ES1AL - ES1JL Taiwan Semiconductor CREAT BY ART 1A, 50V - 600V Surface Mount Super Fast Rectifiers FEATURES - Glass passivated junction chip - Ideal for automated placement - Low profile package - Low power loss, high efficiency - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Sub SMA Case: Sub SMA Molding compound, UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Part No. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL Marking code ES ES ES ES ES ES ES ES 1AL 1BL 1CL 1DL 1FL 1GL 1HL 1JL EAL EBL ECL EDL EFL EGL EHL EJL UNIT Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 400 500 600 V Maximum RMS voltage VRMS 35 70 105 140 210 280 350 420 V Maximum DC blocking voltage VDC 50 100 150 200 300 400 500 600 V Maximum average forward rectified current IF(AV) 1 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30 A Maximum instantaneous forward voltage (Note 1) @1A Maximum reverse current @ rated VR TJ=25°C TJ=125°C VF 0.95 1.3 1.7 5 IR V μA 100 Typical junction capacitance (Note 2) CJ Maximum reverse recovery time (Note 3) trr 35 ns RθJL RθJA 35 85 °C/W TJ - 55 to +150 °C TSTG - 55 to +150 °C Typical thermal resistance Operating junction temperature range Storage temperature range 10 8 pF Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Measured at 1 MHz and Applied VR=4.0 Volts. Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Document Number: DS_D1410026 Version: K15 ES1AL - ES1JL Taiwan Semiconductor ORDERING INFORMATION PART NO. PART NO. PACKING CODE PACKING CODE PACKAGE PACKING Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA 1,800 / 7" Plastic reel (8mm tape) 3,000 / 7" Plastic reel (8mm tape) 7,500 / 13" Paper reel (8mm tape) 7,500 / 13" Plastic reel (8mm tape) 10,000 / 13" Paper reel (8mm tape) 10,000 / 13" Plastic reel (8mm tape) 1,800 / 7" Plastic reel (12mm tape) 3,000 / 7" Plastic reel (12mm tape) 7,500 / 13" Paper reel (12mm tape) 7,500 / 13" Plastic reel (12mm tape) RH Sub SMA 10,000 / 13" Paper reel (12mm tape) MH Sub SMA 10,000 / 13" Plastic reel (12mm tape) SUFFIX ES1xL (Note 1) SUFFIX RU RV RT MT RQ MQ R3 RF R2 M2 H G Note 1: "x" defines voltage from 50V (ES1AL) to 600V (ES1JL) EXAMPLE PREFERRED P/N PART NO. ES1JLHRUG ES1JL PART NO. PACKING CODE SUFFIX H PACKING CODE DESCRIPTION SUFFIX RU AEC-Q101 qualified Green compound G RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG. 2 TYPICAL FORWARD CHARACTERISTICS 1.2 1 0.8 0.6 0.4 RESISTIVE OR INDUCTIVE LOAD 0.2 0 80 90 100 110 120 LEAD TEMPERATURE 130 140 150 INSTANTANEOUS FORWARD CURRENT (A) AVERAGE FORWARD CURRENT (A) FIG.1 FORWARD CURRENT DERATING CURVE 100 Pulse Width=300μs 1% Duty Cycle ES1HL-ES1JL 10 ES1FL-ES1GL ES1AL-ES1DL 1 0.1 0.4 (oC) 0.6 0.8 1 1.2 1.4 1.6 1.8 FORWARD VOLTAGE (V) 30 25 8.3ms Single Half Sine Wave 20 15 10 5 0 1 10 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D1410026 100 FIG. 4 TYPICAL REVERSE CHARACTERISTICS 1000 INSTANTANEOUS REVERSE CURRENT (μA) PEAK FORWARD SURGE CURRENT (A) FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 100 TJ=125°C 10 TJ=75°C 1 0.1 TJ=25°C 0.01 0 20 40 60 80 100 120 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 140 Version: K15 ES1AL - ES1JL Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE 14 CAPACITANCE (pF) 12 ES1AL-ES1DL 10 8 6 ES1FL-ES1JL 4 f=1.0MHz Vsig=50mVp-p 2 0 1 10 100 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS Sub SMA Unit (mm) DIM. Unit (inch) Min Max Min Max B 1.70 1.90 0.067 0.075 C 2.70 2.90 0.106 0.114 D 0.16 0.30 0.006 0.012 E 1.23 1.43 0.048 0.056 F 0.80 1.20 0.031 0.047 G 3.40 3.80 0.134 0.150 H 2.45 2.60 0.096 0.102 I 0.35 0.85 0.014 0.033 J 0.00 0.10 0.000 0.004 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.4 0.055 B 1.2 0.047 C 3.1 0.122 D 1.9 0.075 E 4.3 0.169 MARKING DIAGRAM P/N = Marking Code G = Green compound Code YW = Date Code F = Factory Code Document Number: DS_D1410026 Version: K15 ES1AL - ES1JL Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1410026 Version: K15