BAW56 SERIES_H14.pdf

BAW56, BAV70, BAV99
Taiwan Semiconductor
Small Signal Product
225mW SMD Switching Diode
FEATURES
- Fast switching speed
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin(Sn) lead finish with Nickel(Ni) underplate
- Pb free and RoHS compliant
- Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
MECHANICAL DATA
SOT-23
- Case: SOT-23 small outline plastic package
- Terminal: Matte tin plated, lead free,
solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260oC/10s
- Weight: 0.008grams (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (TA=25℃ unless otherwise noted)
PARAMETER
SYMBOL
VALUE
UNIT
PD
225
mW
Peak repetitive reverse voltage
VRRM
70
V
Repetitive peak forward current
IFRM
450
mA
IO
200
mA
Power dissipation
Mean forward current
Pulse Width=1 sec
Non-repetitive peak forward
surge current
Pulse Width=1 µsec
Thermal resistance form junction to ambient
Junction and storage temperature range
PARAMETER
IR = 100 µA
Reverse breakdown voltage
IF = 50 mA
Forward voltage
IF = 150 mA
VR = 70 V
Reverse leakage current
VR = 0 V,
f = 1 MHz
Junction capacitance
Reverse revovery time
BAW56, BAV70
BAV99
IF = IR = 10 mA, RL = 100 Ω, IRR = 1 mA
Document Number: DS_S1404011
0.5
IFSM
A
2
RθJA
556
TJ , TSTG
- 55 to + 150
o
C/W
o
C
SYMBOL
MIN
MAX
UNIT
V(BR)
70
-
V
-
1.00
-
1.25
-
2.50
µA
-
2
pF
-
1.5
pF
-
6
ns
VF
IR
CJ
trr
V
Version: H14
BAW56, BAV70, BAV99
Taiwan Semiconductor
Small Signal Product
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
Fig. 2 Leakage Current VS. Junction Temperature
Fig. 1 Typucal Forward Characteristics
10000
100
REVERSE CURRENT (nA)
Instantaneous Forward Current (mA)
1000
10
1
0.1
0.01
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
VR=20V
Typical
1000
100
10
1
0
20
40
60
80
100
120
140
160
180
200
Junction Temperature (oC)
Instantaneous Forward Voltage(V)
Fig. 3 Power Dissipation Derating Curve
Power Dissipation (mW)
250
200
150
100
50
0
0
25
50
75
100
125
150
Ambient Temperature (oC)
Document Number: DS_S1404011
Version: H14
BAW56, BAV70, BAV99
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
GREEN
PART NO.
MANUFACTURE
PACKING
CODE
CODE
COMPOUND
PACKAGE
PACKING
MARKING
CODE
BAW56
RF
SOT-23
3K / 7" Reel
A1
BAV70
RF
SOT-23
3K / 7" Reel
A4
RF
SOT-23
3K / 7" Reel
A7
BAV99
(Note)
BAW56
RF
G
SOT-23
3K / 7" Reel
A1
BAV70
RF
G
SOT-23
3K / 7" Reel
A4
BAV99
RF
G
SOT-23
3K / 7" Reel
A7
Note: Manufacture special control, if empty means no special control requirement.
EXAMPLE
GREEN
MANUFACTURE
PREFERRED P/N
PACKING CODE
PART NO.
COMPOUND
DESCRIPTION
CODE
CODE
BAV99 RF
BAV99
RF
BAV99-B0 RF
BAV99
B0
RF
BAV99-D0 RF
BAV99
D0
RF
BAV99 RFG
BAV99
BAV99-B0 RFG
BAV99
BAV99-D0 RFG
BAV99
Document Number: DS_S1404011
RF
G
Green compound
B0
RF
G
Green compound
D0
RF
G
Green compound
Version: H14
BAW56, BAV70, BAV99
Taiwan Semiconductor
Small Signal Product
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Unit (inch)
DIM.
Min
Max
Min
Max
A
2.70
3.10
0.106
0.122
B
1.10
1.50
0.043
0.059
C
0.30
0.51
0.012
0.020
D
1.78
2.04
0.070
0.080
E
2.10
2.64
0.083
0.104
F
0.89
1.30
0.035
0.051
G
0.55 REF
0.022 REF
H
0.1 REF
0.004 REF
Unit (mm)
Unit (inch)
Z
Typ.
2.9
Typ.
0.114
X
0.8
0.031
Y
0.9
0.035
C
2.0
0.079
E
1.35
0.053
SUGGEST PAD LAYOUT
DIM.
Pin Configuration
Document Number: DS_S1404011
Version: H14
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