RSFAL - RSFML Taiwan Semiconductor CREAT BY ART 0.5A, 50V - 1000V Surface Mount Fast Recovery Rectifiers FEATURES - Glass passivated junction chip - Ideal for automated placement - High temperature metallurgically bonded construction - Fast switching for high efficiency - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition Sub SMA MECHANICAL DATA Case: Sub SMA Molding compound, UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Part No. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL Marking code RSF RSF RSF RSF RSF RSF RSF AL BL DL GL JL KL ML UNIT FAL FBL FDL FGL FJL FKL FML Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current IF(AV) 0.5 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 10 A VF 1.3 V Maximum instantaneous forward voltage (Note 1) @ 0.5 A Maximum reverse current @ rated VR TJ=25°C TJ=125°C Typical junction capacitance (Note 2) CJ Maximum reverse recovery time (Note 3) trr Typical thermal resistance Operating junction temperature range Storage temperature range 5 IR μA 50 4 150 pF 250 500 ns RθJC RθJA 32 150 °C/W TJ - 55 to +150 °C TSTG - 55 to +150 °C Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Measured at 1 MHz and Applied VR=4.0 Volts. Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Document Number: DS_D1410008 Version: L15 RSFAL - RSFML Taiwan Semiconductor ORDERING INFORMATION PART NO. PART NO. PACKING CODE PACKING CODE PACKAGE PACKING Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA 1,800 / 7" Plastic reel (8mm tape) 3,000 / 7" Plastic reel (8mm tape) 7,500 / 13" Paper reel (8mm tape) 7,500 / 13" Plastic reel (8mm tape) 10,000 / 13" Paper reel (8mm tape) 10,000 / 13" Plastic reel (8mm tape) 1,800 / 7" Plastic reel (12mm tape) 3,000 / 7" Plastic reel (12mm tape) 7,500 / 13" Paper reel (12mm tape) 7,500 / 13" Plastic reel (12mm tape) RH Sub SMA 10,000 / 13" Paper reel (12mm tape) MH Sub SMA 10,000 / 13" Plastic reel (12mm tape) SUFFIX RSFxL (Note 1) SUFFIX RU RV RT MT RQ MQ R3 RF R2 M2 H G Note 1: "x" defines voltage from 50V (RSFAL) to 1000V (RSFML) EXAMPLE PREFERRED PART NO. PART NO. PART NO. RSFMLHRUG SUFFIX RSFML PACKING CODE PACKING CODE H DESCRIPTION SUFFIX RU AEC-Q101 qualified Green compound G RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG. 2 TYPICAL REVERSE CHARACTERISTICS 0.6 RESISTIVE OR INDUCTIVE LOAD 0.5 0.4 0.3 0.2 0.1 0 0 25 50 75 100 125 150 175 INSTANTANEOUS REVERSE CURRENT (μA) AVERAGE FORWARD CURRENT (A) FIG.1 FORWARD CURRENT DERATING CURVE 10 1 TJ=100°C 0.1 TJ=25°C 0.01 0.001 0 FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 10 8.3ms Single Half Sine Wave 8 6 4 2 0 1 10 NUMBER OF CYCLES AT 60 Hz 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 5 TYPICAL FORWARD CHARACTERISTICS 100 INSTANTANEOUS FORWARD CURRENT (A) PEAK FORWARD SURGE CURRENT (A) LEAD TEMPERATURE (oC) 10 Pulse Width=300μs 1% Duty Cycle 1 0.1 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 FORWARD VOLTAGE (V) Document Number: DS_D1410008 Version: L15 RSFAL - RSFML Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE 10 CAPACITANCE (pF) f=1.0MHz Vsig=50mVp-p 1 1 10 100 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS Sub SMA Unit (mm) DIM. Unit (inch) Min Max Min Max B 1.70 1.90 0.067 0.075 C 2.70 2.90 0.106 0.114 D 0.16 0.30 0.006 0.012 E 1.23 1.43 0.048 0.056 F 0.80 1.20 0.031 0.047 G 3.40 3.80 0.134 0.150 H 2.45 2.60 0.096 0.102 I 0.35 0.85 0.014 0.033 J 0.00 0.10 0.000 0.004 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.4 0.055 B 1.2 0.047 C 3.1 0.122 D 1.9 0.075 E 4.3 0.169 MARKING DIAGRAM P/N = Marking Code G = Green compound Code YW = Date Code F = Factory Code Document Number: DS_D1410008 Version: L15 RSFAL - RSFML Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1410008 Version: L15