HS3AB - HS3MB Taiwan Semiconductor CREAT BY ART 3A, 50V - 1000V High Efficient Surface Mount Rectifiers FEATURES - Low power loss, high efficiency - Low forward voltage drop - Low profile package - Fast switching for high efficiency - Ideal for automated placement - Glass passivated junction chip. - Fast switching for high efficiency - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 DO-214AA (SMB) MECHANICAL DATA Case: DO-214AA (SMB) Molding compound, UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Part No. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 93 mg (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL HS HS HS 3AB 3BB 3DB HS HS HS HS HS 3FB 3GB 3JB 3KB 3MB UNIT Maximum repetitive peak reverse voltage VRRM 50 100 200 300 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 210 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 300 400 600 800 1000 V Maximum average forward rectified current IF(AV) 3 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 100 A Maximum instantaneous forward voltage (Note 1) IF= 3 A Maximum reverse current @ rated VR TJ=25°C TJ=125°C VF 1.0 1.3 1.7 10 IR V μA 250 Maximum reverse recovery time (Note 2) trr 50 75 ns Typical junction capacitance (Note 3) CJ 80 50 pF Typical thermal resistance Operating junction temperature range Storage temperature range RθJA 60 °C/W TJ - 55 to +150 °C TSTG - 55 to +150 °C Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note 3: Measured at 1 MHz and Applied VR=4.0 Volts Document Number: DS_D0000101 Version: J15 HS3AB - HS3MB Taiwan Semiconductor ORDERING INFORMATION PART NO. PART NO. PACKING CODE PACKING CODE SUFFIX SUFFIX PACKAGE PACKING SMB 850 / 7" Plastic reel SMB 3,000 / 13" Paper reel SMB 3,000 / 13" Plastic reel (*) R5 HS3xB (Note 1) H R4 G M4 Note 1: "x" defines voltage from 50V (HS3AB) to 1000V (HS3MB) *: Optional available EXAMPLE PREFERRED P/N PART NO. HS3MBHR5G HS3MB PART NO. SUFFIX PACKING CODE PACKING CODE H DESCRIPTION SUFFIX R5 AEC-Q101 qualified Green compound G RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG.1 FORWARD CURRENT DERATING CURVE 3 2.5 2 1.5 1 RESISTIVE OR INDUCTIVE LOAD 0.5 0 0 25 50 75 100 125 150 175 INSTANTANEOUS REVERSE CURRENT (μA) 3.5 AVERAGE FORWARD CURRENT (A) FIG. 2 TYPICAL REVERSE CHARACTERISTICS 1000 TJ=125°C 100 10 TJ=25°C 1 0.1 0 20 FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 150 100 50 0 100 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D0000101 1000 INSTANTANEOUS FORWARD CURRENT (A) PEAK FORWARD SURGE URRENT(A) 200 10 80 100 120 140 FIG. 4 TYPICAL FORWARD CHARACTERISTICS 8.3ms Single Half Sine Wave 1 60 100 300 250 40 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) LEAD TEMPERATURE (°C) 10 HS3AB-HS3DB HS3GB 1 HS3JB-HS3MB 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 FORWARD VOLTAGE (V) Version: J15 HS3AB - HS3MB Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE 175 150 CAPACITANCE (pF) 125 100 HS3AB-HS3GB 75 50 HS3JB-HS3MB 25 0 0.1 1 10 100 1000 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS DO-214AA (SMB) Unit (mm) DIM. Unit (inch) Min Max Min Max A 1.95 2.10 0.077 0.083 B 4.25 4.75 0.167 0.187 C 3.48 3.73 0.137 0.147 D 1.99 2.61 0.078 0.103 E 0.90 1.41 0.035 0.056 F 5.10 5.30 0.201 0.209 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 2.3 0.091 B 2.5 0.098 C 4.3 0.169 D 1.8 0.071 E 6.8 0.268 MARKING DIAGRAM P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D0000101 Version: J15 HS3AB - HS3MB Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D0000101 Version: J15