DATASHEET

MP3/USB 2.0 High Speed Switch with Negative
Signal Handling and Low Power Shutdown
ISL54209
Features
The Intersil ISL54209 dual SPDT (Single Pole/Double
Throw) switch combines low distortion audio and
accurate USB 2.0 high speed data (480Mbps) signal
switching in the same low voltage device. When
operated with a 2.5V to 5.0V single supply, this analog
switch allows audio signal swings below ground,
allowing for the use of a common USB and audio
headphone connector in Personal Media Players and
other portable battery powered devices.
• High Speed (480Mbps) and Full Speed (12Mbps)
Signaling Capability per USB 2.0
The ISL54209 logic control pins are 1.8V compatible,
which allows for control via a standard µcontroller.
• Low Distortion Negative Signal Capability
• Low Power Shutdown State
• Low Distortion Headphone Audio Signals
- THD+N at 1mW into 32Load. . . . . . .<0.013%
• Crosstalk (100kHz) . . . . . . . . . . . . . . . . . . -95dB
• OFF-Isolation (100kHz) . . . . . . . . . . . . . . . 95dB
• Single Supply Operation (VDD) . . . . . 2.5V to 5.0V
The ISL54209 has an audio enable control pin to open all
switches and put the part in a low power state. In this
state, the device draws typically 1nA of current.
The ISL54209 is available in a small 10 Ld 1.8mm x
1.4mm or 2.1mmx 1.6mm ultra-thin µTQFN packages
and a 10 Ld 3mmx3mm TDFN package. It operates over
a temperature range of -40°C to +85°C.
Related Literature
• -3dB Bandwidth USB Switch . . . . . . . . . . 736MHz
• Available in µTQFN and TDFN Packages
• COM Pins Over-voltage Tolerant to 5.5V
• Compliant with USB 2.0 Short Circuit Requirements
Without Additional External Components
• Pb-Free (RoHS Compliant)
Applications*(see page 16)
• MP3 and other Personal Media Players
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Application Note AN1406 “ISL54209EVAL1Z
Evaluation Board User’s Manual”
• Cellular/Mobile Phones
• PDAs
• Audio/USB Switching
Application Block Diagram
3.3V
VDD
ISL54209
USB/HEADPHONE JACK
IN
VBUS
LOGIC CONTROL
4M
CTRL
µCONTROLLER
4M
D-
COM -
D+
USB
HIGH-SPEED
TRANSCEIVER
COM +
L
R
50k
AUDIO
CODEC
50k
GND
June 10, 2010
FN6627.4
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2009, 2010. All Rights Reserved
Intersil (and design) and XDCP are trademarks owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL54209
R NEW DESIGNS
NOT RECOMMENDED FO
ACEMENT
NO RECOMMENDED REPL
pport Center at
contact our Technical Su
ntersil.com/tsc
1-888-INTERSIL or www.i
ISL54209
Pin Configurations
(Note 1)
ISL54209
(10 LD 3.0mmx3.0mm TDFN)
TOP VIEW
ISL54209
(10 LD 2.1mmx1.6mm µTQFN)
TOP VIEW
CTRL
10
4M
VDD
LOGIC
CONTROL
VDD 1
IN 2
9 D-
COM - 3
COM - 3
COM + 4
7 L
10 CTRL
9
D-
8
D+
7
L
6
R
50k
50k
GND 5
6 R
COM + 4
4M
LOGIC
CONTROL
4M
IN 2
8 D+
4M
PD
1
50k
50k
5
GND
ISL54209
(10 LD 1.8mmx1.4mm µTQFN)
TOP VIEW
D-
8
CTRL
9
VDD
10
D+
L
7
6
LOGIC
CONTROL
50k
5
R
4
GND
3
COM +
4M
1
2
IN
COM -
NOTE:
1. ISL54209 Switches Shown for IN = Logic “0” and CTRL = Logic “1”.
Truth Table
ISL54209
IN
CTRL
L, R
D+, D-
0
0
OFF
OFF
0
1
ON
OFF
1
X
OFF
ON
IN, CTRL: Logic “0” when  0.5V or Floating, Logic “1” when
 1.4V with 2.7V to 3.6V Supply.
2
FN6627.4
June 10, 2010
ISL54209
Pin Descriptions
TDFN
µTQFN
2.1mmx1.6mm
µTQFN
1.8mmx1.4mm
NAME
1
1
10
VDD
2
2
1
IN
3
3
2
COM-
Voice and Data Common Pin
4
4
3
COM+
Voice and Data Common Pin
5
5
4
GND
6
6
5
R
Audio Right Input
7
7
6
L
Audio Left Input
8
8
7
D+
USB Differential Input
9
9
8
D-
USB Differential Input
10
10
9
CTRL
PD
-
-
PD
FUNCTION
Power Supply
Digital Control Input
Ground Connection
Digital Control Input (Audio Enable)
Thermal Pad. Tie to Ground or Float
Ordering Information
PART
NUMBER
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL54209IRUZ-T
(Notes 3, 4, 5)
GF
-40 to +85
10 Ld 2.1mmx1.6mm µTQFN
L10.2.1x1.6A
ISL54209IRU1Z-T
(Notes 3, 4, 5)
U4
-40 to +85
10 Ld 1.8mmx1.4mm µTQFN
L10.1.8x1.4A
ISL54209IRTZ-T
(Notes 2, 4, 5)
4209
-40 to +85
10 Ld 3mmx3mm TDFN
L10.3x3A
ISL54209IRTZ
(Notes 2, 5)
4209
-40 to +85
10 Ld 3mmx3mm TDFN
L10.3x3A
ISL54209EVAL1Z
ISL54209 Eval Kit
NOTES:
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach
materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
4. Please refer to TB347 for details on reel specifications.
5. For Moisture Sensitivity Level (MSL), please see device information page for ISL54209. For more information on MSL please
see techbrief TB363.
3
FN6627.4
June 10, 2010
ISL54209
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
Input Voltages
D+, D- (Note 6) . . . . . . . . . . . . . . . . . . . . . - 2V to 5.5V
L, R (Note 6). . . . . . . . . . . . . . . . - 2V to ((VDD) + 0.3V)
IN, CTRL (Note 6) . . . . . . . . . . . -0.3V to ((VDD) + 0.3V)
Output Voltages
COM-, COM+ (Note 6) . . . . . . . . . . . . . . . . . -2V to 5.5V
Continuous Current (Audio Switches) . . . . . . . . . . ±150mA
Peak Current (Audio Switches)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±300mA
Continuous Current (USB Switches) . . . . . . . . . . . . ±40mA
Peak Current (USB Switches)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA
ESD Ratings
Human Body Model, I/0 to GND . . . . . . . . . . . . . . . >4kV
Human Body Model, All Other Pins. . . . . . . . . . . . . >3.5kV
Human Body Model, VDD to GND . . . . . . . . . . . . . . >11kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . >250V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . >2kV
Latch-up Tested per JEDEC: ClassII Level A > . . . . @ +85°C
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
10 Ld 2.1mmx1.6mm µTQFN (Notes 8, 10). .154
100
10 Ld 3mmx3mm TDFN (Notes 7, 9) . .
58
18
10 Ld 1.8mmx1.4mm µTQFN (Notes 8, 10). 160
105
Maximum Junction Temperature (Plastic Package). . +150°C
Maximum Storage Temperature Range. . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
Audio Signal Range . . . . . . . . . . . . . . . . . . . . -1.5V to 1.5V
USB Signal Range . . . . . . . . . . . . . . . . . . . . . . . 0V to VDD
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
6. Signals on D+, D-, L, R, COM-, COM+, CTRL and IN exceeding VDD or GND by specified amount are clamped. Limit current to
maximum current ratings.
7. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
8. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
9. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
10. For JC, the “case temp” location is taken at the package top center.
Electrical Specifications - 2.7V to 3.6V Supply
Test Conditions: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V,
VINL = VCTRLL = 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER
TEST CONDITIONS
TEMP
MIN
(°C) (Notes 12, 13)
TYP
MAX
(Notes 12, 13) UNITS
ANALOG SWITCH CHARACTERISTICS
Audio Switches (L, R)
Analog Signal Range,
VANALOG
VDD = 3.3V, IN = 0.5V, CTRL = 1.4V
Full
-1.5
-
1.5
V
ON-Resistance, rON
VDD = 3.0V, IN = 0.5V, CTRL = 1.4V,
ICOMx = 40mA, VL or VR = -0.85V to 0.85V
(Figure 3, Note 15)
+25
-
2.5
2.8

Full
-
-
3.4

rON Matching Between
Channels, rON
VDD = 3.0V, IN = 0.5V, CTRL = 1.4V, ICOMx
= 40mA, VL or VR = Voltage at max rON over
signal range of -0.85V to 0.85V (Notes 15,
16)
+25
-
0.09
0.25

Full
-
-
0.26

rON Flatness, rFLAT(ON)
VDD = 3.0V, IN = 0.5V, CTRL = 1.4V,
ICOMx = 40mA, VL or VR = -0.85V to 0.85V
(Notes 14, 15)
+25
-
0.02
0.05

Full
-
-
0.07

VDD = 5.0V, IN = 0V, CTRL = VDD, ICOMx =
40mA, VL or VR = -0.85V to 0.85V (Figure 3)
25
-
2.3
-

ON-Resistance, rON
4
FN6627.4
June 10, 2010
ISL54209
Electrical Specifications - 2.7V to 3.6V Supply
Test Conditions: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V,
VINL = VCTRLL = 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C. (Continued)
PARAMETER
TEST CONDITIONS
TEMP
MIN
(°C) (Notes 12, 13)
TYP
MAX
(Notes 12, 13) UNITS
ON-Resistance, rON
VDD = 4.2V, IN = 0V, CTRL = VDD,
ICOMx = 40mA, VL or VR = -0.85V to 0.85V
(Figure 3)
25
-
2.35
-

ON-Resistance, rON
VDD = 2.85V, IN = 0V, CTRL = VDD, ICOMx =
40mA, VL or VR = -0.85V to 0.85V (Figure 3)
25
-
2.72
-

Discharge Pull-Down
Resistance, RL, RR
VDD = 3.6V, IN = 0V, CTRL = 1.4V, VCOM- or
VCOM+ = -0.85V, 0.85V, VL or VR = -0.85V,
0.85V, VD+ and VD- = floating; measure
current through the discharge pull-down
resistor and calculate resistance value.
+25
-
50
-
k
Analog Signal Range,
VANALOG
VDD = 2.7V to 3.6V, IN = 1.4V, CTRL = 1.4V
Full
0
-
VDD
V
ON-Resistance, rON
(High-Speed)
VDD = 3.3V, IN = 1.4V, CTRL = 1.4V,
ICOMx = 40mA, VD+ or VD- = 0V to 400mV
(Figure 4, Note 15)
25
-
5
6.5

Full
-
-
7

rON Matching Between
Channels, rON
(High-Speed)
VDD = 3.3V, IN = 1.4V, CTRL = 1.4V, ICOMx
= 40mA, VD+ or VD- = Voltage at max rON
(Notes 15, 16)
25
-
0.05
0.25

Full
-
-
0.55

rON Flatness, rFLAT(ON)
(High-Speed)
VDD = 3.3V, IN = 1.4V, CTRL = 1.4V,
ICOMx = 40mA, VD+ or VD- = 0V to 400mV
(Notes 14, 15)
25
-
0.45
0.55

Full
-
-
1.0

ON-Resistance, rON
(Full-Speed)
VDD = 3.3V, IN = 1.4V, CTRL = 1.4V,
ICOMx = 1mA, VD+ or VD- = 3.3V (Figure 4,
Note 15)
25
-
25
30

Full
-
-
35

ON-Resistance, rON
VDD = 5.0V, IN = VDD, CTRL = VDD, ICOMx =
1mA, VD+ or VD- = 5V (Figure 4)
+25
-
20
-

ON-Resistance, rON
VDD = 4.2V, IN = VDD, CTRL = VDD, ICOMx =
1mA, VD+ or VD- = 4.2V (Figure 4)
25
-
22
-

ON-Resistance, rON
VDD = 2.85V, IN = VDD, CTRL = VDD, ICOMx
= 1mA, VD+ or VD- = 2.85V (Figure 4)
25
-
28
-

OFF-Leakage Current,
ID+(OFF) or ID-(OFF)
VDD = 3.6V, IN = 0V, CTRL = 3.6V, VCOM- or
VCOM+ = 0.5V, 0V, VD+ or VD- = 0V, 0.5V,
VL and VR = float
25
-5
0.5
5
nA
Full
-60
-
60
nA
25
-10
2
10
nA
Full
-70
-
70
nA
VDD = 3.0V, RL = 50, CL = 10pF (Figure 1)
25
-
52
-
ns
USB Turn-OFF Time, tOFF VDD = 3.0V, RL = 50, CL = 10pF (Figure 1)
25
-
20
-
ns
Audio Turn-ON Time, tON VDD = 3.0V, RL = 50, CL = 10pF (Figure 1)
25
-
2.5
-
µs
Audio Turn-OFF Time,
tOFF
VDD = 3.0V, RL = 50, CL = 10pF (Figure 1)
25
-
50
-
ns
Break-Before-Make Time VDD = 3.0V, RL = 50, CL = 10pF (Figure 2)
Delay, tD
25
-
44
-
ns
USB Switches (D+, D-)
ON-Leakage Current, IDX VDD = 3.6V, IN = VDD, CTRL = 0V or VDD,
VD+ or VD- = 2.7V, VCOM- or VCOM+ = Float,
VL and VR = float
DYNAMIC CHARACTERISTICS
USB Turn-ON Time, tON
5
FN6627.4
June 10, 2010
ISL54209
Electrical Specifications - 2.7V to 3.6V Supply
Test Conditions: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V,
VINL = VCTRLL = 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C. (Continued)
PARAMETER
TEST CONDITIONS
TEMP
MIN
(°C) (Notes 12, 13)
TYP
MAX
(Notes 12, 13) UNITS
Skew, tSKEW
VDD = 3.0V, IN = 3V, CTRL = 3V, RL = 45,
CL = 10pF,tR = tF = 720ps at 480Mbps,
(Duty Cycle = 50%) (Figure 7)
25
-
50
-
ps
Total Jitter, tJ
VDD =3.0V, IN = 3V, CTRL = 3V, RL = 50,
CL = 10pF,tR = tF = 750ps at 480Mbps
25
-
210
-
ps
Propagation Delay, tPD
VDD = 3.0V, IN = 3V, CTRL = 3V, RL = 45,
CL = 10pFFigure 7)
25
-
250
-
ps
Audio Crosstalk
R to COM-, L to COM+
VDD = 3.0V, IN = 0V, CTRL = 3.0V,
RL = 32, f = 20Hz to 20kHz, VR or
VL = 0.707VRMS (2VP-P) (Figure 6)
25
-
-110
-
dB
Crosstalk
(Audio to USB, USB to
Audio)
VDD = 3.0V, RL = 50, f = 100kHz
(Figure 6)
25
-
-95
-
dB
OFF-Isolation
VDD = 3.0V, RL = 50, f = 100kHz
25
-
95
-
dB
OFF-Isolation
VDD = 3.0V, RL = 32, f = 20Hz to 20kHz
25
-
114
-
dB
Total Harmonic Distortion f = 20Hz to 20kHz, VDD = 3.0V, IN = 0V,
CTRL = 3.0V, VL or VR = 180mVRMS
(509mVP-P), RL = 32
25
-
0.013
-
%
Total Harmonic Distortion f = 20Hz to 20kHz, VDD = 3.0V, IN = 0V,
CTRL = 3.0V, VL or VR = 0.707VRMS (2VP-P),
RL = 32
25
-
0.06
-
%
USB Switch -3dB
Bandwidth
Signal = 0dBm, 0.2VDC offset, RL = 50,CL
= 5pF
25
-
736
-
MHz
D+/D- OFF-Capacitance, f = 1MHz, VDD = 3.0V, IN = 0V, CTRL = 3.0V,
VD- or VD+ = VCOMx = 0V (Figure 5)
CDxOFF
25
-
3
-
pF
L/R OFF-Capacitance,
CLOFF, CROFF
f = 1MHz, VDD = 3.0V, IN = 3.0V, CTRL = 0V
or 3V, VL or VR = VCOMx = 0V (Figure 5)
25
-
5
-
pF
COM ON-Capacitance,
CCOMx(ON)
f = 1MHz, VDD = 3.0V, IN = 3.0V, CTRL = 0V
or 3V, VD- or VD+ = VCOMx = 0V (Figure 5)
25
-
8
-
pF
Power Supply Range,
VDD
Full
2.5
5.0
V
Positive Supply Current, VDD = 3.6V, IN = 0V or 3.6V, CTRL = 3.6V
IDD
25
-
7
13
µA
Full
-
-
15
µA
25
-
1
10
nA
Full
-
-
150
nA
25
-
7
-
µA
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, VDD = 3.6V, IN = 0V, CTRL = 0V or float
IDD (Low Power State)
Power OFF-Current, IDx
ICOMx
VDD = 0V, VDx = VCOMx = 5.25V, IN = CTRL
= Float
DIGITAL INPUT CHARACTERISTICS
Voltage Low, VINL,
VCTRLL
VDD = 2.7V to 3.6V
Full
-
-
0.5
V
Voltage High, VINH,
VCTRLH
VDD = 2.7V to 3.6V
Full
1.4
-
-
V
6
FN6627.4
June 10, 2010
ISL54209
Electrical Specifications - 2.7V to 3.6V Supply
Test Conditions: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V,
VINL = VCTRLL = 0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range,
-40°C to +85°C. (Continued)
TEMP
MIN
(°C) (Notes 12, 13)
TEST CONDITIONS
Input Current, IINL,
ICTRLL
VDD = 3.6V, IN = 0V, CTRL = 0V
Full
-50
20
50
nA
Input Current, IINH
VDD = 3.6V, IN = 3.6, CTRL = 0V
Full
-2
0.9
2
µA
Input Current, ICTRLH
VDD = 3.6V, IN = 0V, CTRL = 3.6V
Full
-2
0.9
2
µA
CTRL Pull-Down Resistor, VDD = 3.6V, IN = 0V, CTRL = 3.6V; measure
RCTRL
current through the internal pull-down
resistor and calculate resistance value.
Full
-
4
-
M
IN Pull-Down Resistor,
RIN
Full
-
4
-
M
VDD = 3.6V, IN = 3.6V, CTRL = 3.6V;
measure current through the internal
pull-down resistor and calculate resistance
value.
TYP
MAX
(Notes 12, 13) UNITS
PARAMETER
NOTES:
11. VLOGIC = Input voltage to perform proper function.
12. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this
data sheet.
13. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested.
14. Flatness is defined as the difference between maximum and minimum value of ON-resistance over the specified analog signal
range.
15. Limits established by characterization and are not production tested.
16. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel
with lowest max rON value, between L and R or between D+ and D-.
7
FN6627.4
June 10, 2010
ISL54209
Test Circuits and Waveforms
VINH
LOGIC
INPUT
50%
VINL
VINPUT
tOFF
SWITCH
INPUT VINPUT
SWITCH
INPUT
CTRL
VOUT
AUDIO OR USB
COMx
IN
VOUT
90%
SWITCH
OUTPUT
C
VDD
tr < 20ns
tf < 20ns
90%
VIN
CL
10pF
RL
50
GND
0V
tON
Logic input waveform is inverted for switches that have the
opposite logic sense.
Repeat test for all switches. CL includes fixture and stray
capacitance.
RL
----------------------V OUT = V
(INPUT) R + r
L
ON
FIGURE 1B. TEST CIRCUIT
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1. SWITCHING TIMES
VDD
VINH
LOGIC
INPUT
C
CTRL
VINL
D- OR D+
VINPUT
SWITCH
OUTPUT
VOUT
0V
GND
VIN
tD
FIGURE 2A. MEASUREMENT POINTS
CL
10pF
RL
50
IN
90%
VOUT
COMx
L OR R
Repeat test for all switches. CL includes fixture and stray
capacitance.
FIGURE 2B. TEST CIRCUIT
FIGURE 2. BREAK-BEFORE-MAKE TIME
VDD
VDD
C
C
rON = V1/40mA
rON = V1/40mA
CTRL
CTRL
D- OR D+
L OR R
VL OR VR
VD- OR VD+
IN 0V OR FLOAT
V1
40mA
40mA
COMx
IN
V1
VDD
COMx
GND
GND
Repeat test for all switches.
Repeat test for all switches.
FIGURE 3. AUDIO rON TEST CIRCUIT
8
FIGURE 4. USB rON TEST CIRCUIT
FN6627.4
June 10, 2010
ISL54209
Test Circuits and Waveforms (Continued)
VDD
VDD
C
CTRL
C
CTRL
AUDIO OR USB
SIGNAL
GENERATOR
L OR R
IN
IMPEDANCE
ANALYZER
32
COMx
IN
0V OR VDD
0V
COMx
GND
R OR L
COMx
ANALYZER
RL
Repeat test for all switches.
NC
GND
Signal direction through switch is reversed, worst case values
are recorded. Repeat test for all switches.
FIGURE 5. CAPACITANCE TEST CIRCUIT
FIGURE 6. AUDIO CROSSTALK TEST CIRCUIT
VDD
C
tri
CTRL
90%
DIN+
DIN-
10%
50%
tskew_i
90%
VDD
DIN+
IN
15.8
COM+
143
50%
10%
DIN-
tfi
tro
15.8
OUT+
D+
CL
COM-
OUT-
DCL
143
45
45
90%
OUT+
OUT-
10%
GND
50%
tskew_o
50%
90%
tf0
10%
|tro - tri| Delay Due to Switch for Rising Input and Rising Output Signals.
|tfo - tfi| Delay Due to Switch for Falling Input and Falling Output Signals.
|tskew_0| Change in Skew through the Switch for Output Signals.
|tskew_i| Change in Skew through the Switch for Input Signals.
FIGURE 7A. MEASUREMENT POINTS
FIGURE 7B. TEST CIRCUIT
FIGURE 7. SKEW TEST
9
FN6627.4
June 10, 2010
ISL54209
Typical Application Block Diagrams
3.3V
VDD
ISL54209
USB/HEADPHONE JACK
IN
LOGIC CONTROL
VBUS
4M
CTRL
µCONTROLLER
4M
D-
COM -
D+
USB
HIGH-SPEED
TRANSCEIVER
COM +
L
AUDIO
CODEC
R
50k
50k
GND
FIGURE 8. LOGIC CONTROL VIA MICRO-PROCESSOR
3.3V
VDD
ISL54209
USB/HEADPHONE JACK
IN
LOGIC CONTROL
VBUS
500k
4M
CTRL
µCONTROLLER
4M
D-
COM -
D+
USB
HIGH-SPEED
TRANSCEIVER
COM +
L
R
50k
AUDIO
CODEC
50k
GND
FIGURE 9. LOGIC CONTROL VIA VBUS VOLTAGE FROM COMPUTER OR USB HUB
10
FN6627.4
June 10, 2010
ISL54209
Detailed Description
The ISL54209 device is a dual single pole/double throw
(SPDT) analog switch that operates from a single DC
power supply in the range of 2.5V to 5.0V. It was
designed to function as a dual 2 to 1 multiplexer to select
between USB differential data signals and audio L and R
stereo signals. It comes in tiny µTQFN and TDFN
packages for use in MP3 players, PDAs, cellular phones
and other personal media players.
The part consists of two 2.5 audio switches and two 5
USB switches. The audio switches can accept signals that
swing below ground. They were designed to pass audio
left and right stereo signals, that are ground referenced,
with minimal distortion. The USB switches were designed
to pass high-speed USB differential data signals with
minimal edge and phase distortion.
The ISL54209 was specifically designed for MP3 players,
personal media players and cellular phone applications
that need to combine the audio headphone jack and the
USB data connector into a single shared connector,
thereby saving space and component cost. “Typical
Application Block Diagrams” on page 10 of this
functionality are shown in Figures 8 and 9.
The ISL54209 has a single logic control pin (IN) that
selects between the audio switches and the USB
switches. This pin can be driven Low or High to switch
between the audio CODEC drivers and USB transceiver of
the MP3 player or cellular phone. The ISL54209 also
contains a logic control pin (CTRL) that when driven Low
while IN is Low, opens all switches and puts the part into
a low power state, drawing typically 1nA of IDD current.
Detailed descriptions of the two types of switches are
provided in the following sections.
Audio Switches
The two audio switches (L, R) are 2.5 switches that can
pass signals that swing below ground by as much as
1.5V. They were designed to pass ground reference
stereo signals with minimal insertion loss and very low
distortion over a ±1V signal range.
Crosstalk between the audio channels is -110dB over the
audio band. Crosstalk between the audio channel and
USB channel is -95dB at 100kHz. These switches have
excellent OFF-isolation, 114dB, over the audio band with
a 32 load.
Over a signal range of ±1V (0.707VRMS) with
VDD > 2.7V, these switches have an extremely low rON
resistance variation. They can pass ground referenced
audio signals with very low distortion (<0.06% THD+N)
when delivering 15.6mW into a 32headphone speaker
load. See Figures 10 and 11.
These switches are bi-directional switches. In typical
applications, the audio drivers would be connected at the
L and R side of the switch and the speaker loads would
be connected at the COM side of the switch.
11
The audio switches are active (turned ON) whenever the
IN voltage is  0.5V or floating and the CTRL voltage to
1.4V.
USB Switches
The two USB switches (D+, D-) are bidirectional switches
that can pass rail-to-rail signals. When powered with a
3.3V supply, these switches have a nominal rON of 5
over the signal range of 0V to 400mV with a rON flatness
of 0.45. The rON matching between the D+ and Dswitches over this signal range is only 0.05 ensuring
minimal impact by the switches to USB high speed signal
transitions. As the signal level increases, the rON
resistance increases. At a signal level of 3.3V, the switch
resistance is nominally 25.
The USB switches were specifically designed to pass USB
2.0 high-speed (480Mbps) differential signals typically in
the range of 0V to 400mV. They have low capacitance
and high bandwidth to pass the USB high-speed signals
with minimum edge and phase distortion to meet USB
2.0 high speed signal quality specifications. See
Figure 12.
The USB switches can also pass USB full-speed signals
(12Mbps) with minimal distortion and meet all the USB
requirements for USB 2.0 full-speed signaling. See
Figure 13 for Full-speed Eye Pattern taken with switch in
the signal path.
The USB switches are active (turned ON) whenever the
IN voltage is  to 1.4V.
COM+, COM-, 1D-, 1D+, 2D-, AND 2D+ ARE
OVERVOLTAGE TOLERANT UP TO 5.5V AND
DOWN TO -1.5V
For normal operation, the signal range for the USB
switches is from -1V to VDD. During normal operation,
the signal voltage at D- and D+ should not be allowed
to exceed the VDD voltage rail or go below ground by
more than -1.0V. However, the ISL54209, with a VDD
supply voltage in the range of 0V to 5.0V, can
withstand an overvoltage of up to 5.5V or down to
-1.5V applied at its COM pins (COM-, COM+) and/or
USB signal pins (1D-, 1D+, 2D-, 2D+) without
damage. In this overvoltage condition, the part draws
<1mA of current and causes no stress to the IC.
Note: When in the overvoltage state, the fault voltage
at a COM pin will pass thru the USB switch to the signal
side of the switch, so the media player’s USB
transceiver must have protection circuitry to protect it
from damage.
ISL54209 Operation
The following will discuss using the ISL54209 in the
“Typical Application Block Diagrams” on page 10 shown
in Figures 8 and 9.
VDD SUPPLY
The DC power supply connected at VDD pin provides the
required bias voltage for proper switch operation. The
FN6627.4
June 10, 2010
ISL54209
part can operate with a supply voltage in the range of
2.5V to 5.0V.
and will drive the IN pin low and put the part back into
the Audio or Low Power Mode.
In a typical USB/Audio application for portable battery
powered devices, the VDD voltage will come from a
battery or an LDO and be in the range of 2.7V to 3.6V.
For best possible USB full-speed operation (12Mbps), it is
recommended that the VDD voltage be 2.5V in order to
get a USB data signal level above 2.5V.
Low Power Mode
LOGIC CONTROL
The state of the ISL54209 device is determined by the
voltage at the IN pin and the CTRL pin. These logic pins
are 1.8V logic compatible when VDD is in the range of
2.7V to 3.6V and can be controlled by a standard
microprocessor. The part has three states or modes of
operation. The Audio Mode, USB Mode and the Low
Power Mode. Refer to the “Truth Table” on page 2.
The IN and CTRL pins are internally pulled low through a
4Mresistor to ground and can be left floating or
tri-stated by the microprocessor. The CTRL control pin is
only active when IN is logic “0”.
Logic control voltage levels:
IN = Logic “0” (Low) when VIN 0.5V or Floating.
IN = Logic “1” (High) when VIN 1.4V
CTRL = Logic “0” (Low) when 0.5V or Floating.
CTRL = Logic “1” (High) when 1.4V
Audio Mode
If the IN pin = Logic “0” and CTRL pin = Logic “1”, the
part will be in the Audio mode. In Audio mode, the L
(left) and R (right) 2.5 audio switches are ON and the
D- and D+ 5 switches are OFF (high impedance).
When nothing is plugged into the common connector or a
headphone is plugged into the common connector, the
µprocessor will sense that there is no voltage at the VBUS
pin of the connector and will drive and hold the IN control
pin of the ISL54209 low. As long as CTRL = Logic “1,” the
ISL54209 part will be in the audio mode and the audio
drivers of the media player can drive the headphones
and play music.
USB Mode
If the IN pin = Logic “1” and the CTRL pin = Logic “0” or
Logic “1”, the part will go into USB mode. In USB mode,
the D- and D+ 5 switches are ON and the L and R 2.5
audio switches are OFF (high impedance).
When a USB cable from a computer or USB hub is
connected at the common connector, the µprocessor will
sense the presence of the 5V VBUS and drive the IN pin
voltage high. The ISL54209 part will go into the USB
mode. In USB mode, the computer or USB hub
transceiver and the MP3 player or cell phone USB
transceiver are connected and digital data will be able to
be transmitted back and forth.
If the IN pin = Logic “0” and CTRL pin = Logic “0”, the
part will be in the Low Power mode. In the Low Power
mode, the audio switches and the USB switches are OFF.
In this state, the device draws typically 1nA of current.
In Low Power mode, the OFF-isolation and crosstalk
between switch cells is minimal for negative swinging
signals. Care should be taken to avoid negative swinging
signals in this mode of operation. In typical applications,
the Low Power state will be applied to the ISL54209 part
when the portable media player is in its sleep or
hibernate mode to conserve battery power. In the sleep
mode, no audio or USB signals are applied to the part.
USING THE COMPUTER VBUS VOLTAGE TO DRIVE
THE “IN” PIN
Rather than using a microprocessor to control the IN
logic pin, one can directly drive the IN pin using the 5V
VBUS voltage from the computer or USB hub. See
Figure 9 “Typical Application Block Diagrams” on
page 10.
When a headphone or nothing is connected at the
common connector, the internal 4M pull-down will pull
the IN pin low, putting the ISL54209 in the Audio or Low
Power mode, depending on the condition of the CTRL pin.
When a USB cable is connected at the common
connector, the voltage at the IN pin will be driven to 5V
and the part will automatically go into the USB mode.
When the USB cable is disconnected from the common
connector, the voltage at the IN pin will be pulled low by
the pull-down resistor and return to the Audio or Low
Power mode, depending on the condition of the CTRL pin.
Note: The ISL54209 contains an internal diode between
the IN pin and VDD pin. Whenever the IN voltage is
greater than the VDD voltage by more than 0.7V, current
will flow through this diode into the VDD power supply
bus. An external series resistor in the range of 100k to
500k is required at the IN logic pin to limit the current
when driving it with the VBUS voltage. This allows the
VBUS voltage from a computer or USB hub (4.4V to
5.25V) to drive the IN pin while the VDD voltage is in the
range of 2.5V to 3.6V. A 500k resistor will limit the
current to 2.76µA and still allow the IN logic voltage to go
to around 3.67V, which is will above the required VINH
level of 1.4V. A smaller series resistor can be used but
more current will flow.
When the USB cable is disconnected, the µprocessor will
sense that the 5V VBUS voltage is no longer connected
12
FN6627.4
June 10, 2010
ISL54209
Typical Performance Curves
TA = +25°C, Unless Otherwise Specified.
0.11
0.10
0.10
RLOAD = 32
VLOAD = 0.707VRMS
0.08
0.08
THD+N (%)
THD+N (%)
0.09
0.07
VDD = 2.6V
0.06
0.05
0.04
20
RLOAD = 32
VDD = 3V
VDD = 2.7V
VDD = 3.6V
0.06
2VP-P
1VP-P
0.02
20
200
2k
FREQUENCY (Hz)
20k
FIGURE 11. THD+N vs SIGNAL LEVELS vs FREQUENCY
VOLTAGE SCALE (0.1V/DIV)
FIGURE 10. THD+N vs SUPPLY VOLTAGE vs
FREQUENCY
20k
2.5VP-P
0.04
VDD = 3V
200
2k
FREQUENCY (Hz)
3VP-P
TIME SCALE (0.2ns/DIV)
FIGURE 12. EYE PATTERN: 480Mbps WITH USB SWITCHES IN THE SIGNAL PATH
13
FN6627.4
June 10, 2010
ISL54209
Typical Performance Curves
TA = +25°C, Unless Otherwise Specified. (Continued)
VOLTAGE SCALE (0.5V/DIV.)
VDD = 3.3V
TIME SCALE (10ns/DIV)
FIGURE 13. EYE PATTERN: 12Mbps USB SIGNAL WITH USB SWITCHES IN THE SIGNAL PATH
1
-20
-1
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
0
USB SWITCH
0
-2
-3
-4
RL = 50
10M
100M
FREQUENCY (Hz)
FIGURE 14. FREQUENCY RESPONSE
14
VDCOFFSET = 1.5VDC
-40
-60
-80
-100
VSIGNAL = 0.2VP-P TO 2VP-P
1M
RL = 50
VSIGNAL = 0.2VP-P TO 2VP-P
1G
-120
0.001M
0.01M
0.1M
1M
10M
FREQUENCY (Hz)
100M 500M
FIGURE 15. OFF-ISOLATION USB SWITCHES
FN6627.4
June 10, 2010
ISL54209
Typical Performance Curves
TA = +25°C, Unless Otherwise Specified. (Continued)
NORMALIZED GAIN (dB)
0
-20
RL = 50
VSIGNAL = 0.2VP-P TO 2VP-P
Die Characteristics
SUBSTRATE AND TDFN THERMAL PAD
POTENTIAL (POWERED UP):
-40
GND
-60
TRANSISTOR COUNT:
-80
98
PROCESS:
-100
Submicron CMOS
-120
0.001M 0.01M
0.1M
1M
10M
100M 500M
FREQUENCY (Hz)
FIGURE 16. OFF-ISOLATION AUDIO SWITCHES
15
FN6627.4
June 10, 2010
ISL54209
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE
REVISION
CHANGE
3/8/10
FN6627.4
Made correction to Tjc in Thermal information and corresponding notes as follows: 2.1x1.6
uTQFN package from “48.3” to “100” and 1.8x1.4 uTQFN package from “61.9” to “105”. Added
note that is "not direct attach" for both uTQFN packages.
Added Latchup to Abs Max Ratings.
Updated POD L10.2.1X1.6A to most recent rev. Changes were to convert to new format by
moving dimensions from table onto drawing (no dimension changes)
Updated POD L10.3X3A to most recent rev. Changes were to convert to new format by moving
dimensions from table onto drawing (no dimension changes)
11/24/09
FN6627.3
Added 10 Ld 1.8x1.4 µTQFN option
Added MSL note to Ordering Information
Added “Boldface limits apply...” to common conditions of Electrical Specifications table. Bolded
full temperature specs in spec table.
Added Revision History and Products section
Added L10.1.8x1.4A package outline drawing
Under thermal information for the 2.1 x 1.6 µTQFN & the 1.8 x 1.4 µTQFN, added new boiler
plate note for theta JC indicating measurement taken at center of top of package. Moved
Note 8 down to 3x3 TDFN.
7/1/08
FN6627.2
Added eval part # to ordering info and updated ESD HBM rating.
Applied Intersil standards: Updated pb-free Note 2 to match format, updated over-temp note
4/3/08
FN6627.1
-P2, added Note 3 to order info per Mark Kwoka's new verbiage based on lead finish. Update
cross refs accordingly
-P3, changed ESD and added apps info for the VBUS control
-P5, Note 10 revised to: "Parts are 100% tested at +25°C. Temperature limits established by
characterization and are not production tested." from "Parts are 100% tested at +25°C. Overtemperature limits established by characterization and are not production tested."
12/20/07
FN6627.0
Initial Release
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The
Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com: ISL54209
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
16
FN6627.4
June 10, 2010
ISL54209
Package Outline Drawing
L10.1.8x1.4A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 5, 3/10
1.80
B
6
PIN #1 ID
A
1
1
1.40
3
10
0.50
6 PIN 1
INDEX AREA
9 X 0.40
2
10X 0.20 4
0.10 M C A B
0.05 M C
0.70
8
5
0.10
7
2X
4X 0.30
6
6X 0.40
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
MAX. 0.55
C
SEATING PLANE
0.08 C
(9 X 0.60)
1
(10X 0.20)
(4X 0.30)
3
10
8
(0.70)
SIDE VIEW
(0.70)
C
5
6
0 .1 27 REF
7
(6X 0.40)
PACKAGE OUTLINE
0-0.05
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
JEDEC reference MO-255.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
17
FN6627.4
June 10, 2010
ISL54209
Package Outline Drawing
L10.2.1x1.6A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 5, 3/10
8.
PIN 1
INDEX AREA
2.10
A
B
PIN #1 ID
1
0.05 MIN.
1
8.
4
4X 0.20 MIN.
1.60
0.10 MIN.
10
5
0.80
10X 0.40
0.10
6
9
2X
6X 0.50
10 X 0.20 4
TOP VIEW
0.10 M C A B
M C
BOTTOM VIEW
(10 X 0.20)
SEE DETAIL "X"
(0.05 MIN)
PACKAGE
OUTLINE
1
MAX. 0.55
0.10 C
(10X 0.60)
C
(0.10 MIN.)
(2.00)
SEATING PLANE
0.08 C
SIDE VIEW
(0.80)
(1.30)
C
0 . 125 REF
(6X 0.50 )
(2.50)
0-0.05
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
18
1.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2.
All Dimensions are in millimeters. Angles are in degrees.
Dimensions in ( ) for Reference Only.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Lead width dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Maximum package warpage is 0.05mm.
6.
Maximum allowable burrs is 0.076mm in all directions.
7.
Same as JEDEC MO-255UABD except:
No lead-pull-back, MIN. Package thickness = 0.45 not 0.50mm
Lead Length dim. = 0.45mm max. not 0.42mm.
8.
The configuration of the pin #1 identifier is optional, but must be located within
the zone indicated. The pin #1 identifier may be either a mold or mark feature.
FN6627.4
June 10, 2010
ISL54209
Package Outline Drawing
L10.3x3A
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 5, 3/10
3.00
A
2.0 REF
6
PIN 1
INDEX AREA
B
8X 0.50 BSC
5
1
6
PIN 1
INDEX AREA
10X 0 . 30
3.00
1.50
0.15
(4X)
10
0.10 M C A B
0.05 M C
5
4 10 X 0.25
TOP VIEW
2.30
( 2.30 )
BOTTOM VIEW
0 .80 MAX
SEE DETAIL "X"
0.10 C
C
(2.90)
SEATING PLANE
0.08 C
(1.50)
SIDE VIEW
(10 X 0.50)
0 . 2 REF
5
C
( 8X 0 .50 )
( 10X 0.25 )
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
Angular ±2.50°
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7.
19
Compliant to JEDEC MO-229-WEED-3 except exposed pad length (2.30mm).
FN6627.4
June 10, 2010
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