BAS316_C14.pdf

BAS316
Taiwan Semiconductor
Small Signal Product
200mW High Voltage SMD Switching Diode
FEATURES
- Fast switching device (trr<4.0ns)
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish
- Pb free version and RoHS compliant
- Packing code with suffix "G" means
green compound (halogen-free)
SOD-323
MECHANICAL DATA
- Case: Bend lead SOD-323 small outline plastic package
- Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed : 260°C/10s
- Polarity: Indicated by cathode band
- Weight: 4.85 ± 0.5 mg
- Marking Code: A6
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
SYMBOL
VALUE
UNITS
Power dissipation
PD
200
mW
Mean forward current
IO
250
mA
Non-repetitive peak forward current
Pulse Width = 1 μsec
Pulse Width = 1 msec
PARAMETER
IR = 100 μA
IF = 10 mA
IF = 50 mA
Junction Capacitance
Reverse Recovery Time
Document Number: DS_S1311003
VR = 75 V
VR = 25 V
C
MIN
MAX
UNITS
V(BR)
100
-
V
-
0.715
-
0.855
-
1.000
-
1.250
-
1.00
-
0.03
VF
IF = 150 mA
Reverse Leakage Voltage
o
-65 to + 150
SYMBOL
IF = 1.0 mA
Forward Voltage
A
1.0
TJ , TSTG
Junction and storage temperature range
Reverse Breakdown Voltage
4.0
IFRM
IR
V
μA
VR = 0 , f = 1.0 MHz
CJ
-
1.5
pF
IF = IR = 10 mA , RL = 100 Ω
trr
-
4
ns
Version: C14
BAS316
Taiwan Semiconductor
Small Signal Product
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
Fig. 2 Reverse Current VS. Reverse Voltage
10
100
1
10
Reverse Current (uA)
Instantaneous Forward Current (mA)
Fig. 1 Typical Forward Characteristics
0.1
0.01
1
0.1
0.01
0.001
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
1.6
20
40
1.5
200
1.2
Junction Capacitance (pF)
Power Dissipation (mW)
250
150
100
50
0
50
75
100
125
Ambient Temperature (°C)
Document Number: DS_S1311003
100
120
Fig. 4 Typical Junction Capacitance
Fig. 3 Admissible Power Dissipation Curve
25
80
Reverse Voltage (V)
Instantaneous Forward Voltage (V)
0
60
150
175
0.9
0.6
0.3
0
0
2
4
6
8
10
12
14
16
Reverse Voltage (V)
Version: C14
BAS316
Taiwan Semiconductor
Small Signal Product
ORDER INFORMATION (EXAMPLE)
BAS316 RRG
Green compound code
Packing code
Part no.
DIMENSIONS
B
DIM.
C
A
D
E
H
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
1.150
1.400
0.045
0.055
B
2.300
2.700
0.091
0.106
C
0.250
0.450
0.010
0.018
D
1.600
1.800
0.063
0.071
E
0.800
1.000
0.031
0.039
F
0.050
0.177
0.002
0.007
G
0.475 REF
0.019 REF
H
-
-
0.100
0.004
F
G
SUGGESTED PAD LAYOUT
Unit (mm)
Unit (inch)
Min
Min
G
1.52
0.060
X
0.59
0.023
X1
2.70
0.106
Y
0.45
0.018
DIM.
Document Number: DS_S1311003
Version: C14
BAS316
Taiwan Semiconductor
Small Signal Product
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_S1311003
Version: C14
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