SODDB3 SERIES_C1601.pdf

SODDB3/SODDB3T
Taiwan Semiconductor
Small Signal Product
400mW Trigger Diode (DIAC)
FEATURES
- Surface Mount Device SOD-123 packaged
- VBO=32V DB3
- Max. PD=400mW
MECHANICAL DATA
- Case: Plastic gull wing SOD-123 package
- High temperature soldering guaranteed: 260°C/10s
SOD-123
- Weight: 10.55mg (approximately)
- Moisture sensitivity level (MSL): 1
- Pb free and RoHS compliant
APPLICATION
- These diacs are intended for use in thyrisitors phase control, circuits
for lamp dimming, universal motor speed control, and heat control
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
Repetitive Peak on-state Current
tp=20μs, f=100Hz
Power Dissipation
Junction Temperature
Storage Temperature Range
PARAMETER
Reverse Breakdown Voltage
Breakdown Voltage Symmetry
Dynamic Breakdown Voltage
SYMBOL
VALUE
ITRM
2
A
PD
400
mW
TJ
- 40 to +125
°C
TSTG
- 40 to +125
°C
SYMBOL
SODDB3
SODDB3T
SODDB3
SODDB3T
SODDB3
SODDB3T
VBO
MIN
TYP
MAX
28
32
36
30
32
34
[|+VBO1 ||-VBO2 |]
|△V±|
±3
±2
5
9
Repetitive Peak on-state Current
ITRM
2
Output Voltage
VO
5
Leakage Current
IR
-
Rest Time
Breakdown current
tr
SODDB3
SODDB3T
IBO
UNIT
TEST CONDITION
UNIT
C=22nF
V
C=22nF
V
△I=[ IBO to IF=10mA]
V
tP=20μs, f=100Hz
10
V
VB = 0.5VBO
μA
μs
1.5
100
-
A
Note
15
C=22nF
μA
Note: Test circuit for output voltage
Version: C1601
SODDB3/SODDB3T
Taiwan Semiconductor
Small Signal Product
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
Fig. 2 Power derating curve
1.08
200
1.06
150
Power dissipation (mW)
VBO(TJ)/VBO(TJ=25oC)
Fig.1 Relative variation of VBO vs. junction temperature
1.04
1.02
1
100
50
5
6
0
25
50
75
100
125
0
25
50
75
100
125
150
7
Ambient temperature (°C)
Junction temperature (°C)
1
Fig. 3 Peak pulse current vs. pulse duration
10
Repetitive peak on-state current I TRM(A)
2
f=100Hz
3
1
4
0.1
1
0.01
10
100
1000
2
10000
tp(μs)
3
Version: C1601
SODDB3/SODDB3T
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
PART NO.
PACKING CODE
PACKING CODE
SODDBxx
(Note 1, 2)
SUFFIX
RH
G
PACKAGE
PACKING
SOD-123
3K / 7" Reel
Note 1: "x" is Device Code from "3" - "3T".
Note 2: Whole series with green compound
EXAMPLE
EXAMPLE P/N
PART NO.
PACKING CODE
SODDB3 RHG
SODDB3
RH
PACKING CODE
DESCRIPTION
SUFFIX
G
Green compound
PACKAGE OUTLINE DIMENSIONS
SOD-123
Unit (mm)
DIM.
Unit (inch)
Min
Max
Min
Max
A
1.40
1.80
0.055
0.071
B
3.55
3.85
0.140
0.152
C
0.45
0.70
0.018
0.028
D
2.55
2.85
0.100
0.112
E
0.95
1.35
0.037
0.053
F
0.05
0.15
0.002
0.006
G
0.50 REF
0.02 REF
H
-
-
0.10
0.004
SUGGEST PAD LAYOUT
Unit (mm)
Unit (inch)
Min
Min
G
2.25
0.089
X
0.90
0.035
X1
4.05
0.159
Y
0.95
0.037
DIM.
MARKING
Note: Apply positive voltage in cathode line and apply negative in another
electrode, it will show better I/V curve. It help user
differentiate the direction of purpose.
Cathode line
Version: C1601
SODDB3/SODDB3T
Taiwan Semiconductor
CREAT BY ART
Notice
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assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
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sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
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Version: C1601