HS1AL thru HS1ML Taiwan Semiconductor CREAT BY ART High Efficient Surface Mount Rectifiers FEATURES - Glass passivated junction chip - Ideal for automated placement - Low profile package - Low power loss, high efficiency - Fast switching for high efficiency - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: Sub SMA Sub SMA Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - green compound (halogen-free) Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL Marking code HS HS HS HS HS HS 1AL 1BL 1DL 1FL 1GL 1JL 1KL 1ML HAL HBL HDL HFL HGL HJL HKL HML HS HS UNIT Maximum repetitive peak reverse voltage VRRM 50 100 200 300 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 210 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 300 400 600 800 1000 V Maximum average forward rectified current IF(AV) 1 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30 A Maximum instantaneous forward voltage (Note 1) @1A VF Maximum reverse current @ rated VR TJ=25 ℃ TJ=125 ℃ IR Typical junction capacitance (Note 2) Cj 20 15 Maximum reverse recovery time (Note 3) Trr 50 75 Typical thermal resistance Operating junction temperature range Storage temperature range 0.95 1.3 V 1.7 5 μA 150 pF ns O RθjA 100 TJ - 55 to +150 O C - 55 to +150 O C TSTG C/W Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Measured at 1 MHz and Applied VR=4.0 Volts. Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Document Number: DS_D1405079 Version: B14 HS1AL thru HS1ML Taiwan Semiconductor ORDERING INFORMATION PART NO. AEC-Q101 PACKING CODE GREEN COMPOUND PACKAGE PACKING Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA 1,800 / 7" Plastic reel (8mm tape) 3,000 / 7" Plastic reel (8mm tape) 7,500 / 13" Paper reel (8mm tape) 7,500 / 13" Plastic reel (8mm tape) 10,000 / 13" Paper reel (8mm tape) 10,000 / 13" Plastic reel (8mm tape) 1,800 / 7" Plastic reel (12mm tape) 3,000 / 7" Plastic reel (12mm tape) 7,500 / 13" Paper reel (12mm tape) 7,500 / 13" Plastic reel (12mm tape) RH Sub SMA 10,000 / 13" Paper reel (12mm tape) MH Sub SMA 10,000 / 13" Plastic reel (12mm tape) QUALIFIED HS1xL (Note 1) CODE RU RV RT MT RQ MQ R3 RF R2 M2 Prefix "H" Suffix "G" Note 1: "x" defines voltage from 50V (HS1AL) to 1000V (HS1ML) EXAMPLE PREFERRED P/N PART NO. HS1JL RU HS1JL HS1JL RUG HS1JL HS1JLHRU AEC-Q101 PACKING CODE QUALIFIED GREEN COMPOUND CODE DESCRIPTION RU RU H HS1JL G Green compound RU AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) FIG. 2- TYPICAL REVERSE CHARACTERISTICS 100 1.2 1 0.8 0.6 0.4 0.2 0 80 90 100 110 120 130 140 150 INSTANTANEOUS REVERSE CURRENT (μA) AVERAGE FORWARD CURRENT (A) FIG.1- MAXIMUM AVERAGE FORWARD CURRENT DERATING 10 TJ=125℃ 1 0.1 0.01 TJ=25℃ 0.001 0 FIG. 3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 40 35 30 8.3ms Single Half Sine Wave 25 20 15 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 4- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS INSTANTANEOUS FORWARD CURRENT (A) PEAK FORWARD SURGE URRENT (A) LEAD TEMPERATURE (oC) 100 10 HS1AL-HS1DL 1 HS1GL 0.1 HS1JL-HS1ML 10 5 1 10 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D1405079 100 0.01 0 0.2 0.4 0.6 0.8 1 1.2 FORWARD VOLTAGE (V) 1.4 1.6 Version: B14 HS1AL thru HS1ML Taiwan Semiconductor FIG. 5- TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE (pF) 70 60 50 40 HS1AL-HS1GL 30 20 10 HS1JL-HS1ML 0 0.1 1 10 100 1000 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS Unit (mm) DIM. Unit (inch) Min Max Min Max B 1.70 1.90 0.067 0.075 C 2.70 2.90 0.106 0.114 D 0.16 0.30 0.006 0.012 E 1.23 1.43 0.048 0.056 F 0.80 1.20 0.031 0.047 G 3.40 3.80 0.134 0.150 H 2.45 2.60 0.096 0.102 I 0.35 0.85 0.014 0.033 J 0.00 0.10 0.000 0.004 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.4 0.055 B 1.2 0.047 C 3.1 0.122 D 1.9 0.075 E 4.3 0.169 MARKING DIAGRAM P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D1405079 Version: B14 HS1AL thru HS1ML Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1405079 Version: B14