3/20/2014 LTM4676 144LD-BGA, 16mm X 16mm X 5.01mm (TABLE OF MATERIAL DECLARATION) The LTM4676 is RoHS compliant per EU RoHS Directive 2003/95/EC. It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) No. Part Name Material Name 1 Substrate Circuit Board 2 Solder Paste Alloy 3 Component Weight (gram) 0.3362 Active Ics IC packaging Wire Solder Ball 8 Encapsulation Silicon LTC3880IUHE-9 Gold SAC305 Epoxy Resin CAS Number Material Mass (gram) Materials Analysis (weight %) Barium Compounds 7727-43-7 0.00787 2.34 Bismaleimide/Triazine Resin/Filler Substances (Silica Crystalline) 105391-33-1, 1156-510/9003-36-5/21645-51-2, non-disclosure 0.06553 19.49 Copper Metal Copper Compounds Ecotoxic substances Lead Phosphorus Gold metal or alloy Nickel Zinc Bisphenol A epoxyresin Continuous Filament Fiber Glass 7440-50-8 147-14-8 7440-38-2, 7440-28-0 7439-92-1 7723-14-0 7440-57-5 7440-02-0 7440-66-6 25068-38-6 65997-17-3 0.18803 0.00007 0.00003 0.00000 0.00025 0.00091 0.00403 0.00037 0.00002 0.05148 55.92 0.02 0.01 0.00 0.08 0.27 1.20 0.11 0.01 15.31 Acrylic Resin Non-disclosure 0.01503 4.47 Epoxy Resin Chromium(III) Oxide Silica amorphous Talc;not containing fibers like asbestos Non-disclosure 1308-38-9 7631-86-9 0.00023 0.00001 0.00010 0.07 0.00 0.03 14807-96-6 0.00091 0.27 Aromatic carbonyl compounds Non-disclosure 0.00087 0.26 Cyanoguanidine Amine compounds 461-58-5 Non-disclosure 0.00003 0.00011 0.01 0.03 Leveling agent and others Non-disclosure 0.00034 0.10 Imidazole system curing agent Sn Sb Non-disclosure 7440-31-5 7440-36-0 1.0529 Iron Powder (Fe) Copper (Cu) Nickel (Ni) Tin (Sn) Ceramic (Ba) Compounds 7439-89-6 7440-50-8 7440-02-0 7440-31-5 12047-27-7 0.0194 0.0806 0.0043 0.2419 Silicon SEE LTC WEBSITE Au Sn Ag Cu Fused Silica Epoxy Resin Phenol Resin Crytalline Silica Carbon Black Metal Hydroxide 7440-21-3 LTC WEBSITE 7440-57-5 7440-31-5 7440-22-4 7440-50-8 60676-86-0 Non-disclosure Non-disclosure 14808-60-7 1333-86-4 Non-disclosure 0.00002 0.06579 0.00346 0.71127 0.22105 0.01433 0.00947 0.09678 0.01937 0.0806 0.00426 0.23343 0.00726 0.00121 1.17292 0.13522 0.13522 0.04558 0.00760 0.02279 0.01 95.00 5.00 67.55 20.99 1.36 0.90 9.19 100.00 100.00 99.99 96.50 3.00 0.50 77.20 8.90 8.90 3.00 0.50 1.50 0.0692 Passive Components 4 5 6 7 Materials Analysis (element) 1.5193 Total Package Weight 3.3238 Note: Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts