BAS316 Taiwan Semiconductor Small Signal Product 200mW High Voltage SMD Switching Diode FEATURES - Fast switching device (trr<4.0ns) - Surface mount device type - Moisture sensitivity level 1 - Matte Tin (Sn) lead finish - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (halogen-free) SOD-323 MECHANICAL DATA - Case: Bend lead SOD-323 small outline plastic package - Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Polarity: Indicated by cathode band - Weight: 4.85 ± 0.5 mg - Marking Code: A6 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE UNITS Power dissipation PD 200 mW Mean forward current IO 250 mA Non-repetitive peak forward current Pulse Width = 1 μsec Pulse Width = 1 msec PARAMETER IR = 100 μA IF = 10 mA IF = 50 mA Junction Capacitance Reverse Recovery Time Document Number: DS_S1311003 VR = 75 V VR = 25 V C MIN MAX UNITS V(BR) 100 - V - 0.715 - 0.855 - 1.000 - 1.250 - 1.00 - 0.03 VF IF = 150 mA Reverse Leakage Voltage o -65 to + 150 SYMBOL IF = 1.0 mA Forward Voltage A 1.0 TJ , TSTG Junction and storage temperature range Reverse Breakdown Voltage 4.0 IFRM IR V μA VR = 0 , f = 1.0 MHz CJ - 1.5 pF IF = IR = 10 mA , RL = 100 Ω trr - 4 ns Version: C14 BAS316 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Fig. 2 Reverse Current VS. Reverse Voltage 10 100 1 10 Reverse Current (uA) Instantaneous Forward Current (mA) Fig. 1 Typical Forward Characteristics 0.1 0.01 1 0.1 0.01 0.001 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1.6 20 40 1.5 200 1.2 Junction Capacitance (pF) Power Dissipation (mW) 250 150 100 50 0 50 75 100 125 Ambient Temperature (°C) Document Number: DS_S1311003 100 120 Fig. 4 Typical Junction Capacitance Fig. 3 Admissible Power Dissipation Curve 25 80 Reverse Voltage (V) Instantaneous Forward Voltage (V) 0 60 150 175 0.9 0.6 0.3 0 0 2 4 6 8 10 12 14 16 Reverse Voltage (V) Version: C14 BAS316 Taiwan Semiconductor Small Signal Product ORDER INFORMATION (EXAMPLE) BAS316 RRG Green compound code Packing code Part no. DIMENSIONS B DIM. C A D E H Unit (mm) Unit (inch) Min Max Min Max A 1.150 1.400 0.045 0.055 B 2.300 2.700 0.091 0.106 C 0.250 0.450 0.010 0.018 D 1.600 1.800 0.063 0.071 E 0.800 1.000 0.031 0.039 F 0.050 0.177 0.002 0.007 G 0.475 REF 0.019 REF H - - 0.100 0.004 F G SUGGESTED PAD LAYOUT Unit (mm) Unit (inch) Min Min G 1.52 0.060 X 0.59 0.023 X1 2.70 0.106 Y 0.45 0.018 DIM. Document Number: DS_S1311003 Version: C14 BAS316 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1311003 Version: C14