714AA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
X3DFN4 0.525x0.925, 0.3P
CASE 714AA
ISSUE B
DATE 08 DEC 2014
SCALE 8:1
Ï
Ï
PIN ONE
REFERENCE
2X
0.05 C
2X
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A B
D
MILLIMETERS
DIM MIN
MAX
A
0.24
0.32
A1 0.00
0.05
b
0.12
0.18
D
0.525 BSC
E
0.925 BSC
e
0.30 BSC
L 0.173 0.233
L2 0.42
0.48
E
TOP VIEW
A
0.05 C
GENERIC
MARKING DIAGRAM*
0.05 C
A1
SIDE VIEW
NOTE 3
C
XM
5X
L2
SEATING
PLANE
b
0.07
1
2
C A B
NOTE 3
4X
4
M
L
3
e
e/2
BOTTOM VIEW
X
M
= Specific Device Code
= Date Code
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
RECOMMENDED
SOLDER FOOTPRINT*
0.66
5X
4X
0.38
0.18
1.08
1
0.30
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON89145F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
X3DFN4 0.525X0.925, 0.3P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON89145F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
31 JUL 2014
A
CHANGED POSITIONAL TOLERANCE VALUE IN TOP VIEW FROM 0.08 TO 0.05.
REQ. BY D. TRUHITTE.
21 OCT 2014
B
CHANGED DESCRIPTION FROM X2LLGA4 TO X3DFN4. REQ. BY D. TRUHITTE.
08 DEC 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
December, 2014 − Rev. B
Case Outline Number:
714AA
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