DATASHEET

ISL54409, ISL54410
Features
The Intersil ISL54409 and ISL54410 are Dual SPST
(Single Pole/Single Throw) switches that provide a very
low distortion audio path for a stereo headphone and
can be connected in a wired-OR configuration at the
switch outputs with USB2.0 HS signals for Audio/USB
signal multiplexing to a common connector. The audio
switch path can be disabled to provide high signal
isolation, preventing crosstalk between the audio codec
and USB data signals.
• Single Supply Operation (VDD) . . . +2.7V to +5.0V
The ISL54409 and ISL54410 analog switches are
negative swing capable with a single supply voltage and
maintain excellent THD performance within a signal
range of -1V to +1V. The switch terminals have low pin
capacitance (4pF typical), minimizing impact to USB 2.0
High-Speed signals. The ISL54409 offers a Low Power
Shutdown mode while the ISL54410 offers a High
Off-Isolation mode. The ISL54410 contains active Audio
Click and Pop Elimination circuitry for AC-coupled audio
signals.
• Low Power Shutdown Mode (ISL54409)
The ISL54409 and ISL54410 are available in a 8 Ld
TDFN (2mmx2mm) or a 10 Ld µTQFN (1.8mmx1.4mm)
package. They operate over a temperature range of
-40 to +85°C.
Typical Application
• Negative Signal Handling (See “Audio/USB wired-OR
Application” on page 8 on protecting USB controller)
• Low OFF Capacitance for HS USB . . . . . . . . . . 4pF
• Power Off Protection
• THD+N at 1mW into 32Ω Load . . . . . . . . <0.02%
• Audio Muting . . . . . . . . . . . . . . . . . . . . .>110dB
• Low Power Consumption. . . . 21µW with 3V supply
• Active Click and Pop Elimination Circuitry (ISL54410)
• USB VBUS Hot Plug Operation
• Available in 8 Ld TDFN (2mmx2mm) or 10 Ld µTQFN
(1.8mmx1.4mm) Package
Applications*(see page 11)
• Consumer Entertainment Systems
• MP3 and other Personal Media Players
• Cellular/Mobile Phones and PDAs
Related Literature*(see page 11)
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
USB2.0 HS Eye Diagram
USB
CONTROLLER
µCONTROLLER
ISL54409
ISL54410
COMMON
CONNECTOR
LOGIC
CONTROL
January 14, 2010
FN6983.1
CTRL
IN
COM+
RIN
COM-
LIN
AUDIO
CODEC
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2009, 2010. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL54409, ISL54410
Audio/USB 2.0 Wired-OR Switch with Click and
Pop Reduction
ISL54409, ISL54410
Application Block Diagrams
0.1µF
3.3V
USB
CONTROLLER
VDD
CTRL
LOGIC CONTROL
D+
IN
4MΩ
D-
4MΩ
COM-
LEFT
SPEAKER
LIN
50kΩ
COM+
RIGHT
SPEAKER
USB
CONTROLLER
0.1µF
VDD
CTRL
LOGIC CONTROL
D-
4MΩ
LIN
200kΩ
COM+
GND
220µF
AUDIO
CODEC
CLICK AND
POP SHUNT
RIN
200kΩ
LOGIC
CONTROLLER
IN
4MΩ
COM-
RIGHT
SPEAKER
AUDIO
CODEC
220µF
50kΩ
GND
3.3V
LEFT
SPEAKER
220µF
RIN
ISL54409
D+
LOGIC
CONTROLLER
220µF
ISL54410
TABLE 1. ISL54409, ISL54410 FEATURES
PART
NUMBER
ANALOG SIGNAL
RANGE
PACKAGE
LOW POWER
MODE
CLICK AND POP
ELIMINATION
VBUS HOT PLUG
OPERATION
ISL54409
-1 TO +1V
8 Ld TDFN, 10 Ld µTQFN
Yes
No
Yes
ISL54410
-1 TO +1V
8 Ld TDFN, 10 Ld µTQFN
No
Yes
Yes
2
FN6983.1
January 14, 2010
ISL54409, ISL54410
Pin Configurations
(Note 1)
ISL54409, ISL54410
(8 Ld 2x2 TDFN)
TOP VIEW
ISL54409, ISL54410
(10 Ld 1.8x1.4 µTQFN)
TOP VIEW
IN
VDD
CTRL
NC
10
9
8
7
NC
6
LIN
LOGIC
CONTROL
2
8
CTRL
7
LIN
4MΩ
4MΩ
4MΩ
2
3
COM+
1
IN
LOGIC
CONTROL
1
4MΩ
COM-
VDD
4
5
GND
RIN
COM-
3
6
RIN
COM+
4
5
GND
NOTE:
1. Switches shown with IN = 0 and CTRL = 1.
Pin Descriptions
ISL54409 and ISL54410
TDFN
µTQFN
NAME
FUNCTION
1
10
VDD
2
1
IN
3
2
COM-
Audio Left Output
4
3
COM+
Audio Right Output
5
4
GND
IC Ground Connection
6
5
RIN
Audio Right Input
7
6
LIN
Audio Left Input
-
7
NC
Not Connected
-
8
NC
Not Connected
8
9
CTRL
PD
-
Pad
Power Supply
Logic Control; Internal 4MΩ pull down
Logic Control; Internal 4MΩ pull-down
Thermal Pad; Connect to GND Plane
Truth Tables
ISL54409
IN
CTRL
COM-/COM+
0
0
OFF
0
1
ON
1
X
OFF
ISL54410
MODE
IN
CTRL
COM-/COM+
0
0
OFF
Click and Pop
Audio
0
1
ON
Audio
Mute
1
X
OFF
Mute
Low Power
CTRL and IN: Logic “0” when ≤ 0.5V, Logic “1” when ≥ 1.4V
3
MODE
CTRL and IN: Logic “0” when ≤ 0.5V, Logic “1” when ≥ 1.4V
FN6983.1
January 14, 2010
ISL54409, ISL54410
Ordering Information
PART NUMBER
(Note 2)
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
Tape & Reel
(Pb-Free)
PKG.
DWG. #
ISL54409IRTZ-T (Note 3)
409
-40 to +85
8 Ld 2x2 TDFN
L8.2x2C
ISL54409IRUZ-T (Note 4)
U2
-40 to +85
10 Ld 1.8x1.4 µTQFN
L10.1.8x1.4A
ISL54410IRTZ-T (Note 3)
410
-40 to +85
8 Ld 2x2 TDFN
L8.2x2C
ISL54410IRUZ-T (Note 4)
U3
-40 to +85
10 Ld 1.8x1.4 µTQFN
L10.1.8x1.4A
ISL54409EVAL1Z
Evaluation Board
NOTES:
2. Please refer to TB347 for details on reel specifications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach
materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
5. For Moisture Sensitivity Level (MSL), please see device information page for ISL54409, ISL54410. For more information on
MSL please see techbrief TB363.
4
FN6983.1
January 14, 2010
ISL54409, ISL54410
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
Input Voltages
LIN, RIN (Note 6) . . . . . . . . . . . . . -2V to ((VDD) + 0.3V)
IN, CTRL (Note 6). . . . . . . . . . . . -0.3V to ((VDD) + 0.3V)
Output Voltages
COM-, COM+ (Note 6) . . . . . . . . . . . -2V to ((VDD) + 0.3V)
Continuous Current (LIN, RIN) . . . . . . . . . . . . . . . . ±150mA
Peak Current (LIN, RIN)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . ±300mA
ESD Ratings:
Human Body Model
ISL54409. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5kV
ISL54410. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6kV
Machine Model
ISL54409. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250V
ISL54410. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . 2kV
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
1.8x1.4mm µTQFN (Notes 7, 8) . . .
160
61.9
2mmx2mm TDFN (Notes 7, 8) . . . .
84
10
Maximum Junction Temperature (Plastic Package). . . +150°C
Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature. . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
6. Signals on LIN, RIN, COM-, COM+, IN and CTRL exceeding VDD or GND by specified amount are clamped. Limit current to
maximum current ratings.
7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
8. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VCTRL = 1.4V, VIN = 0.5V,
(Notes 9, 10), Unless Otherwise Specified. Boldface limits apply over
the operating temperature range, -40°C to +85°C.
PARAMETER
TEST CONDITIONS
TEMP
MIN
MAX
(°C) (Notes 10, 11) TYP (Notes 10, 11) UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Input Signal Range, VDD = 3.3V
VANALOG
Full
-1.5
-
1.5
V
ON-Resistance, rON
IXOUT = 40mA, VLIN or VRIN = -0.85V to
0.85V, (See Figure 2, Note 14)
+25
-
2.5
2.8
Ω
Full
-
-
3.8
Ω
IXOUT = 40mA, VLIN or VRIN = -0.85V to
0.85V, (Notes 12, 14)
+25
-
20
60
mΩ
Full
-
-
70
mΩ
IXOUT = 40mA, VLIN or VRIN = Voltage at max
rON over signal range of -0.85V to 0.85V,
(Notes 13, 14)
+25
-
0.1
0.32
Ω
Full
-
-
0.4
Ω
+25
-
40
-
Ω
Full
-
-
-
Ω
rON Flatness, rFLAT(ON)
rON Matching Between
Channels, ΔrON
Active Click and Pop Shunt VCTRL = 0V, VIN = 0V, VLIN or VRIN = -1.5V
Resistance
to 1.5V, ISL54410 only
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
VDD = 2.7V, RL = 50Ω, CL = 10pF
(see Figure 1)
+25
-
5
-
µs
Turn-OFF Time, tOFF
VDD = 2.7V, RL = 50Ω, CL = 10pF
(see Figure 1)
+25
-
45
-
ns
OFF-Isolation
VIN = 3V, VLIN or VRIN = 0.707VRMS,
RL = 32Ω, f = 20Hz to 20kHz (see Figure 3)
+25
-
110
-
dB
Crosstalk
RIN to LOUT, LIN to ROUT
VCTRL = 3.0V, VIN = 0V, RL = 32Ω, f = 20Hz
to 20kHz, VLIN or VRIN = 0.707VRMS (2VP-P),
(See Figure 4)
+25
-
-90
-
dB
5
FN6983.1
January 14, 2010
ISL54409, ISL54410
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VCTRL = 1.4V, VIN = 0.5V,
(Notes 9, 10), Unless Otherwise Specified. Boldface limits apply over
the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
Total Harmonic Distortion
TEST CONDITIONS
f = 20Hz to 20kHz, VCTRL = 3.0V, VIN = 0V,
VLIN or VRIN = 0.36VRMS (1VP-P), RL = 32Ω
TEMP
MIN
MAX
(°C) (Notes 10, 11) TYP (Notes 10, 11) UNITS
+25
-
0.03
-
%
+25
f = 20Hz to 20kHz, VCTRL= 3.0V, VIN = 0V,
VLIN or VRIN = 0.707VRMS (2VP-P), RL = 32Ω
-
0.06
-
%
f = 240MHz, VCTRL = 0V, VIN = 3V, VLIN or
VRIN = 0V
+25
-
5
-
pF
f = 240MHz, VCTRL = 0V, VIN = 0V, VLIN or
VRIN = 0V
+25
-
4
-
pF
Power Supply Range, VDD
Full
2.7
3.6
V
Audio Mode Supply Current, VDD = 3.6V
IDD
+25
-
7
13
µA
Full
-
-
15
µA
Shutdown Current, ISHDN
VDD = 3.6V, VCTRL = 0.5V, VIN = 0.5V;
ISL54409
+25
-
1
10
nA
Full
-
-
150
nA
VDD = 3.6V, VCTRL = 0.5V, VIN = 0.5V;
ISL54410
+25
-
2.4
4
µA
Full
-
-
5
µA
VDD = 0V, VCTRL = VIN = Float, VLIN/RIN =
VCOM-/COM+ = 5.25V,
+25
-
7
-
µA
Logic Voltage Low, VLogic_L VDD = 2.7V to 3.6V
Full
-
-
0.5
V
Logic Voltage High, VLogic_H VDD = 2.7V to 3.6V
Full
1.4
-
-
V
Logic Input Low Current,
ILogic_L
VDD = 3.6V, VLogic = 0V
Full
-50
20
50
nA
Logic Input High Current,
ILogic_H
VDD = 3.6V, VLogic = 3.6V
Full
-2
1
2
µA
Logic Pull-Down Resistor,
RLogic
VDD = 3.6V, VLogic = 3.6V
Full
-
4
-
MΩ
COM-, COM+ OFF
Capacitance, COFF
POWER SUPPLY CHARACTERISTICS
Power OFF-Current,
IRIN/LIN or ICOM-/COM+
DIGITAL INPUT CHARACTERISTICS
NOTES:
9. VLogic = Logic input voltage to perform proper function.
10. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this
data sheet.
11. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested.
12. Flatness is defined as the difference between maximum and minimum value of ON-resistance over the specified analog signal
range.
13. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with
lowest max rON value.
14. Limits established by characterization and are not production tested.
6
FN6983.1
January 14, 2010
ISL54409, ISL54410
Test Circuits and Waveforms
VCTRL
LOGIC
INPUT
VCTRL
tr < 20ns
tf < 20ns
50%
tOFF
SWITCH
INPUT VINPUT
VDD
IN
VCOM-/COM+
VLIN/RIN
VOUT
90%
SWITCH
OUTPUT
0.1µF
VDD
CTRL
90%
VCTRL
0V
CL
10pF
RL
50Ω
GND
tON
*CL includes board capacitance
FIGURE 1B. TEST CIRCUIT
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1. SWITCHING TIMES
Repeat test for all switches.
rON = V1/40mA
VDD
0.1µF
VDD
IN
VDD
IN
VDD
LIN OR RIN
VIN
CTRL
V1
40mA
LIN OR RIN
0.1µF
COM- OR
COM+
RL
CTRL
COM- OR
COM+
0V OR
FLOAT
GND
GND
FIGURE 2. rON TEST CIRCUIT
FIGURE 3. OFF ISOLATION CIRCUIT
VDD
CTRL
COM- OR
COM+
0V OR
FLOAT
0.1µF
LIN OR
RIN
IN
COM+ OR
COM-
RIN OR
LIN
RL
GND
FIGURE 4. CROSSTALK TEST CIRCUIT
7
FN6983.1
January 14, 2010
ISL54409, ISL54410
Detailed Description
The ISL54409, ISL54410 are +2.7 to +5.0V, Single Pole
Single Throw (SPST) audio switches that are negative
swing capable. The switch outputs (COM-, COM+) have
low OFF capacitance (4pF) that is capable of multiplexing
USB2.0 HS data and audio signals in a wired-OR
configuration for common connector applications (see
“Application Block Diagrams” on page 2). The ISL54409
features a low power shutdown mode while the ISL54410
features audio Click and Pop Elimination circuitry.
The ISL54409, ISL54410 are offered in a 8 Ld
2mmx2mm TDFN or 10 Ld 1.4x1.8mm µTQFN packages.
Power Supply Considerations
The ISL54409, ISL54410 operates on a +2.7V to +5.0V
power supply. A 0.1µF local decoupling capacitor placed
as closed as possible from the VDD pin to GND is highly
recommended for stable operation.
Audio Switches
The ISL54409, ISL54410 switches are designed to have
low THD+N from a signal range of -1V to +1V for audio
applications (see Figures 8 through 11). The
ON-resistance of the audio switches have a typical
resistance of 2.6Ω.
The analog signal range of the audio switches are
capable beyond -1V to +1V however, the ON-resistance
of the switches increases beyond it. The THD+N
performance deteriorates beyond a signal range of -1V to
+1V.
Audio/USB wired-OR Application
The ISL54409, ISL54410 allows the connection of an
audio codec and USB Controller to a common connector.
For audio mode of operation, the switch is closed to pass
low distortion audio from the codec to a headphone.
When the switch is open, USB2.0 HS data (480MBps) can
be transmitted to a host controller with minimal signal
degradation.
Since the USB device is always connected to the COMand COM+ pins on the ISL54409, ISL54410,
considerations must be taken to protect the USB
Controller when passing audio signals through the
switch. The USB2.0 specification requires the USB data
line to sustain a signal of -1V without damage to the
device. Audio signals from the codec may swing below
-1V in some applications. Since the USB Controller is
high impedance when not operating, exceeding -1V may
cause high leakage currents or damage sensitive devices
on the USB device. It is highly recommended to keep the
audio signal range within -1V to +1V.
USB VBUS Hot Plug Operation
The ISL54409, ISL54410 allows the hot plug operation of
the USB VBUS signal to operate the switch. This can be
accomplished by connecting CTRL to VDD at all times.
The VBUS signal from the USB Host is used to drive the
IN logic pin. Note from the “Absolute Maximum Ratings”
on page 5 that the IN pin must be kept below VDD.
8
Exceeding VDD by putting the 5V VBUS signal to the IN
pin will forward bias the ESD diode on the IN pin, which
will draw excessive diode current and result in a
damaged pin on the device. To prevent damage to the IN
pin, it is recommended to place a current limiting series
resistor or use a voltage divider to bring the voltage at
the IN pin below VDD. A 10kΩ series resistor will reduce
current significantly to prevent possible damage to the IN
pin. For further protection, a voltage divider with
RT = 10kΩ will reduce the IN voltage below VDD with no
impact on logic threshold voltages (see Figure 5).
VDD
0.1µF
VBUS = 5V
*RIN
IN
*RT
COM-
CTRL
ISL54409
ISL54410
COM+
*RIN = 10kΩ
*RT = Optional
LIN
RIN
GND
FIGURE 5. USB VBUS HOT PLUG PROTECTION
Low Power Shutdown/Click and Pop Mode
When the CTRL and IN pins are at logic “0”, the ISL54409
and ISL54410 enter into a disabled mode of operation. In
the disabled mode of operation, both switches are turned
OFF. For the ISL54409, the disabled mode is Low Power
Shutdown. The device is brought to a low powered state
and the Icc current is significantly reduced.
*Note: When placed in the Low Power Shutdown state,
the internal charge pumps that generate the negative
supply rails for negative signal swing capability are
turned off to reduce power consumption. With the
internal negative supply rail disabled the ISL54409 will
have poor isolation and crosstalk performance for
negative signal swings on the switch terminals. Negative
voltages will have a low impedance path to the other
switch terminals. It is not recommended to operate the
switch in Low Power Shutdown if the audio codec will
remain active when transmitting USB data on the COMand COM+ pins.
For the ISL54410, the disabled mode is Audio Click and
Pop Elimination. The switch input pins LIN and RIN have
their active Click and Pop circuitry enabled, which turns
on a typical 40Ω shunt resistance from the switch input
pin to GND. Some audio application requires DC biasing
the audio codec above ground for full output signal
swing. The audio signal must have the DC component
removed with a blocking capacitor at the headphone
load. This blocking capacitor is typically the source of
audible click and pop transients when the audio codec
powers up or down with the DC bias. The negative signal
swing capability of the audio switch allows the DC
blocking capacitor to be placed on input side of the
switch, which allows the Click and Pop Elimination
circuitry to discharge the DC blocking capacitor of any
transient currents, eliminating audio clicks and pops.
FN6983.1
January 14, 2010
ISL54409, ISL54410
Typical Performance Curves
TA = +25°C, Unless Otherwise Specified
2.61
4.0
IOUT = 40mA
VDD = 2.7V
3.6
VDD = 3.0V
3.2
+85°C
3.4
2.59
rON (Ω)
rON (Ω)
2.60
3.8
VDD = 3.3V
2.58
IOUT = 40mA
VDD = 3.0V
3.0
2.8
2.6
+25°C
2.4
2.2
VDD = 3.6V
2.57
2.0
1.8
2.56
-1.0 -0.8 -0.6 -0.4 -0.2 0
0.2 0.4
VOUT (V)
0.6 0.8 1.0
VOUT (V)
FIGURE 6. ON-RESISTANCE vs SWITCH VOLTAGE vs
SUPPLY VOLTAGE
0.068
-40°C
1.6
-1.2 -1.0-0.8-0.6-0.4-0.2 0 0.2 0.4 0.6 0.8 1.0 1.2
FIGURE 7. ON-RESISTANCE vs SWITCH VOLTAGE vs
TEMPERATURE
0.10
RLOAD = 32Ω
VLOAD = 0.707VRMS
0.9VRMS
0.066
0.08
0.707VRMS
VDD = 3.3V
THD+N (%)
THD+N (%)
VDD = 3.0V
0.064
VDD = 3.6V
0.062
1.0VRMS
0.060
0.06
0.04
0.35VRMS
0.02
0.058
0.056
20
200
2k
0
20
20k
RLOAD = 32Ω
VDD = 3V
RMS VOLTAGES AT LOAD
200
FIGURE 8. THD+N vs SUPPLY VOLTAGE vs
FREQUENCY
0.20
20k
FIGURE 9. THD+N vs SIGNAL LEVELS vs FREQUENCY
RLOAD = 32Ω
RLOAD = 32Ω
FREQ = 1kHz
VDD = 3V
0.10
FREQ = 1kHz
VDD = 3V
0.08
0.06
THD+N (%)
THD+N (%)
0.10
0.08
2k
FREQUENCY (Hz)
FREQUENCY (Hz)
0.04
0.02
0.06
0.04
0.03
0.02
0.01
0.003
0.12 0.23 0.35 0.47 0.58 0.70 0.82 0.93 1.05 1.16
OUTPUT VOLTAGE (VRMS)
FIGURE 10. THD+N vs OUTPUT VOLTAGE
9
0.01
0.008
1
2
3
4
5 6 7 8 910
20
30
OUTPUT POWER (mW)
FIGURE 11. THD+N vs OUTPUT POWER
FN6983.1
January 14, 2010
ISL54409, ISL54410
Typical Performance Curves
TA = +25°C, Unless Otherwise Specified (Continued)
0
NORMALIZED GAIN (dB)
-40
-1.0
-1.5
-2.0
20
VDD = 3V
RL = 32Ω
VIN = 0.707 VRMS
100 200
500 1k 2k
FREQUENCY (Hz)
-60
-80
-100
-120
-140
-160
10k 20k
RL = 32Ω
VIN = 0.2VP-P TO 2VP-P
20
100 200 500 1k 2k
FREQUENCY (Hz)
5k
10k 20k
FIGURE 13. OFF-ISOLATION
FIGURE 12. INSERTION LOSS
-40
NORMALIZED GAIN (dB)
GAIN (dB)
-0.5
-60
-80
-100
-120
-140
-160
20
RL = 32Ω
VIN = 0.2VP-P TO 2VP-P
100 200
500
1k
2k
5k
10k 20k
FREQUENCY (Hz)
FIGURE 14. CROSSTALK
10
FN6983.1
January 14, 2010
ISL54409, ISL54410
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE
REVISION
CHANGE
1/14/10
FN6983.0
Removed “Coming Soon” from TDFN package options in “Ordering Information” on page 4.
Added “ISL54409EVAL1Z” to “Ordering Information” on page 4.
Updated Package Outline Drawing L10.1.8x1.4A on page 12. Revisions were to move
dimensions from table onto drawing.
9/25/09
FN6983.0
Initial Release.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The
Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com: ISL54409, ISL54410
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
11
FN6983.1
January 14, 2010
ISL54409, ISL54410
Package Outline Drawing
L10.1.8x1.4A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 4, 9/09
(DATUM A)
1.80
A
PIN #1 ID
1
2
0.50
1.40
6
INDEX AREA
2X
B
NX 0.40
NX 0.20 5
10X
0.10 M C A B
0.05 M C
5
0.10 C
1
2X
(DATUM B)
7
2
0.10 C
0.40 BSC
BOTTOM VIEW
TOP VIEW
0.10 C
C
0.5
0.05 C
SEATING PLANE
0.05 MAX
2.20
1.00
0.60
1.00
SIDE VIEW
0.50
1.80
0.40
0.20
0.20
0.40
5
NX (0.20)
CL
(0.05 MAX)
0.127 REF
0.40
e
SECTION "C-C"
TYPICAL RECOMMENDED LAND PATTERN
TERMINAL TIP
C C
10 LAND PATTERN
0.40 BSC
DETAIL "X"
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals. Total 10 leads.
3. Nd and Ne refer to the number of terminals on D (4) and E (6) side,
respectively.
4. All dimensions are in millimeters. Tolerances ±0.05mm unless
otherwise noted. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
12
FN6983.1
January 14, 2010
ISL54409, ISL54410
Package Outline Drawing
L8.2x2C
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) WITH E-PAD
Rev 0, 07/08
2.00
6
PIN #1 INDEX AREA
A
B
6
PIN 1
INDEX AREA
8
1
0.50
2.00
1.45±0.050
Exp.DAP
(4X)
0.15
0.10 M C A B
0.25
( 8x0.30 )
TOP VIEW
0.80±0.050
Exp.DAP
BOTTOM VIEW
( 8x0.20 )
Package Outline
( 8x0.30 )
SEE DETAIL "X"
( 6x0.50 )
1.45
2.00
0.10 C
0 . 75 ( 0 . 80 max)
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
( 8x0.25 )
0.80
2.00
TYPICAL RECOMMENDED LAND PATTERN
C
0 . 2 REF
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
13
FN6983.1
January 14, 2010
Similar pages