BYG20D SERIES_E15.pdf

BYG20D - BYG20J
Taiwan Semiconductor
CREAT BY ART
1.5A, 200V - 600V High Efficient Surface Mount Rectifiers
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Fast switching for high efficiency
- High surge current capability
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21
DO-214AC (SMA)
MECHANICAL DATA
Case: DO-214AC (SMA)
Molding compound: UL flammability classification rating 94V-0
Part No. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Moisture sensitivity level: level 1, per J-STD-020
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.064 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
BYG20D
BYG20G
BYG20J
UNIT
Maximum repetitive peak reverse voltage
VRRM
200
400
600
V
Maximum RMS voltage
VRMS
140
280
420
V
Maximum DC blocking voltage
VDC
200
400
600
V
Maximum average forward rectified current
IF(AV)
1.5
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
30
A
Maximum instantaneous forward voltage
(Note 1)
Maximum reverse current @ rated VR
IF=1.0A
IF=1.5A
TJ=25°C
TJ=100°C
Pulse energy in avalanche mode, non repetitive
(Inductive load switch off ), L=120mH
Maximum reverse recovery time (Note 2)
Typical thermal resistance (Note 3)
Operating junction temperature range
Storage temperature range
VF
IR
1.3
1.4
1
10
V
μA
ERSM
20
mJ
trr
75
ns
RθJL
25
RθJA
100
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
°C/W
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse recovery test conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 3: Mount on PC board with 5mm x 5mm copper pads as heatsink.
Document Number: DS_D0000075
Version: E15
BYG20D - BYG20J
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PART NO.
PACKING
PACKING CODE
SUFFIX
CODE
SUFFIX
BYG20x
(Note 1)
PACKAGE
PACKING
R3
SMA
1,800 / 7" Plastic reel
R2
SMA
7,500 / 13" Paper reel
SMA
7,500 / 13" Plastic reel
Folded SMA
1,800 / 7" Plastic reel
F2
Folded SMA
7,500 / 13" Paper reel
F4
Folded SMA
7,500 / 13" Plastic reel
M2
H
G
F3
Note 1: "x" defines voltage from 200V (BYG20D) to 600V (BYG20J)
EXAMPLE
EXAMPLE
PART NO.
PART NO.
BYG20DHR3G
PART NO.
PACKING
PACKING CODE
SUFFIX
CODE
SUFFIX
H
R3
G
BYG20D
DESCRIPTION
AEC-Q101 qualified
Green compound
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
FIG.1 FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT (A)
1.5
1
Resistive or
inductive load
0.5
0
0
20
40
60
80
100
120
140
160
INSTANTANEOUS REVERSE CURRENT (μA)
100
2
10
1
TJ=125°C
0.1
0.01
TJ=25°C
0.001
0
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
LEAD TEMPERATURE (°C)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
10
INSTANTANEOUS FORWARD CURRENT (A)
70
PEAK FORWARD SURGE URRENT (A)
20
60
8.3ms single half sine wave
50
40
30
20
10
0
1
10
NUMBER OF CYCLES AT 60 Hz
Document Number: DS_D0000075
100
1
0.1
0.4
0.6
0.8
1
1.2
1.4
1.6
FORWARD VOLTAGE (V)
Version: E15
BYG20D - BYG20J
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
175
f=1.0MHz
Vsig=50mVp-p
CAPACITANCE (pF)
150
125
100
75
50
25
0
0.1
1
10
100
1000
REVERSE VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
Unit (mm)
DIM.
A
Unit (inch)
Min
Max
Min
Max
1.27
1.58
0.050
0.062
B
4.06
4.60
0.160
0.181
C
2.29
2.83
0.090
0.111
D
1.99
2.50
0.078
0.098
E
0.90
1.41
0.035
0.056
F
4.95
5.33
0.195
0.210
G
0.10
0.20
0.004
0.008
H
0.15
0.31
0.006
0.012
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
1.68
0.066
B
1.52
0.060
C
3.93
0.155
D
2.41
0.095
E
5.45
0.215
MARKING DIAGRAM
P/N =
Specific Device Code
G=
Green Compound
YW =
Date Code
F=
Factory Code
Document Number: DS_D0000075
Version: E15
BYG20D - BYG20J
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D0000075
Version: E15
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