RMB2S thru RMB6S Taiwan Semiconductor CREAT BY ART Miniature Glass Passivated Fast Recovery Surface Mount Bridge Rectifiers FEATURES - Ideal for automated placement - Reliable low cost construction utilizing molded plastic technique - High surge current capability - Small size, simple installation - Moisture sensitivity level: level 1, per J-STD-020 - UL Recognized File # E-326243 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition TO-269AA (MBS) - AEC-Q101 Qualified MECHANICAL DATA Case: TO-269AA (MBS) Molding compound, UL flammability classification rating 94V-0 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Polarity: Polarity as marked on the body Weight: 0.12 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL RMB2S RMB4S RMB6S Unit Maximum repetitive peak reverse voltage VRRM 200 400 600 V Maximum RMS voltage VRMS 140 280 420 V Maximum DC blocking voltage VDC 200 400 600 V Maximum average forward current 60Hz sine wave resistance load On glass-expoxy P.C.B. On aluminum substrate IF(AV) Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30 A Rating for fusing (t<8.3ms) I2t 3.74 A2s Maximum instantaneous forward voltage (Note 1) IF= 0.4 VF 1.00 V IR 5 100 μA Maximum reverse recovery time (Note 2) trr 150 ns Typical junction capacitance per leg CJ 13 pF RθJA 85 °C/W TJ - 55 to +150 °C TSTG - 55 to +150 °C Maximum DC reverse current at rated DC blocking voltage TJ=25 °C TJ=125 °C Typical thermal resistance Operating junction temperature range Storage temperature range 0.5 0.8 A Note 1: Pulse Test with PW=300μs, 1% Duty Cycle Note 2: Reverse Recovery Test Condition: IF=0.5A, IR=1.0A, IRR=0.25A Document Number: DS_D1410011 Version: F14 RMB2S thru RMB6S Taiwan Semiconductor ORDERING INFORMATION PART NO. PACKING CODE PACKING CODE PACKAGE PACKING MBS 3,000 / 13" Paper reel SUFFIX RMBxS (Note 1,2) RC G Note 1: "x" defines voltage from 200V (RMB2S) to 600V (RMB6S) Note 2: Whole series with green compound EXAMPLE PREFERRED P/N PART NO. PACKING CODE RMB2S RCG RMB2S RC PACKING CODE DESCRIPTION SUFFIX AEC-Q101 qualified Green compound G RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG. 2 TYPICAL REVERSE CHARACTERISTICS PER LEG FIG.1 FORWARD CURRENT DERATING CURVE 100 INSTANTANEOUS REVERSE CURRENT (μA) AVERAGE FORWARD CURRENT (A) 1 0.8 Aluminum Substrate 0.6 0.4 Glass Epoxy P.C.B. 0.2 0 0 20 40 60 80 100 120 140 160 1 0.1 TJ=25°C 0.01 0 20 40 60 80 100 AMBIENT TEMPERATURE (oC) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 2 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT PER LEG FIG. 4 TYPICAL FORWARD CHARACTERISTICS PER LEG 35 10 8.3ms Single Half Sine Wave 30 INSTANTANEOUS FORWARD CURRENT (A) PEAK FORWARD SURGE CURRENT (A) TJ=125°C 10 25 20 15 10 5 0 1 10 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D1410011 100 1 0.1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 FORWARD VOLTAGE (V) Version: F14 RMB2S thru RMB6S Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE PER LEG 30 CAPACITANCE (pF) A 25 20 15 10 f=1.0MHz Vsig=50mVp-p 5 0 0.1 1 10 100 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS TO-269AA (MBS) DIM. Unit (mm) Unit (inch) Min Max Min Max A 4.50 4.90 0.177 0.193 B 0.56 0.84 0.022 0.033 C 3.60 5.00 0.142 0.197 D - 6.90 - 0.272 E 2.20 2.60 0.087 0.102 F 2.30 2.70 0.091 0.106 G - 0.20 - 0.008 H - 2.90 - 0.114 I 0.95 1.53 0.037 0.060 J 0.70 1.10 0.028 0.043 K 0.15 0.35 0.006 0.014 L 1.10 2.12 0.043 0.083 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.7 0.067 B 0.9 0.035 C 4.4 0.173 D 8.1 0.319 E 1.3 0.051 F 6.3 0.248 MARKING DIAGRAM P/N = Specific Device Code YW = Date Code F = Factory Code Document Number: DS_D1410011 Version: F14 RMB2S thru RMB6S Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1410011 Version: F14