DATASHEET

EL5126
®
August 24, 2006
• 8-channel reference outputs
• Accuracy of ±0.1%
• Supply voltage of 4.5V to 16.5V
• Digital supply 3.3V to 5V
• Low supply current of 10mA
• Rail-to-rail capability
• I2C control interface
Applications
• TFT-LCD drive circuits
• Reference voltage generators
Pinout
The EL5126 has 8 outputs and is available in a 32 Ld QFN
package. It is specified for operation over the full -40°C to
+85°C temperature range.
PART
NUMBER
PART
MARKING PACKAGE
TAPE
AND
REEL
PKG. NO.
26 NC
Ordering Information
31 OSC
32 OSC_SEL
EL5126
(32 LD 5X6 QFN)
TOP VIEW
27 FILTER
A number of the EL5126 can be stacked for applications
requiring more than 8 outputs. The reference inputs can be
tied to the rails, enabling each part to output the full voltage
range, or alternatively, they can be connected to external
resistors to split the output range and enable finer
resolutions of the outputs.
Features
28 STD/REG
The EL5126 is designed to produce
the reference voltages required in
TFT-LCD applications. Each output is
programmed to the required voltage with 10 bits of
resolution. Reference pins determine the high and low
voltages of the output range, which are capable of swinging
to either supply rail. Programming of each output is
performed using the serial interface.
FN7337.2
29 SCL
8-Channel TFT-LCD Reference Voltage
Generator
30 SDA
Data Sheet
VS 1
25 OUTA
VSD 2
24 OUTB
VS 3
23 OUTC
EL5126CL
5126CL
32 Ld QFN
-
MDP0046
EL5126CLZ
(Note)
5126CLZ
32 Ld QFN
(Pb-free)
-
MDP0046
EL5126CL-T7
5126CL
32 Ld QFN
7”
MDP0046
EL5126CLZ-T7
(Note)
5126CLZ
32 Ld QFN
(Pb-free)
7”
MDP0046
EL5126CL-T13
5126CL
32 Ld QFN
13”
MDP0046
AGND 6
20 OUTE
EL5126CLZ-T13
(Note)
5126CLZ
32 Ld QFN
(Pb-free)
13”
MDP0046
CAP 7
19 OUTF
NC 8
18 OUTG
VS 9
17 OUTH
1
22 OUTD
NC 16
21 DGND
NC 15
NC 14
DGND 13
DGND 11
REFL 5
NC 12
THERMAL
PAD
A0 10
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
REFH 4
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved. Elantec is a registered trademark of Elantec Semiconductor, Inc.
All other trademarks mentioned are the property of their respective owners.
EL5126
Absolute Maximum Ratings (TA = 25°C)
Supply Voltage between VS and GND. . . . . . . . . . . . . . . . . . . .+18V
Supply Voltage between VSD and GND . . . . . . . . . . . . . . . . . . .+7V
Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . . 30mA
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
VS = 18V, VSD = 5V, VREFH = 13V, VREFL = 2V, RL = 1.5kΩ and CL = 200pF to 0V, TA = +25°C Unless
Otherwise Specified.
PARAMETER
DESCRIPTION
CONDITION
MIN
TYP
MAX
UNIT
7.6
9
mA
1.9
3.2
mA
50
150
mV
SUPPLY
IS
Supply Current
ISD
Digital Supply Current
No load
ANALOG
VOL
Output Swing Low
Sinking 5mA
VOH
Output Swing High
Sourcing 5mA
ISC
Short Circuit Current
PSRR
Power Supply Rejection Ratio
tD
14.85
14.95
V
RL = 10Ω
150
240
mA
VS+ is moved from 14V to 16V
45
60
dB
Program to Out Delay
4
ms
VAC
Accuracy
20
mV
VDROOP
Droop Voltage
RINH
Input Resistance @ VREFH, VREFL
REG
Load Regulation
FCLOCK = 25kHz
1
2
32
IOUT = 5mA step
0.5
mV/ms
kΩ
1.5
mV/mA
DIGITAL
VIH
Logic 1 Input Voltage
VIL
Logic 0 Input Voltage
FCLK
Clock Frequency
RSDIN
SDIN Input Resistance
1
GΩ
tS
Setup Time
40
ns
tH
Hold Time
40
ns
tR
Rise Time
20
ns
tF
Fall Time
20
ns
2
VSD20%
V
20%*
VSD
V
400
kHz
EL5126
Pin Descriptions
PIN NUMBER
PIN NAME
PIN TYPE
PIN DESCRIPTION
1, 3, 9
VS
Power
Positive power supply for analog circuits
2
VSD
Power
Positive power supply for digital circuits
4
REFH
Analog Input
High reference voltage
5
REFL
Analog Input
Low reference voltage
6, 21, 11, 13
GND
Power
Ground
7
CAP
Analog
Decoupling capacitor for internal reference generator
8, 12, 14, 15, 16, 26
NC
10
A0
Logic Input
17
OUTH
Analog Output
Channel H programmable output voltage
18
OUTG
Analog Output
Channel G programmable output voltage
19
OUTF
Analog Output
Channel F programmable output voltage
20
OUTE
Analog Output
Channel E programmable output voltage
22
OUTD
Analog Output
Channel D programmable output voltage
23
OUTC
Analog Output
Channel C programmable output voltage
24
OUTB
Analog Output
Channel B programmable output voltage
25
OUTA
Analog Output
Channel A programmable output voltage
27
FILTER
Logic Input
Activates internal I2C data filter, high = enable, low = disable
28
STD/REG
Logic Input
Selects mode, high = standard, low = register mode
29
SCL
Logic Input
I2C clock
30
SDA
Logic Input
I2C data input
31
OSC
IP/OP
32
OSC_SEL
Logic Input
Development I2C address input, bit 0
Oscillator pin for synchronizing multiple chips
Selects internal/external OSC source, high = external, low = internal
0.3
7.8
0.2
7.6
0
-0.1
VS=15V
VSD=5V
VREFH=13V
VREFL=2V
-0.2
-0.3
10
ALL CHANNEL OUTPUT = 0V
7.4
0.1
IS (mA)
DIFFERENTIAL NONLINEARITY (LSB)
Typical Performance Curves
7.2
7.0
6.8
6.6
6.4
210
410
610
810
1010
INPUT CODE
FIGURE 1. DIFFERENTIAL NONLINEARITY vs CODE
3
4
6
8
10
12
VS (V)
14
16
18
FIGURE 2. SUPPLY VOLTAGE vs SUPPLY CURRENT
EL5126
Typical Performance Curves (Continued)
VS=VREFH=15V
M=400ns/DIV
1.2
VS=VREFH=15V
1.0 VREFL=0V
0mA
ISD (mA)
0.8
5mA/DIV
5mA
CL=4.7nF
RS=20Ω
0.6
0.4
5V
0
200mV/DIV
CL=1nF
RS=20Ω
0.2
3
3.2 3.4 3.5 3.8 4 4.2 4.4 4.5 4.8
VSD (V)
CL=180pF
5
FIGURE 3. DIGITAL SUPPLY VOLTAGE vs DIGITAL SUPPLY
CURRENT
FIGURE 4. TRANSIENT LOAD REGULATION (SOURCING)
VS=VREFH=15V
M=400ns/DIV
5mA
SCLK
5V
0mA
0V
SDA
CL=1nF
RS=20Ω
5V
0V
10V
CL=4.7nF
RS=20Ω
CL=180pF
5V
0V
OUTPUT
M=400µs/DIV
FIGURE 5. TRANSIENT LOAD REGULATION (SINKING)
FIGURE 6. LARGE SIGNAL RESPONSE (RISING FROM 0V
TO 8V)
SCLK
SCLK
5V
SDA
0V
SDA
5V
0V
OUTPUT
200mV
OUTPUT
0V
M=400µs/DIV
FIGURE 7. LARGE SIGNAL RESPONSE (FALLING FROM 8V
TO 0V)
4
M=400µs/DIV
FIGURE 8. SMALL SIGNAL RESPONSE (RISING FROM 0V
TO 200mV)
EL5126
Typical Performance Curves (Continued)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - LPP EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
3
2
P3 C/W
5°
=3
2
A
OUTPUT
θJ
SDA
2.857W
2.5
LP
POWER DISSIPATION (W)
SCLK
1.5
1
0.5
0
0
M=400µs/DIV
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 9. SMALL SIGNAL RESPONSE (FALLING FROM
200mV TO 0V)
FIGURE 10. POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 AND SEMI G42-88
(SINGLE LAYER) TEST BOARD
0.7 758mW
0.6
A
2
W
P3 C/
LP 32°
=1
θJ
POWER DISSIPATION (W)
0.8
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 11. POWER DISSIPATION vs AMBIENT TEMPERATURE
General Description
Digital Interface
The EL5126 provides a versatile method of providing the
reference voltages that are used in setting the transfer
characteristics of LCD display panels. The V/T
(Voltage/Transmission) curve of the LCD panel requires that
a correction is applied to make it linear; however, if the panel
is to be used in more than one application, the final curve
may differ for different applications. By using the EL5126,
the V/T curve can be changed to optimize its characteristics
according to the required application of the display product.
Each of the eight reference voltage outputs can be set with a
10-bit resolution. These outputs can be driven to within
50mV of the power rails of the EL5126. As all of the output
buffers are identical, it is also possible to use the EL5126 for
applications other than LCDs where multiple voltage
references are required that can be set to 10 bit accuracy.
5
The EL5126 uses a simple two-wire I2C digital interface to
program the outputs. The bus line SCLK is the clock signal
line and bus SDA is the data information signal line. The
EL5126 can support the clock rate up to 400kHz. External
pull up resistor is required for each bus line. The typical
value for these two pull up resistor is about 1kΩ.
START AND STOP CONDITION
The Start condition is a high to low transition on the SDA line
while SCLK is high. The Stop condition is a low to high
transition on the SDA line while SCLK is high. The start and
stop conditions are always generated by the master. The
bus is considered to be busy after the start condition and to
be free again a certain time after the stop condition. The two
bus lines must be high when the buses are not in use. The
I2C Timing Diagram 2 shows the format.
EL5126
the eight outputs at one time. Two data bytes are required for
10-bit data for each channel output and there are total of 16
data bytes for 8 channels. Data in data byte 1 and 2 is for
channel A. Data in data byte 15 and 16 is for channel H. D9
to D0 are the 10-bit data for each channel. The unused bits
in the data byte are "don't care" and can be set to either one
or zero. See Table 1 for program sample for one channel
setting:
DATA VALIDITY
The data on the SDA line must be stable during the high
period of the clock. The high or low state of the data line can
only change when the clock signal on the SCLK line is low.
BYTE FORMAT AND ACKNOWLEDGE
Every byte put on the SDA line must be eight bits long. The
number of bytes that can be transmitted per transfer is
unrestricted. Each byte has to be followed by an
acknowledge bit. Data is transferred with the most significant
bit first (MSB).
TABLE 1.
DATA
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
The master puts a resistive high level on the SDA line during
the acknowledge clock pulse. The peripheral that
acknowledges has to pull down the SDA line during the
acknowledge clock pulse.
DEVICES ADDRESS AND W/R BIT
Data transfers follow the format shown in Timing Diagram 1.
After the Start condition, a first byte is sent which contains
the Device Address and write/read bit. This address is a 7bit long device address and only two device addresses (74H
and 75H) are allowed for the EL5126. The first 6 bits (A6 to
A1, MSBs) of the device address have been factory
programmed and are always 111010. Only the least
significant bit A0 is allowed to change the logic state, which
can be tied to VSD or DGND. A maximum of two EL5126
may be used on the same bus at one time. The EL5126
monitors the bus continuously and waiting for the start
condition followed by the device address. When a device
recognizes its device address, it will start to accept data. An
eighth bit is followed by the device address, which is a data
direction bit (W/R). A "0" indicates a Write transmission and
a "1" indicates a Read transmission.
CONDITION
0
0
0
0
0
0
0
0
0
0
Data value = 0
1
0
0
0
0
0
0
0
0
0
Data value = 512
0
0
0
0
0
1
1
1
1
1
Data value = 31
1
1
1
1
1
1
1
1
1
1
Data value = 1023
When the W/R bit is high, the master can read the data from
the EL5126. See Timing Diagram 1 for detail formats.
REGISTER MODE
The part operates at Register Mode if pin 28 (STD/REG) is
held low. The Register Mode allows the user to program
each output individually. Followed by the first byte, the
second byte sets the register address for the programmed
output channel. Bits R0 to R3 set the output channel
address. For the unused bits in the R4 to R7 are "don't care".
See Table 2 for program sample.
The EL5126 also allows the user to read the data at Register
Mode. See Timing Diagram 1 for detail formats.
DIGITAL FILTER
A user selectable digital filter can be used to filter noise
spikes from the SCLK and SDA inputs. When the Filter pin
(pin27) is high, the digital filter is enabled. When the Filter
pin is low, the digital filter is disabled.
The EL5126 can be operated as Standard mode and
Register mode. See the I2C Timing Diagram 1 for detail
formats.
STANDARD MODE
The part operates at Standard Mode if pin 28 (STD/REG) is
held high. The Standard Mode allows the user to program
TABLE 2.
REGISTER ADDRESS
DATA
R3
R2
R1
R0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
0
0
0
0
0
0
0
0
0
0
0
0
0
Channel A, Value = 0
X
0
0
1
1
0
0
0
0
0
0
0
0
0
Channel B, Value = 512
X
0
1
0
0
0
0
0
0
1
1
1
1
1
Channel C, Value = 31
X
1
1
1
1
1
1
1
1
1
1
1
1
1
Channel H, Value = 1023
6
CONDITION
I2C Timing Diagram 1
STANDARD MODE (STD/REG = HIGH) WRITE MODE
I2C
Data
Start
I2C
Data In
Device Address
W A
A6 A5 A4 A3 A2 A1 A0
I2C
CLK In
1 2 3 4 5 6 7 8
= don’t care
Data 1
A
Data 2
D7 D6 D5 D4 D3 D2 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8
A
Data 3
Data 16
D7 D6 D5
A
Stop
D2 D1 D0
6 7 8
7
STANDARD MODE (STD/REG = HIGH) READ MODE
I2C
Data
Start
I2C
Data In
Device Address
R A
Data 1
A
Data 2
A
Data 3
Data 16
NA
Stop
A6 A5 A4 A3 A2 A1 A0
I2C
Data Out
1 2 3 4 5 6 7 8
D7 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8
D7 D6 D5
D2 D1 D0
EL5126
I2C
CLK In
D7 D6 D5 D4 D3 D2 D9 D8
6 7 8
REGISTER MODE (STD/REG = LOW) WRITE MODE
I2C
Data
Start
I2C
Data In
Device Address
W A
A6 A5 A4 A3 A2 A1 A0
I2C
CLK In
1 2 3 4 5 6 7 8
Register Address
A
Data 1
A
Data 2
A
D7 D6 D5 D4 R3 R2 R1 R0
D7 D6 D5 D4 D3 D2 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8
Stop
REGISTER MODE (STD/REG = LOW) READ MODE
I2C
Data
I2C
Data In
Start
Device Address
W A
A6 A5 A4 A3 A2 A1 A0
Register Address
D7 D6 D5 D4 R3 R2 R1 R0
A Start
Device Address
R A
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8
A
Data 2
A6 A5 A4 A3 A2 A1 A0
I2C
Data Out
I2C
CLK In
Data 1
1 2 3 4 5 6 7 8
D7 D6 D5 D4 D3 D2 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8
NA
Stop
EL5126
I2C Timing Diagram 2
START
CONDITION
tF
tR
STOP CONDITION
positive than the VCOM potential. The second EL5126 can
provide the Gamma correction voltage more negative than
the VCOM potential. The Application Drawing shows a
system connected in this way.
CLOCK OSCILLATOR
DATA
CLOCK
tS
tH
tS
tR
tH
tF
START, STOP & TIMING DETAILS OF I2C INTERFACE
Analog Section
TRANSFER FUNCTION
The transfer function is:
data
V OUT ( IDEAL ) = V REFL + ------------- × ( V REFH - V REFL )
1024
where data is the decimal value of the 10-bit data binary
input code.
The output voltages from the EL5126 will be derived from
the reference voltages present at the VREFL and VREFH
pins. The impedance between those two pins is about 32kΩ.
Care should be taken that the system design holds these two
reference voltages within the limits of the power rails of the
EL5126. GND < VREFH ≤ VS and GND ≤ VREFL ≤ VREFH.
In some LCD applications that require more than 8 channels,
the system can be designed such that one EL5126 will
provide the Gamma correction voltages that are more
8
The EL5126 requires an internal clock or external clock to
refresh its outputs. The outputs are refreshed at the falling OSC
clock edges. The output refreshed switches open at the rising
edges of the OSC clock. The driving load shouldn’t be changed
at the rising edges of the OSC clock. Otherwise, it will generate
a voltage error at the outputs. This clock may be input or output
via the clock pin labeled OSC. The internal clock is provided by
an internal oscillator running at approximately 21kHz and can
be output to the OSC pin. In a 2 chip system, if the driving loads
are stable, one chip may be programmed to use the internal
oscillator; then the OSC pin will output the clock from the
internal oscillator. The second chip may have the OSC pin
connected to this clock source.
For transient load application, the external clock Mode
should be used to ensure all functions are synchronized
together. The positive edge of the external clock to the OSC
pin should be timed to avoid the transient load effect. The
Application Drawing shows the LCD H rate signal used, here
the positive clock edge is timed to avoid the transient load of
the column driver circuits.
After power on, the chip will start with the internal oscillator
mode. At this time, the OSC pin will be in a high impedance
condition to prevent contention. By setting pin 32 to high, the
chip is on external clock mode. Setting pin 32 to low, the chip
is on internal clock mode.
EL5126
Block Diagram
REFERENCE HIGH
OUT
OUT
OUT
OUT
OUT
EIGHT
CHANNEL
MEMORY
VOLTAGE
SOURCES
OUT
OUT
OUT
REFERENCE LOW
REFERENCE DECOUPLE
I2C DATA IN
CONTROL IF
I2C CLOCK IN
FILTER
STD/REG
A0
OSCILLATOR OSCILLATOR
INPUT/OUTPUT
SELECT
CHANNEL OUTPUTS
POWER DISSIPATION
Each of the channel outputs has a rail-to-rail buffer. This
enables all channels to have the capability to drive to within
100mV of the power rails, (see Electrical Characteristics for
details).
With the 30mA maximum continues output drive capability
for each channel, it is possible to exceed the 125°C absolute
maximum junction temperature. Therefore, it is important to
calculate the maximum junction temperature for the
application to determine if load conditions need to be
modified for the part to remain in the safe operation.
When driving large capacitive loads, a series resistor should
be placed in series with the output. (Usually between 5Ω and
50Ω).
Each of the channels is updated on a continuous cycle, the
time for the new data to appear at a specific output will
depend on the exact timing relationship of the incoming data
to this cycle.
The best-case scenario is when the data has just been
captured and then passed on to the output stage
immediately; this can be as short as 48µs. In the worst-case
scenario this will be 380µs, when the data has just missed
the cycle.
When a large change in output voltage is required, the
change will occur in 2V steps, thus the requisite number of
timing cycles will be added to the overall update time. This
means that a large change of 16V can take between 3ms
and 3.4ms depending on the absolute timing relative to the
update cycle.
9
The maximum power dissipation allowed in a package is
determined according to:
T JMAX - T AMAX
P DMAX = --------------------------------------------Θ JA
where:
• TJMAX = Maximum junction temperature
• TAMAX = Maximum ambient temperature
• θJA = Thermal resistance of the package
• PDMAX = Maximum power dissipation in the package
EL5126
The maximum power dissipation actually produced by the IC
is the total quiescent supply current times the total power
supply voltage and plus the power in the IC due to the loads.
P DMAX = V S × I S + Σ [ ( V S - V OUT i ) × I LOAD i ]
when sourcing, and:
P DMAX = V S × I S + Σ ( V OUT i × I LOAD i )
when sinking.
Where:
• i = 1 to total 8
• VS = Supply voltage
POWER SUPPLY BYPASSING AND PRINTED CIRCUIT
BOARD LAYOUT
Good printed circuit board layout is necessary for optimum
performance. A low impedance and clean analog ground
plane should be used for the EL5126. The traces from the
two ground pins to the ground plane must be very short. The
thermal pad of the EL5126 should be connected to the
analog ground plane. Lead length should be as short as
possible and all power supply pins must be well bypassed. A
0.1µF ceramic capacitor must be place very close to the VS,
VREFH, VREFL, and CAP pins. A 4.7µF local bypass
tantalum capacitor should be placed to the VS, VREFH, and
VREFL pins.
APPLICATION USING THE EL5126
• IS = Quiescent current
• VOUTi = Output voltage of the i channel
• ILOADi = Load current of the i channel
By setting the two PDMAX equations equal to each other, we
can solve for the RLOAD's to avoid the device overheat. The
package power dissipation curves provide a convenient way
to see if the device will overheat.
10
In the first application drawing, the schematic shows the
interconnect of a pair of EL5126 chips connected to give
8 gamma corrected voltages above the VCOM voltage, and
8 gamma corrected voltages below the VCOM voltage.
EL5126
Application Drawing
HIGH REFERENCE
VOLTAGE
+10V
REFH
OUTA
VS
OUTB
COLUMN
(SOURCE)
DRIVER
0.1µF
+12V
0.1µF
+5V
MICROCONTROLLER
VSD
0.1µF
LCD PANEL
OUTC
FILTER
OUTD
AO
I2C DATA IN
SDA
I2C CLOCK
LCD
TIMING
CONTROLLER
HORIZONTAL RATE
+5V
OUTE
SCL
OSC
OSC_SEL OUTF
CAP
ADDRESS = H74
0.1µF
OUT
REFL
STD
GND
OUTH
EL5126
MIDDLE REFERENCE VOLTAGE
+5.5V
OUTA
REFH
OSC
OSC_SEL
VS
OUTB
+5V
+12V
0.1µF
+5V
VSD
0.1µF
OUTC
FILTER
I2C DATA IN
I2C CLOCK
AO
SDA
OUTD
SCL
OUTE
ADDRESS = H75
CAP
+1V
0.1µF
LOW REFERENCE
VOLTAGE
OUTF
REFL
0.1µF
OUT
STD
GND
OUTH
EL5126
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
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11
EL5126
QFN (Quad Flat No-Lead) Package Family
MDP0046
QFN (QUAD FLAT NO-LEAD) PACKAGE FAMILY
(COMPLIANT TO JEDEC MO-220)
A
SYMBOL QFN44 QFN38
D
N
(N-1)
(N-2)
B
1
2
3
PIN #1
I.D. MARK
E
(N/2)
2X
0.075 C
2X
0.075 C
N LEADS
TOP VIEW
QFN32
TOLERANCE
NOTES
A
0.90
0.90
0.90
0.90
±0.10
-
A1
0.02
0.02
0.02
0.02
+0.03/-0.02
-
b
0.25
0.25
0.23
0.22
±0.02
-
c
0.20
0.20
0.20
0.20
Reference
-
D
7.00
5.00
8.00
5.00
D2
5.10
3.80
5.80 3.60/2.48
E
7.00
7.00
8.00
E2
5.10
5.80
5.80 4.60/3.40
e
0.50
0.50
0.80
L
0.55
0.40
0.53
Basic
-
Reference
8
6.00
Basic
-
Reference
8
0.50
Basic
-
0.50
±0.05
-
N
44
38
32
32
Reference
4
ND
11
7
8
7
Reference
6
NE
11
12
8
9
Reference
5
0.10 M C A B
(N-2)
(N-1)
N
b
L
PIN #1 I.D.
3
1
2
3
(E2)
(N/2)
NE 5
7
(D2)
BOTTOM VIEW
0.10 C
e
C
SYMBOL QFN28 QFN24
QFN20
QFN16
TOLERANCE NOTES
A
0.90
0.90
0.90
0.90
0.90
±0.10
-
A1
0.02
0.02
0.02
0.02
0.02
+0.03/
-0.02
-
b
0.25
0.25
0.30
0.25
0.33
±0.02
-
c
0.20
0.20
0.20
0.20
0.20
Reference
-
D
4.00
4.00
5.00
4.00
4.00
Basic
-
D2
2.65
2.80
3.70
2.70
2.40
Reference
-
E
5.00
5.00
5.00
4.00
4.00
Basic
-
E2
3.65
3.80
3.70
2.70
2.40
Reference
-
e
0.50
0.50
0.65
0.50
0.65
Basic
-
L
0.40
0.40
0.40
0.40
0.60
±0.05
-
N
28
24
20
20
16
Reference
4
ND
6
5
5
5
4
Reference
6
NE
8
7
5
5
4
Reference
5
Rev 10 12/04
SEATING
PLANE
NOTES:
0.08 C
N LEADS
& EXPOSED PAD
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
SEE DETAIL "X"
2. Tiebar view shown is a non-functional feature.
3. Bottom-side pin #1 I.D. is a diepad chamfer as shown.
SIDE VIEW
4. N is the total number of terminals on the device.
5. NE is the number of terminals on the “E” side of the package
(or Y-direction).
(c)
C
2
6. ND is the number of terminals on the “D” side of the package
(or X-direction). ND = (N/2)-NE.
A
(L)
A1
N LEADS
DETAIL X
12
7. Inward end of terminal may be square or circular in shape with radius
(b/2) as shown.
8. If two values are listed, multiple exposed pad options are available.
Refer to device-specific datasheet.
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