152AX

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DSN2, 0.60x0.30, 0.36P
CASE 152AX
ISSUE O
SCALE 8:1
DATE 17 NOV 2015
D
PIN 1
INDICATOR
0.025 C
2X
2X
ÈÈ
0.025 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
B
DIM
A
A1
b
D
E
e
L
E
TOP VIEW
A
0.02 C
A1
GENERIC
MARKING DIAGRAM*
0.01 C
C
SIDE VIEW
MILLIMETERS
MIN
MAX
0.175 0.225
−−− 0.018
0.205 0.225
0.575 0.625
0.275 0.325
0.36 BSC
0.145 0.165
SEATING
PLANE
X
e
b
X = Specific Device Code
1
0.05
L2
C A B
2X
0.05
M
M
C A B
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
RECOMMENDED
SOLDER FOOTPRINT*
BOTTOM VIEW
0.65
2X
0.27
1
2X
0.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON06808G
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DSN2, 0.60X0.30, 0.36P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON06808G
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
17 NOV 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. O
Case Outline Number:
152AX
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