BAS16_D14.pdf

BAS16
Taiwan Semiconductor
Small Signal Product
225mW SMD Switching Diode
FEATURES
- Low power loss, high current capability, low VF
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish with Nickel (Ni) underplate
- Pb free version and RoHS compliant
- Packing code with suffix "G" means
green compound (halogen-free)
SOT-23
MECHANICAL DATA
- Case: Bend lead SOT-23 small outline plastic package
- Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed : 260°C/10s
- Weight: 8 ± 0.5 mg
- Marking Code: A6
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
Power dissipation
Repetitive peak reverse voltage
Mean forward current
Non-repetitive peak forward surge current @ t = 0.001 s
Thermal resistance (Junction to Ambient)
(Note 1)
Junction and storage temperature range
PARAMETER
Reverse breakdown voltage
IR = 100 μA
SYMBOL
VALUE
UNIT
PD
225
mW
VRRM
75
V
IO
150
mA
IFSM
2
RθJA
375
TJ , TSTG
-65 to +150
IF = 10 mA
IF = 50 mA
Junction capacitance
Reverse recovery time
o
C
MIN
MAX
UNIT
V(BR)
75
-
V
0.715
VF
-
IF = 150 mA
Reverse leakage current
C/W
SYMBOL
IF = 1.0 mA
Forward voltage
A
o
0.855
1.000
V
1.250
VR = 75 V
IR
-
1
μA
VR = 0 V , f = 1.0 MHz
CJ
-
2.0
pF
(Note 2)
trr
-
3.0
ns
Note 1: Valid provided that electrodes are kept at ambient temperature
Note 2: Reverse recovery test conditions: IF=10mA , IR=10mA , RL=100 Ω, IRR= 1mA
Document Number: DS_S1312001
Version: D14
BAS16
Taiwan Semiconductor
Small Signal Product
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
Fig. 2 Reverse Current VS. Reverse Voltage
Fig. 1 Typical Forward Characteristics
1000
10
Reverse Current (μA)
Instantaneous Forward Current (mA)
100
1
0.1
100
10
0.01
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1
1.6
0
Instantaneous Forward Voltage (V)
40
60
80
Reverse Voltage (V)
100
120
Fig. 4 Typical Junction Capacitance
Fig. 3 Admissible
Power
Fig.
3 Dissipation Curve
1.4
300
1.3
Junction Capacitance (pF)
250
Power Dissipation (mW)
20
200
150
100
50
1.2
1.1
1.0
0.9
0.8
0
0
25
50
75
100
125
Ambient Temperature (oC)
Document Number: DS_S1312001
150
175
0
8
16
24
32
40
Reverse Voltage (V)
Version: D14
BAS16
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
PART NO.
PACKING
PACKING CODE
SUFFIX (Note 1)
CODE
SUFFIX
PART NO.
BAS16
-xx
RF
G
R5
PACKAGE
PACKING
3K / 7" Reel
SOT-23
10K / 13" Reel
Note 1: Part No. Suffix „-xx “ would be used for special requirement
EXAMPLE
PREFERRED P/N PART NO.
PART NO.
SUFFIX
BAS16 RF
BAS16
RF
BAS16 RFG
BAS16
RF
BAS16-B0 RFG
BAS16
-B0
PACKING CODE
PACKING CODE
SUFFIX
DESCRIPTION
Multiple manufacture
source
RF
G
Multiple manufacture
source
Green compound
G
Defined manufacture
source
Green compound
PACKAGE OUTLINE DIMENSIONS
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
2.70
3.10
0.106
0.122
B
1.10
1.50
0.043
0.059
C
0.30
0.51
0.012
0.020
D
1.78
2.04
0.070
0.080
E
2.10
2.64
0.083
0.104
F
0.89
1.30
0.035
0.051
G
0.55 REF
0.022 REF
H
0.10 REF
0.004 REF
Unit (mm)
Unit (inch)
Typ.
Typ.
Z
2.8
0.110
X
0.7
0.028
Y
0.9
0.035
C
1.9
0.075
E
1.0
0.039
SUGGEST PAD LAYOUT
DIM.
Document Number: DS_S1312001
Version: D14
BAS16
Taiwan Semiconductor
Small Signal Product
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_S1312001
Version: D14
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