1SS355 Taiwan Semiconductor Small Signal Product 200mW High Speed SMD Switching Diode FEATURES - Fast switching device (trr<4.0ns) - Surface Mount Device Type - Moisture sensitivity level 1 - Matte Tin (Sn) lead finish with Nickel (Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (halogen-free) SOD-323F MECHANICAL DATA - Case: Flat lead SOD-323F small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260°C/10s - Polarity: Indicated by cathode band - Weight: 6 ± 0.5mg - Marking code: S4 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER Power Dissipation SYMBOL VALUE UNIT PD 200 mW VRRM 90 V Reverse Voltage VR 80 V Minimum Breakdown Voltage at IR = 100μA VBR 80 V IF 250 mA Repetitive Peak Reverse Voltage Forward Current Continue Forward Current IO 150 mA IFSM 500 mA Maximum Reverse Leakage Current at VR = 80V IR 100 nA Maximum Forward Voltage at IF = 100mA VF 1.2 V Maximum Reverse Recovery Time at IF = 10mA, VR = 6V, RL = 100 Ohms trr 4 ns Maximum Junction Capacitance at VR = 0.5V, f = 1MHz Cj 4 pF OperatingTemperature Range TOPR - 65 to +150 o C Storage Temperature Range TSTG - 65 to +150 o C Repetitive Peak Forward Voltage Note : These ratings are limiting values above which the serviceability of the diode may be impaired Version: C1603 1SS355 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PART NO. SUFFIX -xx (Note 1) 1SS355 PACKING CODE PACKING CODE SUFFIX RR R9 G PACKAGE PACKING SOD-323F 3K / 7" Reel 10K / 13" Reel Note 1: Part No. Suffix „-xx “ would be used for special requirement EXAMPLE PREFERRED P/N PART NO. 1SS355 RRG 1SS355 1SS355-L0 RRG 1SS355 1SS355-B0 RRG 1SS355 PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX DESCRIPTION RR G Multiple manufacture source Green compound -L0 RR G Defined manufacture source Green compound -B0 RR G Defined manufacture source Green compound PACKAGE OUTLINE DIMENSIONS SOD-323F DIM. Unit (mm) Unit (inch) Min Max Min Max A 1.15 1.35 0.045 0.053 B 2.30 2.80 0.091 0.110 C 0.25 0.40 0.010 0.016 D 1.60 1.80 0.063 0.071 E 0.80 1.10 0.031 0.043 F 0.05 0.25 0.002 0.010 SUGGEST PAD LAYOUT Unit (mm) Unit (inch) Typ. Typ. A 0.630 0.025 B 0.830 0.033 C 1.600 0.063 D 2.860 0.113 DIM. Version: C1603 1SS355 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Version: C1603