TSF30U45C Taiwan Semiconductor Trench Schottky Rectifier FEATURES - Patented Trench Schottky technology - Excellent high temperature stability - Low forward voltage - Low power loss/ high efficiency - High forward surge capability - Compliant to RoHS directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition ITO-220AB TYPICAL APPLICATIONS Trench Schottky barrier rectifier are designed for high frequency miniature switched mode power supplies such as adapters, lighting and on-board DC/DC converters. MECHANICAL DATA Case: ITO-220AB Molding compound, UL flammability classification rating 94V-0 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: As marked Mounting torque: 0.56 Nm max. Weight: 1.7g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage per device Maximum average forward rectified current per diode Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode Voltage rate of change (rated VR) Isolation voltage from terminal to heatsink t = 1 min Breakdown voltage ( IR =1.0mA ) Instantaneous forward voltage per diode ( Note1 ) Instantaneous reverse current per diode at rated reverse voltage SYMBOL TSF30U45C UNIT VRRM 45 V TJ = 25°C IF = 15A TJ = 125°C TJ = 25°C TJ = 125°C A 15 IFSM 250 A dV/dt 10000 V/μs VAC 1500 V VBR IF = 15A 30 IF(AV) VF IR Min. TYP. MAX. 45 - - - 0.450 0.50 - 0.415 0.45 - 150 500 μA - 50 100 mA V V Typical thermal resistance per diode RθJC 4 °C/W Operating junction temperature range TJ - 55 to +150 °C TSTG - 55 to +150 °C Storage temperature range Note 1: Pulse test with pulse width = 300μs, 1% duty cycle Document Number: DS_D1412008 Version: F14 TSF30U45C Taiwan Semiconductor ORDERING INFORMATION PART NO. PACKING PACKING CODE CODE SUFFIX C0 TSF30U45C PACKAGE PACKING G ITO-220AB 50 / Tube PACKING PACKING CODE CODE C0 SUFFIX G EXAMPLE PREFERRED PART NO. PART NO. TSF30U45C C0G TSF30U45C DESCRIPTION Green compound RATINGS AND CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) FIG.1 FORWARD CURRENT DERATING CURVE FIG. 2 TYPICAL FORWARD CHARACTERISTICS 100 INSTANTANEOUS FORWARD CURRENT (A) AVERAGE FORWARD CURRENT (A) 20 15 10 5 WITH HEATSINK 3in x 5in x 0.25in Al-Plate 10 TJ=150°C TJ=125°C 1 0.1 TJ=100°C TJ=25°C 0.01 0 0 25 50 75 100 125 0 150 CASE TEMPERATURE (oC) 0.4 0.6 FORWARD VOLTAGE (V) FIG. 4 TYPICAL JUNCTION CAPACITANCE FIG. 3 TYPICAL REVERSE CHARACTERISTICS 10000 100 TJ=150°C 10 TJ=125°C CAPACITANCE (pF) INSTANTANEOUS REVERSE CURRENT (mA) 0.2 TJ=100°C 1 0.1 1000 TJ=25°C 0.01 f=1.0MHz Vslg=50mVp-p 0.001 10 20 30 40 50 60 70 80 90 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Document Number: DS_D1412008 100 100 0.1 1 10 100 REVERSE VOLTAGE (V) Version: F14 TSF30U45C Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS ITO-220AB DIM. Unit (mm) Min Max Unit (inch) Min Max A 4.30 4.70 0.169 0.185 B 2.50 3.16 0.098 0.124 C 2.30 2.96 0.091 0.117 D 0.46 0.76 0.018 0.030 E 6.30 6.90 0.248 0.272 F 9.60 10.30 0.378 0.406 G 3.00 3.40 0.118 0.134 H I 0.95 0.50 1.45 0.90 0.037 0.020 0.057 0.035 J 2.40 3.20 0.094 0.126 K 14.80 15.50 0.583 0.610 L - 4.10 - 0.161 M 12.60 13.80 0.496 0.543 N - 1.45 - 0.057 O 2.41 2.67 0.095 0.105 MARKING DIAGRAM P/N = Specific Device Code G = Green Compound YWW = Date Code F = Factory Code Document Number: DS_D1412008 Version: F14 TSF30U45C Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1412008 Version: F14