BYG20D - BYG20J Taiwan Semiconductor CREAT BY ART 1.5A, 200V - 600V High Efficient Surface Mount Rectifiers FEATURES - Glass passivated junction chip - Ideal for automated placement - Fast switching for high efficiency - High surge current capability - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 DO-214AC (SMA) MECHANICAL DATA Case: DO-214AC (SMA) Molding compound: UL flammability classification rating 94V-0 Part No. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Moisture sensitivity level: level 1, per J-STD-020 Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.064 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL BYG20D BYG20G BYG20J UNIT Maximum repetitive peak reverse voltage VRRM 200 400 600 V Maximum RMS voltage VRMS 140 280 420 V Maximum DC blocking voltage VDC 200 400 600 V Maximum average forward rectified current IF(AV) 1.5 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30 A Maximum instantaneous forward voltage (Note 1) Maximum reverse current @ rated VR IF=1.0A IF=1.5A TJ=25°C TJ=100°C Pulse energy in avalanche mode, non repetitive (Inductive load switch off ), L=120mH Maximum reverse recovery time (Note 2) Typical thermal resistance (Note 3) Operating junction temperature range Storage temperature range VF IR 1.3 1.4 1 10 V μA ERSM 20 mJ trr 75 ns RθJL 25 RθJA 100 TJ - 55 to +150 °C TSTG - 55 to +150 °C °C/W Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Reverse recovery test conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note 3: Mount on PC board with 5mm x 5mm copper pads as heatsink. Document Number: DS_D0000075 Version: E15 BYG20D - BYG20J Taiwan Semiconductor ORDERING INFORMATION PART NO. PART NO. PACKING PACKING CODE SUFFIX CODE SUFFIX BYG20x (Note 1) PACKAGE PACKING R3 SMA 1,800 / 7" Plastic reel R2 SMA 7,500 / 13" Paper reel SMA 7,500 / 13" Plastic reel Folded SMA 1,800 / 7" Plastic reel F2 Folded SMA 7,500 / 13" Paper reel F4 Folded SMA 7,500 / 13" Plastic reel M2 H G F3 Note 1: "x" defines voltage from 200V (BYG20D) to 600V (BYG20J) EXAMPLE EXAMPLE PART NO. PART NO. BYG20DHR3G PART NO. PACKING PACKING CODE SUFFIX CODE SUFFIX H R3 G BYG20D DESCRIPTION AEC-Q101 qualified Green compound RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG. 2 TYPICAL REVERSE CHARACTERISTICS FIG.1 FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT (A) 1.5 1 Resistive or inductive load 0.5 0 0 20 40 60 80 100 120 140 160 INSTANTANEOUS REVERSE CURRENT (μA) 100 2 10 1 TJ=125°C 0.1 0.01 TJ=25°C 0.001 0 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) LEAD TEMPERATURE (°C) FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT FIG. 4 TYPICAL FORWARD CHARACTERISTICS 10 INSTANTANEOUS FORWARD CURRENT (A) 70 PEAK FORWARD SURGE URRENT (A) 20 60 8.3ms single half sine wave 50 40 30 20 10 0 1 10 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D0000075 100 1 0.1 0.4 0.6 0.8 1 1.2 1.4 1.6 FORWARD VOLTAGE (V) Version: E15 BYG20D - BYG20J Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE 175 f=1.0MHz Vsig=50mVp-p CAPACITANCE (pF) 150 125 100 75 50 25 0 0.1 1 10 100 1000 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS DO-214AC (SMA) Unit (mm) DIM. A Unit (inch) Min Max Min Max 1.27 1.58 0.050 0.062 B 4.06 4.60 0.160 0.181 C 2.29 2.83 0.090 0.111 D 1.99 2.50 0.078 0.098 E 0.90 1.41 0.035 0.056 F 4.95 5.33 0.195 0.210 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.68 0.066 B 1.52 0.060 C 3.93 0.155 D 2.41 0.095 E 5.45 0.215 MARKING DIAGRAM P/N = Specific Device Code G= Green Compound YW = Date Code F= Factory Code Document Number: DS_D0000075 Version: E15 BYG20D - BYG20J Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D0000075 Version: E15