BAV99S Taiwan Semiconductor Small Signal Product 250mW High Speed Switching Array FEATURES - Fast switching speed - High reverse breakdown voltage rating - Moisture sensitivity level 1 - Matte Tin (Sn) lead finish with Nickel (Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (halogen-free) SOT-363 MECHANICAL DATA - Case: SOT-363 small outline plastic package - Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Case material UL flammability rating 94V-0 - Weight: 8 ± 0.5 mg - Marking Code: K1 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL VALUE UNIT PD 200 mW Repetitive Peak Reverse Voltage VRRM 85 V Repetitive Peak Forward Current IFRM 450 mA IO 150 mA Power Dissipation Mean Forward Current Non-Repetitive Peak Forward Surge Current Pulse width = 1 μs Pulse width = 1 s IFSM PARAMETER IR=2.5μA Reverse Leakage Current Junction Capacitance Reverse Recovery Time C MIN MAX UNIT V(BR) 75 - V - 0.715 - 0.855 IF=10mA Forward Voltage o -55 to 150 SYMBOL IF=1.0mA IF=50mA A 0.5 TJ , TSTG Junction and Storage Temperature Range Reverse Breakdown Voltage 4.5 VF - 1.000 IF=100mA - 1.200 IF=150mA - 1.250 V @VR=75V IR - 1.000 μA VR=0, f=1.0MHz CJ - 1.500 pF (Note 1) trr - 6.000 ns Note 1 : Reverse recovery test conditions : IF=IR=10mA, RL=100Ω Document Number: DS_S1501006 Version: G15 BAV99S Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Fig. 1 Maximum Permissible Continuous Forward Current As A Function of Soldering Point Temperature Fig. 2 Forward Current As A Function of Forward Voltage 300 250 (1) (2) (3) 200 150 IF (mA) IFmax (mA) 200 100 100 50 0 0 0 50 100 0 150 TS (oC) 1 (1) Tj=150oC; typical values. (2) Tj=25oC ; typical values. (3) Tj=25oC; maximum 2 VF (V) Fig. 3 Maximum Permissible Non-Repetitive Peak Forward Current As A Function of Pulse Duration IFSM (A) 10 1 0.1 1 10 Based on square wave currents Tj=25oC prior to surge Document Number: DS_S1501006 100 1000 10000 tp (μs) Version: G15 BAV99S Taiwan Semiconductor Small Signal Product ORDER INFORMATION (EXAMPLE) BAV99S RFG Green compound code Packing code Part no. DIMENSIONS SOT-363 A H F DIM. B E G C D Unit (mm) Unit (inch) Min Max Min Max A 2.00 2.20 0.079 0.087 B 1.15 1.35 0.045 0.053 C 0.15 0.35 0.006 0.014 D 1.20 1.40 0.047 0.055 E 2.15 2.45 0.085 0.096 F 0.85 1.05 0.033 0.041 G 0.25 0.46 0.010 0.018 H 0.00 0.10 0.000 0.004 SUGGESTED PAD LAYOUT Unit (mm) Unit (inch) Typ. Typ. Z 3.20 0.126 G 1.60 0.063 X 0.55 0.022 Y 0.80 0.031 C1 2.40 0.094 C2 0.95 0.037 DIM. Document Number: DS_S1501006 Version: G15 BAV99S Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1501006 Version: G15