VF TJ = 125°C TJ = 25°C TJ = 125°C A 5 VAC Isolation voltage from terminal to heatsink t = 1 min Maximum instantaneous forward voltage per diode (Note1) SYMBOL IR 2000 V Min. TYP. MAX. 60 - - - 0.44 0.48 - 0.54 0.62 - 0.39 0.42 - - 500 μA - - 100 mA V V Typical thermal resistance per diode RθJC 4 °C/W Operating junction temperature range TJ - 55 to +150 °C TSTG - 55 to +150 °C Storage temperature range Note 1: Pulse Test with Pulse Width=300 μs, 1% Duty Cycle Document Number: DS_D1411033 Version: E14 TSF10U60C Taiwan Semiconductor ORDERING INFORMATION PACKING CODE PART NO. PACKING CODE TSF10U60C SUFFIX C0 G PACKAGE PACKING ITO-220AB 50 / Tube EXAMPLE PREFERRED PART NO. TSF10U60C C0G PART NO. PACKING CODE TSF10U60C C0 PACKING CODE DESCRIPTION SUFFIX G Green compound RATINGS AND CHARACTERISTICS CURVES (TA=25oC unless otherwise noted) FIG. 2 TYPICAL FORWARD CHARACTERISTICS FIG.1 FORWARD CURRENT DERATING CURVE 100 INSTANTANEOUS FORWARD CURRENT (A) AVERAGE FORWARD CURRENT (A) 6 5 4 3 2 WITH HEATSINK 4in x 6in x 0.25in Al-Plate 1 0 Tj=125oC 1 Tj=100oC 0.1 Tj=25oC 0.01 0 25 50 75 100 CASE TEMPERATURE 125 150 0 0.2 (oC) 0.4 0.6 0.8 FORWARD VOLTAGE (V) FIG. 4 TYPICAL JUNCTION CAPACITANCE FIG. 3 TYPICAL REVERSE CHARACTERISTICS 10000 100 Tj=150oC 10 Tj=125oC CAPACITANCE (pF) INSTANTANEOUS REVERSE CURRENT (mA) Tj=150oC 10 Tj=100oC 1 0.1 1000 100 f=1.0MHz Vsig=50mVp-p Tj=25oC 10 0.01 10 20 30 40 50 60 70 80 90 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Document Number: DS_D1411033 100 0.1 1 10 100 REVERSE VOLTAGE (V) Version: E14 TSF10U60C Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS ITO-220AB DIM. Unit (mm) Unit (inch) Min Max Min Max A 4.30 4.70 0.169 0.185 B 2.50 3.16 0.098 0.124 C 2.30 2.96 0.091 0.117 D 0.46 0.76 0.018 0.030 E 6.30 6.90 0.248 0.272 F 9.60 10.30 0.378 0.406 G 3.00 3.40 0.118 0.134 H I 0.95 0.50 1.45 0.90 0.037 0.020 0.057 0.035 J 2.40 3.20 0.094 0.126 K 14.80 15.50 0.583 0.610 L - 4.10 - 0.161 M 12.60 13.80 0.496 0.543 N - 1.45 - 0.057 O 2.41 2.67 0.095 0.105 MARKING DIAGRAM P/N = Specific Device Code G = Green Compound YWW = Date Code F = Factory Code Document Number: DS_D1411033 Version: E14 TSF10U60C Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1411033 Version: E14