ES1AL SERIES_K15.pdf

ES1AL - ES1JL
Taiwan Semiconductor
CREAT BY ART
1A, 50V - 600V Surface Mount Super Fast Rectifiers
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Low power loss, high efficiency
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Sub SMA
Case: Sub SMA
Molding compound, UL flammability classification rating 94V-0
Moisture sensitivity level: level 1, per J-STD-020
Part No. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code
ES
ES
ES
ES
ES
ES
ES
ES
1AL
1BL
1CL
1DL
1FL
1GL
1HL
1JL
EAL
EBL
ECL
EDL
EFL
EGL
EHL
EJL
UNIT
Maximum repetitive peak reverse voltage
VRRM
50
100
150
200
300
400
500
600
V
Maximum RMS voltage
VRMS
35
70
105
140
210
280
350
420
V
Maximum DC blocking voltage
VDC
50
100
150
200
300
400
500
600
V
Maximum average forward rectified current
IF(AV)
1
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
30
A
Maximum instantaneous forward voltage (Note 1)
@1A
Maximum reverse current @ rated VR
TJ=25°C
TJ=125°C
VF
0.95
1.3
1.7
5
IR
V
μA
100
Typical junction capacitance (Note 2)
CJ
Maximum reverse recovery time (Note 3)
trr
35
ns
RθJL
RθJA
35
85
°C/W
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
Typical thermal resistance
Operating junction temperature range
Storage temperature range
10
8
pF
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Document Number: DS_D1410026
Version: K15
ES1AL - ES1JL
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PART NO.
PACKING CODE
PACKING CODE
PACKAGE
PACKING
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
1,800 / 7" Plastic reel (8mm tape)
3,000 / 7" Plastic reel (8mm tape)
7,500 / 13" Paper reel (8mm tape)
7,500 / 13" Plastic reel (8mm tape)
10,000 / 13" Paper reel (8mm tape)
10,000 / 13" Plastic reel (8mm tape)
1,800 / 7" Plastic reel (12mm tape)
3,000 / 7" Plastic reel (12mm tape)
7,500 / 13" Paper reel (12mm tape)
7,500 / 13" Plastic reel (12mm tape)
RH
Sub SMA
10,000 / 13" Paper reel (12mm tape)
MH
Sub SMA
10,000 / 13" Plastic reel (12mm tape)
SUFFIX
ES1xL
(Note 1)
SUFFIX
RU
RV
RT
MT
RQ
MQ
R3
RF
R2
M2
H
G
Note 1: "x" defines voltage from 50V (ES1AL) to 600V (ES1JL)
EXAMPLE
PREFERRED P/N
PART NO.
ES1JLHRUG
ES1JL
PART NO.
PACKING CODE
SUFFIX
H
PACKING CODE
DESCRIPTION
SUFFIX
RU
AEC-Q101 qualified
Green compound
G
RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted)
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
1.2
1
0.8
0.6
0.4
RESISTIVE OR
INDUCTIVE LOAD
0.2
0
80
90
100
110
120
LEAD TEMPERATURE
130
140
150
INSTANTANEOUS FORWARD CURRENT
(A)
AVERAGE FORWARD CURRENT (A)
FIG.1 FORWARD CURRENT DERATING CURVE
100
Pulse Width=300μs
1% Duty Cycle
ES1HL-ES1JL
10
ES1FL-ES1GL
ES1AL-ES1DL
1
0.1
0.4
(oC)
0.6
0.8
1
1.2
1.4
1.6
1.8
FORWARD VOLTAGE (V)
30
25
8.3ms Single Half Sine Wave
20
15
10
5
0
1
10
NUMBER OF CYCLES AT 60 Hz
Document Number: DS_D1410026
100
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
1000
INSTANTANEOUS REVERSE CURRENT
(μA)
PEAK FORWARD SURGE CURRENT
(A)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE
CURRENT
100
TJ=125°C
10
TJ=75°C
1
0.1
TJ=25°C
0.01
0
20
40
60
80
100
120
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
140
Version: K15
ES1AL - ES1JL
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
14
CAPACITANCE (pF)
12
ES1AL-ES1DL
10
8
6
ES1FL-ES1JL
4
f=1.0MHz
Vsig=50mVp-p
2
0
1
10
100
REVERSE VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
Sub SMA
Unit (mm)
DIM.
Unit (inch)
Min
Max
Min
Max
B
1.70
1.90
0.067
0.075
C
2.70
2.90
0.106
0.114
D
0.16
0.30
0.006
0.012
E
1.23
1.43
0.048
0.056
F
0.80
1.20
0.031
0.047
G
3.40
3.80
0.134
0.150
H
2.45
2.60
0.096
0.102
I
0.35
0.85
0.014
0.033
J
0.00
0.10
0.000
0.004
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
1.4
0.055
B
1.2
0.047
C
3.1
0.122
D
1.9
0.075
E
4.3
0.169
MARKING DIAGRAM
P/N
= Marking Code
G
= Green compound Code
YW
= Date Code
F
= Factory Code
Document Number: DS_D1410026
Version: K15
ES1AL - ES1JL
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1410026
Version: K15
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