1SS355_C1603.pdf

1SS355
Taiwan Semiconductor
Small Signal Product
200mW High Speed SMD Switching Diode
FEATURES
- Fast switching device (trr<4.0ns)
- Surface Mount Device Type
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish with Nickel (Ni) underplate
- Pb free version and RoHS compliant
- Packing code with suffix "G" means
green compound (halogen-free)
SOD-323F
MECHANICAL DATA
- Case: Flat lead SOD-323F small outline plastic package
- Terminal: Matte tin plated, lead free,
solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260°C/10s
- Polarity: Indicated by cathode band
- Weight: 6 ± 0.5mg
- Marking code: S4
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
Power Dissipation
SYMBOL
VALUE
UNIT
PD
200
mW
VRRM
90
V
Reverse Voltage
VR
80
V
Minimum Breakdown Voltage at IR = 100μA
VBR
80
V
IF
250
mA
Repetitive Peak Reverse Voltage
Forward Current
Continue Forward Current
IO
150
mA
IFSM
500
mA
Maximum Reverse Leakage Current at VR = 80V
IR
100
nA
Maximum Forward Voltage at IF = 100mA
VF
1.2
V
Maximum Reverse Recovery Time
at IF = 10mA, VR = 6V, RL = 100 Ohms
trr
4
ns
Maximum Junction Capacitance at VR = 0.5V, f = 1MHz
Cj
4
pF
OperatingTemperature Range
TOPR
- 65 to +150
o
C
Storage Temperature Range
TSTG
- 65 to +150
o
C
Repetitive Peak Forward Voltage
Note : These ratings are limiting values above which the serviceability of the diode may be impaired
Version: C1603
1SS355
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
-xx
(Note 1)
1SS355
PACKING CODE
PACKING CODE
SUFFIX
RR
R9
G
PACKAGE
PACKING
SOD-323F
3K / 7" Reel
10K / 13" Reel
Note 1: Part No. Suffix „-xx “ would be used for special requirement
EXAMPLE
PREFERRED P/N
PART NO.
1SS355 RRG
1SS355
1SS355-L0 RRG
1SS355
1SS355-B0 RRG
1SS355
PART NO.
SUFFIX
PACKING CODE
PACKING CODE
SUFFIX
DESCRIPTION
RR
G
Multiple manufacture
source
Green compound
-L0
RR
G
Defined manufacture
source
Green compound
-B0
RR
G
Defined manufacture
source
Green compound
PACKAGE OUTLINE DIMENSIONS
SOD-323F
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
1.15
1.35
0.045
0.053
B
2.30
2.80
0.091
0.110
C
0.25
0.40
0.010
0.016
D
1.60
1.80
0.063
0.071
E
0.80
1.10
0.031
0.043
F
0.05
0.25
0.002
0.010
SUGGEST PAD LAYOUT
Unit (mm)
Unit (inch)
Typ.
Typ.
A
0.630
0.025
B
0.830
0.033
C
1.600
0.063
D
2.860
0.113
DIM.
Version: C1603
1SS355
Taiwan Semiconductor
Small Signal Product
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Version: C1603
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