TSP10U100S - TSP10U120S Taiwan Semiconductor 10A, 100V - 120V Trench Schottky Rectifiers FEATURES - Patented Trench Schottky technology - Excellent high temperature stability - Low forward voltage - Low power loss/ high efficiency - High forward surge capability - Ideal for automated placement - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC TO-277A (SMPC) - Halogen-free according to IEC 61249-2-21 definition TYPICAL APPLICATIONS Trench Schottky barrier rectifier is designed for high frequency miniature switched mode power supplies such as adapters, lighting and on-board DC/DC converters. MECHANICAL DATA Case: TO-277A (SMPC) Molding compound meets UL 94 V-0 flammability rating Moisture sensitivity level: level 1, per J-STD-020 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.095g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL TSP10U100S TSP10U120S 10U100 10U120 100 120 Marking code UNIT Maximum repetitive peak reverse voltage VRRM Maximum average forward rectified current IF(AV) 10 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode IFSM 140 A IF = 5A Maximum instantaneous forward voltage per diode (Note 1) IF = 10A IF = 5A IF = 10A Maximum instantaneous reverse current per diode at rated reverse voltage Typical thermal resistance Operating temperature range Storage temperature range TJ = 25°C VF TJ = 125°C TJ = 25°C TJ = 125°C IR V TYP MAX TYP MAX 0.51 - 0.56 - 0.60 0.68 0.68 0.78 0.42 - 0.49 - 0.52 0.60 0.57 0.67 10 150 10 150 µA 6 30 6 30 mA V RθJL 11 °C/W TJ - 55 to +150 °C TSTG - 55 to +150 °C Note 1: Pulse Test with Pulse Width=300μs, 1% Duty Cycle Document Number: DS_D1411030 Version: E15 TSP10U100S - TSP10U120S Taiwan Semiconductor ORDERING INFORMATION PART NO. PACKING CODE TSP10U1xxS (Note 1,2) S1 PACKING CODE SUFFIX PACKAGE PACKING SMPC 1,500/ 7" Plastic reel SMPC 6,000/ 13" Plastic reel G S2 Note 1: "xx" defines voltage from 100V (TSP10U100S) to 120V (TSP10U120S) Note 2: Whole series with green compound EXAMPLE PREFERRED PART NO. TSP10U100S S1G PART NO. PACKING CODE TSP10U100S S1 PACKING CODE DESCRIPTION SUFFIX G Green compound RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG.1 FORWARD CURRENT DERATING CURVE FIG. 2 TYPICAL FORWARD CHARACTERISTICS 100 12 INSTANTANEOUS FORWARD CURRENT (A) TSP10U100S AVERAGE FORWARD CURRENT (A) 10 8 6 4 2 WITH HEATSINK 0 0 25 50 75 100 LEAD TEMPERATURE 125 TJ=150oC 10 TJ=125oC 1 TJ=100oC TJ=25oC 0.1 150 0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 FORWARD VOLTAGE (V) FIG. 4 TYPICAL REVERSE CHARACTERISTICS FIG. 3 TYPICAL FORWARD CHARACTERISTICS 100 100 10 INSTANTANEOUS REVERSE CURRENT (mA) TSP10U120S INSTANTANEOUS FORWARD CURRENT (A) 0.1 (oC) TJ=150oC TJ=125oC 1 TJ=100oC TJ=25oC TSP10U100S TJ=150oC 10 TJ=125oC 1 TJ=100oC 0.1 0.01 TJ=25oC 0.001 0.0001 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 FORWARD VOLTAGE (V) Document Number: DS_D1411030 0.8 0.9 1 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Version: E15 TSP10U100S - TSP10U120S Taiwan Semiconductor FIG. 6 TYPICAL JUNCTION CAPACITANCE FIG. 5 TYPICAL REVERSE CHARACTERISTICS 10000 100 f=1.0MHz Vsig=50mVp-p 10 TJ=150oC JUNCTION CAPACITANCE (pF) A INSTANTANEOUS REVERSE CURRENT (mA) TSP10U120S TJ=125oC 1 TJ=100oC 0.1 0.01 0.001 TJ=25oC 0.0001 1000 100 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 0.1 1 10 100 REVERSE VOLTAGE (V) PEAK FORWARD SURGE CURRENT (A) FIG. 7 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 200 8.3ms Single HalfHalf Sine-Wave 8.3ms Single Sine-Wave 160 120 80 40 0 1 10 100 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D1411030 Version: E15 TSP10U100S - TSP10U120S Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS TO-277A (SMPC) DIM. A Unit (mm) Unit (inch) Min Max Min Max 5.650 5.750 0.222 0.226 B 6.350 6.650 0.250 0.262 C 4.550 4.650 0.179 0.183 D 3.540 3.840 0.139 0.151 E 4.235 4.535 0.167 0.179 F 1.850 2.150 0.073 0.085 G 3.170 3.470 0.125 0.137 H 1.043 1.343 0.041 0.053 I 1.000 1.300 0.039 0.051 J 1.930 2.230 0.076 0.088 K 0.175 0.325 0.007 0.013 L 1.000 1.200 0.039 0.047 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 4.80 0.189 B 4.72 0.186 C 1.40 0.055 D 1.27 0.050 E 6.80 0.268 F 1.04 0.041 MARKING DIAGRAM P/N = Marking Code YW = Date Code F = Factory Code Document Number: DS_D1411030 Version: E15 TSP10U100S - TSP10U120S Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1411030 Version: D14