DATASHEET

ISL54105
Key Features
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DESIGN
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COMME E ISL54105A
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Data Sheet
SEE T H
®
June 11, 2008
FN6723.0
TMDS Regenerator
Features
The ISL54105 is a high-performance TMDS timing
regenerator containing a programmable equalizer and a
clock data recovery (CDR) function for each of the 3 TMDS
pairs in an HDMI or DVI signal. The TMDS data outputs of
the ISL54105 are regenerated and perfectly aligned to the
regenerated TMDS clock signal, creating an extremely
clean, low-jitter DVI/HDMI signal that can be easily
decoded by any TMDS receiver.
• Clock Data Recovery and Retiming
• Programmable pre-emphasis on output driver
• Programmable internal 50Ω, 100Ω, or high-Z termination
• Stand-alone or I2C software-controlled operation
• 72 lead, 10mm x 10mm QFN package
• Pb-free (RoHS compliant)
Applications
The ISL54105 can be used as a cable extender, to clean up
a noisy/jittery TMDS source, or to provide a very stable
TMDS signal to a finicky DVI or HDMI receiver.
• DVI/HDMI extenders
• Televisions/PC monitors/projectors
Block Diagram
RXC
RX0
RX1
RX2
2
TERMINATION
PLL
CH0
2
CDR
D
2
TXC
2
TX0
CK
TERMINATION AND
EQUALIZATION
2
2
CH1
CH2
CDR
CDR
D
FIFO
CK
D
2
TX1
2
TX2
CK
RES_TERM
BIAS GENERATION
RES_BIAS
SDA
SCL
ADDR
7
CONFIGURATION AND CONTROL
ACTIVITY
DETECT
PD
RESET
Ordering Information
PART NUMBER
TEMP. RANGE (°C)
ISL54105CRZ
0 to +70
PACKAGE
72 Ld QFN (Pb-Free)
PKG. DWG. #
L72.10x10B
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL54105
Absolute Maximum Ratings
Thermal Information
Voltage on VD (referenced to GND). . . . . . . . . . . . . . . . . . . . . . 4.0V
Voltage on any Input Pin (referenced to GND) . . . -0.3V to VD+0.3V
Voltage on any “5V Tolerant” Input Pin
(referenced to GND). . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V
Current into any Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . ±20mA
ESD Classification
Human Body Model . . . >4000V, higher voltage testing in progress
Machine Model . . . . . . . .>200V, higher voltage testing in progress
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
QFN Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Maximum Biased Junction Temperature . . . . . . . . . . . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VD = 3.3V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
Electrical Specifications
SYMBOL
Specifications apply for VD = 3.3V, pixel rate = 165MHz, TA = +25°C, RES_TERM = 1kΩ, RES_BIAS = 3.16kΩ,
TMDS output load = 50Ω, TMDS output termination voltage VTERM = 3.3V unless otherwise noted.
PARAMETER
COMMENT
MIN
(Note 2)
TYP
165
225
MAX
(Note 2)
UNIT
FULL CHANNEL CHARACTERISTICS
fDATA_MAX
Maximum Rx Clock Frequency/Pixel Rate
fDATA_MIN
Minimum Rx Clock Frequency/Pixel Rate
(Note 3)
MHz
25
MHz
50
150
mVP-P
TMDS RECEIVER CHARACTERISTICS
VSENS
Minimum Differential Input Sensitivity
R50
50Ω Termination Resistance
45
50
55
Ω
R100
100Ω Termination Resistance
90
97
110
Ω
Rx Clock Duty Cycle
20
80
%
CLKDUTY
TMDS TRANSMITTER CHARACTERISTICS
jTX_CLOCK
Total Jitter on Clock Outputs
Independent of incoming jitter
32
ps
jTX_DATA
Total Jitter on Data Outputs
Independent of incoming jitter
52
ps
±4
ps
SKEWINTRA Intra-Pair (+ to -) Differential Skew
SKEWINTER Inter-Pair (channel-to-channel) Skew
Added with respect to incoming
inter-pair skew
2
UI
tRISE
Rise Time into 50Ω Load to 3.3V
20% to 80%
80
240
ps
tFALL
Fall Time into 50Ω Load to 3.3V
20% to 80%
80
240
ps
TX VOH
Single-Ended High Level Output Voltage
VTERM - 10
VTERM + 10
mV
TX VOL
Single-Ended Low Level Output Voltage
VTERM - 600
VTERM - 400
mV
DIGITAL SCHMITT INPUT CHARACTERISTICS
VIH
High Threshold Voltage
VIL
High to Low Threshold Voltage
I
2.0
V
0.8
Input Leakage Current
V
±10
nA
RPU
Internal Pull-Up Resistance
SDA and SCL pins
65
kΩ
RPD
Internal Pull-Down Resistance
AUTO_CH_SEL, CH_SEL_x,
RESET, ADDRx, PD pins
60
kΩ
CIN
Input Capacitance
5
pF
2
FN6723.0
June 11, 2008
ISL54105
Electrical Specifications
SYMBOL
Specifications apply for VD = 3.3V, pixel rate = 165MHz, TA = +25°C, RES_TERM = 1kΩ, RES_BIAS = 3.16kΩ,
TMDS output load = 50Ω, TMDS output termination voltage VTERM = 3.3V unless otherwise noted.
PARAMETER
MIN
(Note 2)
COMMENT
TYP
MAX
(Note 2)
UNIT
DIGITAL OUTPUT CHARACTERISTICS
VOH
Output HIGH Voltage, IO = 8mA
VOL
Output LOW Voltage, IO = -8mA
2.4
V
0.4
V
3.3
3.6
V
POWER SUPPLY REQUIREMENTS
VD
Supply Voltage
ID
Supply Current
Inputs driven by 165Mpixel/s
TMDS signals.
Default register settings
357
405
mA
ID
Supply Current in Power-down Mode
All available inputs driven by
165Mpixel/s TMDS signals.
20
26
mA
400
kHz
470
ns
3
AC TIMING CHARACTERISTICS (2-WIRE INTERFACE)
fSCL
SCL Clock Frequency
tAA
SCL LOW to SDA Data Out Valid
tBUF
Time the Bus Must be Free Before a New
Transmission Can Start
1.3
tLOW
Clock LOW Time
1.3
0.1
µs
tHIGH
Clock HIGH Time
0.6
0.2
µs
tSU:STA
Start Condition Setup Time
0.6
0.03
µs
tHD:STA
Start Condition Hold Time
0.6
0.07
µs
tSU:DAT
Data In Setup Time
100
0.03
ns
tHD:DAT
Data In Hold Time
0
ns
tSU:STO
Stop Condition Setup Time
0.6
µs
Data Output Hold Time
160
ns
tDH
0
200
µs
NOTE:
2. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
3. Operation up to 165MHz is guaranteed. While many parts will typically operate up to 225MHz, operation above 165MHz is not guaranteed.
tF
SCL
tHIGH
tLOW
tR
tSU:DAT
tSU:STA
tHD:STA
tHD:DAT
tSU:STO
SDA IN
tAA
tDH
tBUF
SDA OUT
FIGURE 1. 2-WIRE INTERFACE TIMING
3
FN6723.0
June 11, 2008
ISL54105
NC
NC
NC
ADDR2
NC
NC
ADDR1
VD
NC
VD
NC
VD
VD
VD
NC
ADDR0
AD
NC
ISL54105 Pin Configuration
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
49 TXC-
RES_TERM
7
48 TX2+
VD
8
47 TX2-
RES_BIAS
9
46 TX1+
VD
10
45 TX1-
RXC-
11
44 TX0+
RXC+
12
43 TX0-
VD
13
42 V
D
VD
14
41 VD_ESD
RX0-
15
40 VD
RX0+
16
39 TEST
VD
17
38 SCL
RESET
18
37 SDA
ADDR3
19
4
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
NC
6
VD
VD
NC
50 TXC+
ADDR6
5
ADDR5
VD
VD
51 VD
VD
4
VD
VD
VD
52 VD
VD
3
RX2+
VD
RX2-
53 VD_ESD
VD
2
RX1+
PD
RX1-
54 VD
VD
1
ADDR4
NC
FN6723.0
June 11, 2008
ISL54105
Pin Descriptions
SYMBOL
DESCRIPTION
RX0-, RX0+, RX1-, RX1+, RX2-, RX2+ TMDS Inputs. Incoming TMDS data signals.
RXC-, RXC+
TMDS Inputs. Incoming TMDS clock signals.
TX0-, TX0+, TX1-, TX1+, TX1-, TX1+
TMDS Outputs. TMDS output data for selected channel.
TXC-, TXC+
TMDS Outputs. TMDS output clock for selected channel.
SCL
Digital input, 5V tolerant, 500mV hysteresis. Serial data clock for 2-wire interface.
Note: Internal 65kΩ pull-up to VD.
SDA
Bidirectional Digital I/O, open drain, 5V tolerant. Serial data I/O for 2-wire interface.
Note: Internal 65kΩ pull-up to VD.
ADDR[6:0]
Digital inputs, 5V tolerant. 7-Bit address for serial interface.
Note: Internal 60kΩ pull-down to GND.
AD
Digital Output, 3.3V. AD = Activity Detect. Output goes high when an active TMDS clock is detected on
RXC.
RES_BIAS
Tie to GND through a 3.16k external resistor. Sets up internal bias currents.
RES_TERM
Tie to VD through a 1.0k 1% external resistor. During calibration, the termination resistor closest in value
to RES_TERM/20 (= 50Ω) is selected.
PD
Digital Input, 3.3V. PD = Power-down. Pull high to put the ISL54105 in a minimum power consumption
mode.
Note: To ensure proper operation, this pin must be held low during power-up. It may be taken high 100ms
after the power supplies have settled to 3.3V ±10%.
When exiting Power-down, a termination resistor Recalibration cycle must be run to re-trim the
termination resistors (see register 0x03[7]).
Note: Internal 60kΩ pull-down to GND.
RESET
Digital Input, 3.3V. Pull high then low to reset the mux. Tie to GND in final application.
Note: Internal 60kΩ pull-down to GND.
TEST
Digital Input. Used for production testing only. Tie to GND in final application. This pin has an internal
pulldown to GND, so it is also acceptable to leave this pin floating.
VD
Power supply. Connect to a 3.3V supply and bypass each pin to GND with 0.1µF.
VD_ESD
Power supply for ESD protection diodes. Connect one of these pins (pin 41 or 53) to the 3.3V VD supply
rail with a low VF (0.4V or lower) Schottky diode, with the cathode connected to VD_ESD and the anode
connected to VD. Bypass each pin to GND with 0.1µF.
THERMAL PAD (GND)
Ground return for the entire chip. The thermal pad must have a low impedance connection to GND for
the ISL54105 to function at all. The lower electrical impedance, the better the ground, and the better the
performance. A low thermal impedance between the thermal pad and the GND plane of the PCB will
dissipate the heat from the package more efficiently as well and is recommended.
5
FN6723.0
June 11, 2008
ISL54105
Register Listing
ADDRESS
0x00
0x01
REGISTER (DEFAULT VALUE)
Device ID (read only)
Channel Activity Detect (read only)
BIT(S)
0x03
Channel Selection (0x0C)
Input Control (0x12)
Recommended default: 0x63
6
DESCRIPTION
3:0
Device Revision
1 = initial silicon, 2 = second revision, etc.
7:4
Device ID
3 = ISL54105
1:0
Reserved
Reserved
Activity Detect
0: TMDS clock not present on RXC
1: TMDS clock detected on RXC
Reserved
This nibble should always be set to 0xC.
4
Reset
Full chip reset. Write a 1 to reset. Will set itself to 0 when
reset is complete.
5
Power-down
0: Normal Operation
1: Puts the chip in a minimal power consumption mode,
turning off all TMDS outputs and open-circuiting all TMDS
inputs.
This bit is OR'ed with the Power-down input pin. If either is
set, the chip will enter power-down. Serial
I/O stays operational in PD mode.
Note: When exiting Power-down, a termination resistor
Recalibration cycle must be run to re-trim the termination
resistors (see register 0x03[7]).
0
Reserved
Set to 1. Default value of 0 is OK, set to 1 to slightly reduce
power consumption.
1
Reserved
Set to 1.
2
Tri-state Clock
Inputs
0: Clock inputs are terminated into 50Ω/100Ω.
1: Clock inputs are tri-stated (to allow chip to operate in
parallel with another TMDS receiver with fixed 50Ω
termination)
3
Tri-state Data Inputs
0: Data inputs are terminated into 50Ω/100Ω.
1: Data inputs are tri-stated (to allow chip to operate in
parallel with another TMDS receiver with fixed 50Ω
termination)
4
Activity Detect Mode 0: AC Activity. Activity detection is based on the presence of
AC activity on TMDS clock inputs. This setting (along with a
hysteresis of 20mV enabled) provides reliable activity
detection. (recommended setting)
1: Common Mode Voltage. If the common mode voltage is
above ~3.05V, the input is considered in active. This method
has been found to be unreliable with small signal swings and
should not be used. This setting is the silicon default but
should be changed in software for more reliable activity
detection.
5
Clock Rx Hysteresis
Enables hysteresis for the clock inputs to prevent false clock
detection when both inputs are high. Data inputs do not get
hysteresis.
0: TMDS input hysteresis disabled
1: TMDS input hysteresis enabled. Eliminates false activity
detects on unconnected channels. (recommended setting)
6
Clock Rx Hysteresis
Magnitude
Controls the amount of hysteresis in the clock inputs.
0: 10mV
1: 20mV (recommended setting)
7
Recalibrate
0: Normal Operation
1: Recalibrates termination resistance. To recalibrate, take
this bit high, wait at least 1ms, then take this bit low.
Calibration is automatically done after power-on, but
performing a recalibration after the supply voltage and
temperature have stabilized may result in termination
resistances closer to the desired 50Ω.
2
0x02
FUNCTION NAME
3:0
FN6723.0
June 11, 2008
ISL54105
Register Listing (Continued)
ADDRESS
0x04
REGISTER (DEFAULT VALUE)
Termination Control (0x00)
BIT(S)
1:0
Set to 00.
Data Termination
0: TMDS Data inputs terminated into 50Ω (normal
operation)
1: TMDS Data inputs terminated into 100Ω (for paralleled
inputs)
Reserved
Set to 000.
6
Clk Termination
0: TMDS Clock inputs terminated into 50Ω (normal
operation)
1: TMDS Clock inputs terminated into 100Ω (for paralleled
inputs)
7
Reserved
Set to 0.
0
Tri-state Clock
Outputs
0: Normal Operation
1: Clock outputs tri-stated (allows another chip to drive the
output clock pins)
1
Tri-state Data
Outputs
0: Normal Operation
1: Data outputs tri-stated (allows another chip to drive the
output data pins)
2
Invert Output
Polarity
0: Normal Operation
1: The polarity of the TMDS data outputs is inverted
(+ becomes -, - becomes +). TMDS clock unchanged.
3
Reverse Output
Order
0: Normal Operation
1: CH0 data is output on CH2 and CH2 data is output on
CH0. No change to CH1.
3:0
Transmit Current
Transmit Drive Current for data signals, adjustable in
0.125mA steps. Clock current is fixed at 10mA.
0x0: 10mA
0x8: 11mA
0xF: 11.875mA
7:4
Transmit
Pre-emphasis
Drive boost (in 0.125mA steps) added during first half of
each bit period for data signals. Clock signals do not have
pre-emphasis.
0x0: 0mA
0x8: 1mA
0xF: 1.875mA
5:3
0x06
Output Options (0x00)
Data Output Drive (0x00)
DESCRIPTION
Reserved
2
0x05
FUNCTION NAME
0x07
Reserved (0xCC)
7:0
Reserved
Default value of 0xCC is OK, can also be set to 0x00.
0x08
Equalization (0xCC)
3:0
Equalizer Gain
Boost (dB) = 1dB + <gain value> * 0.8dB
0x0: 1dB boost at 800MHz
0xC: 10.6dB boost at 800MHz (default)
0xF: 13dB boost at 800MHz
0x09
Test Pattern Generator (0x00)
7:4
Reserved
Default value of 0xC is OK, can also be set to 0x0.
1:0
Generator Mode
When a 25MHz to 165MHz clock is applied to the clock
input, this function will output a PRBS7 pattern on the TX
pins.
0: Normal operation (test patterns disabled)
1: PRBS7 pattern
2: Low frequency toggle (0000011111…)
3: High frequency toggle (1010101010…)
Note: When switching from the high frequency toggle
pattern to the low frequency toggle pattern, you must first
select normal operation.
2
7
Enable PRBS7 Error Enables PRBS7 error counter in registers 0x0A to 0x0C.
Counter
0: Disable PRBS7 Error Counter
1: Enable PRBS7 Error Counter
FN6723.0
June 11, 2008
ISL54105
Register Listing (Continued)
ADDRESS
REGISTER (DEFAULT VALUE)
BIT(S)
0x0A
PRBS7 Error Counter Link 0 (read only)
7:0
PRBS7 Error
Counter Link 0
PRBS7 Error Counter of Link 0. Saturates at 0xFF. Reading
this register clears this register at end of read
0x0B
PRBS7 Error Counter Link 1 (read only)
7:0
PRBS7 Error
Counter Link 1
PRBS7 Error Counter of Link 1. Saturates at 0xFF. Reading
this register clears this register at end of read
0x0C
PRBS7 Error Counter Link 2 (read only)
7:0
PRBS7 Error
Counter Link 2
PRBS7 Error Counter of Link 2. Saturates at 0xFF. Reading
this register clears this register at end of read
0x10
PLL Bandwidth (0x10)
Recommended default: 0x12
1:0
PLL Bandwidth
Selects between 4 PLL bandwidth settings
0: 4MHz (silicon default)
1: 2MHz
2: 1MHz (recommended default)
3: 500kHz
1MHz provides slightly better performance with high jitter/
high noise signals.
7:2
Reserved
Keep set to 000100 binary.
8
FUNCTION NAME
DESCRIPTION
FN6723.0
June 11, 2008
ISL54105
Application Information
PLL Bandwidth
The ISL54105 is a TMDS regenerator, locking to the incoming
DVI or HDMI signal with triple Clock Data Recovery units
(CDRs) and a Phase Locked Loop (PLL). The PLL generates a
low jitter pixel clock from the incoming TMDS clock. The TMDS
data signals are equalized, sliced by the CDR, re-aligned to the
PLL clock, and sent out the TMDS outputs.
The 2-bit PLL Bandwidth register controls the loop
bandwidth of the PLL used to recover the incoming clock
signal. The default 4MHz setting works well in most
applications, however a lower bandwidth of 1MHz has
proven to work just as well with good TMDS sources and
slightly better with marginal sources.
Activity Detection
Power-down
The TMDS input is considered active using one of two
methods. The original default activity detect method (register
0x03b4 = 1) is to measure the common mode of the TMDS
clock input for each channel. If the common mode is 3.3V, it
indicates that there is nothing connected to that input, or that
whatever is connected is turned off (inactive). This has been
found to be relatively unreliable, particularly with weak signals.
The chip can be placed in a Power-down mode when not in
use to conserve power. Setting the Power-down bit (register
0x02 bit 5) to a 1 or pulling the PD input pin high places the
chip in a minimal power consumption mode, turning off all
TMDS outputs and disconnecting all TMDS inputs. Serial I/O
stays operational in PD mode. Note that the PD pin must be
low during power-on in order to initialize the I2C interface.
The preferred method of activity detection is looking for an
active AC signal on the TMDS clock input for that channel
(register 0x03b4 = 1). This is more robust, however
disconnected inputs will cause both inputs to the differential
receiver to be the same level - 3.3V. If the offset error of the
differential TMDS receiver is very small, the receiver can not
resolve a 1 or a 0 and will randomly switch between states,
which may be detected as an active clock. Register 0x03 bits
5 and 6 allow a 10mV or 20mV offset to be added to the input
stage of the clock inputs, eliminating this problem. This offset
will slightly reduce the sensitivity of TMDS receiver for the
clock lines, but since the clock signals are much lower
frequency than the data, they will not be nearly as
attenuated, so this is not a problem in practice.
Note: When exiting Power-down, a termination resistor
Recalibration cycle must be run to re-trim the termination
resistors (see register 0x03[7]).
Again, using the AC activity detection method (register
0x03b4 = 0) is recommended.
Rx Equalization
Register 0x08 bits 3:0 control the amount of equalization
applied to the TMDS inputs, providing 4 bits of control. The
equalization range available is from a minimum of 1dB boost
to a maximum of 13dB at 800MHz, in 0.8dB increments.
Ideally, the equalization is adjusted in the final application to
provide optimal performance with the specific DVI/HDMI
transmitter and cable used. In general, the amount of
equalization required is proportional to the cable length. If
the equalization must be fixed (can not be adjusted in the
final application), an equalization setting of 0xA works well
with short cables as well as medium to longer cables.
Typical Performance
Setup A (Figure 2) was used to capture the TMDS eye
diagrams shown in Figure 3 and Figure 4:
CHROMA 2326
VIDEO PATTERN
GENERATOR @
UXGA 60Hz
15m DUAL-LINK
DVI CABLE
FIGURE 3
DELL 2000FP
UXGA MONITOR
FIGURE 4
FIGURE 2. TEST SETUP A
The 162.5Mpixel/s (UXGA 60Hz) DVI output of the Chroma
2326 was terminated into a TPA2 Plug adapter and
measured with a LeCroy differential probe and 6MHz SDA
using the LeCroy’s software clock recovery. As Figure 3
shows, the amplitude of the TMDS signal is slightly low, but
the eye is otherwise acceptable.
Tx Pre-emphasis
The transmit pre-emphasis function sinks additional current
during the first bit after every transition, increasing the slew
rate for a given capacitance, and helping to maintain the
slew rate when using longer/higher capacitance cables.
Pre-emphasis is controlled by register 0x06 bits 7:4, and
ranges from a minimum of 0mA (no pre-emphasis) to
1.875mA (max pre-emphasis).
9
FIGURE 3. EYE DIAGRAM AT OUTPUT OF CHROMA
GENERATOR
FN6723.0
June 11, 2008
ISL54105
Next, a 15m DualLink DVI cable was attached and
terminated into a female TPA2 adapter and the eye captured
in Figure 4.
FIGURE 6. EYE DIAGRAM AT OUTPUT OF ISL54105
FIGURE 4. CHROMA EYE DIAGRAM AFTER 15m CABLE
The eye is not meeting the minimum requirements of either
the HDMI or DVI standards and the Dell Monitor is unable to
recover the data and display an image.
The cleaner signal generated at the output of the ISL54105
results in an improved eye at the end of another 15m cable
(Figure 7). The eye is open enough that the Dell 2000FP can
now display a UXGA image with no visible sparkle or other
artifacts.
Setup B inserts an ISL54105 and an additional 15m cable
between the pattern generator and the monitor:
CHROMA 2326
VIDEO PATTERN
GENERATOR
FIGURE 3
15m DUAL-LINK
DVI CABLE
FIGURE 4
ISL54105
FIGURE 7
15m DUAL-LINK
DVI CABLE
DELL 2000FP
UXGA MONITOR
FIGURE 6
FIGURE 5. TEST SETUP B
Given the input signal shown in Figure 4, the ISL54105’s
TMDS output signal (Figure 6) is extremely clean. The
output is an improvement over the original signal coming
from the pattern generator in both amplitude and jitter.
FIGURE 7. ISL54105 EYE DIAGRAM AFTER 15m CABLE
Tx Loading Considerations
When the ISL54105 is powered-up and its Tx outputs are
disabled, via either the PD (power-down) pin, the
power-down register bit (register 0x02[5]), or the tri-state
outputs bits (register 0x05[1:0]), the Tx pins are high
impedance. In this state, they will draw no current from the
Rx pins of any TMDS receiver they may be connected to.
However, if power to the ISL54105 is removed, the Tx pins
are no longer high-impedance. Figure 8 shows the relevant
equivalent circuit, including the internal ESD protection
diodes. For simplicity, only one of the eight Tx outputs, ESD
protection diodes, and Rx termination resistors are shown.
When VD to the ISL54105 drops below ~2.7V and power is
applied to the external TMDS receiver, ESD protection
diodes inside the ISL54105 can become forward-biased,
10
FN6723.0
June 11, 2008
ISL54105
drawing current from the external TMDS receiver it is
attached to.
3.3VTX
3.3VRX
VD
TABLE 1. VERSION/LAYOUT MATRIX
RxN
VD_ESD
50
(41, 53)
Tx
TxN
This is non-ideal and can cause the ISL54105 to fail HDMI
Compliance Test 7-3 (“VOFF”). VOFF is the voltage across
each 50Ω RxN resistor when the power is removed from the
device containing the ISL54105.
Modifying the PCB layout per Figure 9 to add a Schottky
diode between the VD power net and the VD_ESD pins,
eliminates current flow from the ESD bus into VD. This
reduces the amount of current drawn from the Tx supply, but
there is still some circuitry attached to the internal ESD bus
that will sink some current. So the current drawn from Rx will
be lower than if the diode were not there (reducing the VOFF
magnitude), but still not low enough to pass Test 7-3.
3.3VRX
VD
RxN
50
D1
FIGURE 9
ISL54105
Fails 7-3
Fails 7-3 (not as badly)
ISL54105A
Fails 7-3
Passes 7-3
The read pointers for Channel 0, 1, and 2 of the FIFO that
follows the CDR all have the same clock, so all 3 channels
transition within a few picoseconds of each other - there is
essentially no skew between the transitions of the three
channels.
However the FIFO read pointers may be positioned up to 2
bits apart relative to each other, introducing a random, fixed
channel-to-channel skew of skew of 1 or (much less
frequently) 2 bits. The random skew is introduced whenever
there is a discontinuity in the input signal (typically a video
mode change or a new mux channel selection). After the
CDRs and PLL lock, the skew is fixed until the next
discontinuity. This adds up to 2 bits of skew in addition to any
incoming skew, as shown in the following examples.
Figure 10 shows an input (the top three signals) with
essentially no skew. After the ISL54105 locks on to the
signal, there may be 1 bit of skew on the output, as shown in
Figure 10.
(41, 53)
C1
0.1μF
FIGURE 8
Inter-Pair (Channel-to-Channel) Skew
FIGURE 8. ISL54105 ESD PROTECTION DIODES
VD_ESD
VERSION
Intersil recommends adding the Schottky circuit to all
designs to reduce Rx current drain in systems using the
original version and completely eliminate it in systems using
the ISL54105A.
ISL54105
3.3VTX
Using the ISL54105A in a layout designed for the ISL54105
(Figure 8) will result in the same behavior as the original
version. See Table 1 for the full matrix.
Tx
TxN
INPUT SKEW
(none, in this
example)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
B
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
B
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
B
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
Bit 7
B
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
B
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
B
ISL54105
FIGURE 9. SCHOTTKY DIODE MODIFICATION
Intersil is currently sampling the ISL54105A, which is fully
compliant with Test 7-3 when applied using the circuit shown
in Figure 9. The ISL54105A is 100% drop-in and backwards
compatible with the ISL54105.
OUTPUT SKEW
(1 bit – 615ps at
162.5Mpixels/s)
FIGURE 10. MAXIMUM ADDITIONAL INTERCHANNEL SKEW
FOR INPUTS WITH NO OR LITTLE SKEW
When there is pre-existing skew on the input, the ISL54105
can add up to 2 bits to the channel-to-channel skew. In the
example in Figure 11, the incoming red channel has 2.3 bits
11
FN6723.0
June 11, 2008
ISL54105
of skew relative to the incoming green and blue. The FIFO’s
quantization (worst case) increases the total skew to 4.0 bits.
Bit 5
INPUT SKEW
(2.3 bits/1.4ns
in this example)
OUTPUT SKEW
(4 bits/2.5ns at
162.5Mpixels/s)
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
Bit 7
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
Bit 7
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
Bit 7
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 9
Bit 8
FIGURE 11. MAXIMUM ADDITIONAL INTERCHANNEL SKEW
FOR INPUTS WITH MODERATE TO LARGE
SKEW
While increasing skew is not desirable, DVI and HDMI
receivers are required to have a minimum of 6 bits of
inter-pair skew tolerance, so the addition of 2 bits of skew is
only a problem with the most pathological cables and
transmitters. It does, however, limit the number of ISL54105s
that can be put in series (although statistically, it is unlikely
that all the skews would line up in a worst-case
configuration).
(such as vias and circuitous paths) can be taken when
routing the clock lines.
• Minimize capacitance on all TMDS lines. The lower the
capacitance, the sharper the rise and fall times.
• Maintain a constant, solid ground (or power) plane under
the 3 high speed TMDS signals. Do not route the signals
over gaps in the ground plane or over other traces.
• Ideally each supply should be bypassed to ground with a
0.1µF capacitor. Minimize trace length and vias to
minimize inductance and maximize noise rejection.
Figure 12 demonstrates a common but non-ideal PCB
layout and its equivalent circuit. The additional trace
resistance between the bypass capacitor and the power
supply/IC reduces its effectiveness. Figure 13
demonstrates a better layout. In this case there is still
series trace resistance (it is impossible to completely
eliminate it), but now it is being put to good use, as part of
a “T” filter, attenuating supply noise before it gets to the IC,
and reducing the amount of IC-generated noise that gets
injected into the supply. Follow the good supply bypassing
rules shown in Figure 13 to the extent possible.
VIA TO
POWER
PLANE
V+
CBYPASS
GND
VIAS
TO
GND
PCB Layout Recommendations
Because of the high speed of the TMDS signals, careful
PCB layout is critical to maximize performance. The
following guidelines should be adhered to as closely as
possible:
• All TMDS pair traces should have a characteristic
impedance of 50Ω with respect to the power/ground
planes and 100Ω with respect to each other. Failure to
meet this requirement will increase reflections, shrinking
the available eye.
• Avoid vias for all 3 high speed TMDS pairs. Vias add
inductance which causes a discontinuity in the
characteristic impedance of the trace. Keep all the traces
on the top (or the bottom) of the PCB. The TMDS clock
can have vias if necessary, since it is lower speed and less
critical. If you must use a via, ensure the vias are
symmetrical (put identical vias in both lines of the
differential pair).
IC
EQUIVALENT CIRCUIT
POWER PLANE
RVIA
RTRACE
RTRACE
V+
V+
CBYPASS
IC
GND
GROUND PLANE
FIGURE 12. SUB-OPTIMAL BYPASS CAPACITOR LAYOUT
• For each TMDS channel, the trace lengths of the 3 TMDS
pairs (0, 1 and 2) should ideally be the same to reduce
inter channel skew introduced by the board.
• The trace length of the clock pair is not critical at all.
Since the clock is only used as a frequency reference, its
phase/delay is inconsequential. In addition, since the
TMDS clock frequency is 1/10th the pixel rate, the clock
signal itself is much more noise-immune. So liberties
12
FN6723.0
June 11, 2008
ISL54105
The ISL54105 has a 7-bit address on the serial bus,
determined by the ADDR0-ADDR6 bits. This allows up to
128 ISL54105s to be independently controlled by the same
serial bus.
VIA TO
POWER
PLANE
V+
CBYPASS
IC
The bus is nominally inactive, with SDA and SCL high.
Communication begins when the host issues a START
command by taking SDA low while SCL is high (Figure 14).
The ISL54105 continuously monitors the SDA and SCL lines
for the start condition and will not respond to any command
until this condition has been met. The host then transmits the
7-bit serial address plus a R/W bit, indicating if the next
transaction will be a Read (R/W = 1) or a Write (R/W = 0). If
the address transmitted matches that of any device on the
bus, that device must respond with an ACKNOWLEDGE
(Figure 15).
GND
VIAS
TO
GND
EQUIVALENT CIRCUIT
POWER PLANE
RVIA
RTRACE
RTRACE
V+
V+
CBYPASS
IC
GND
GROUND PLANE
FIGURE 13. OPTIMAL (“T”) BYPASS CAPACITOR LAYOUT
ISL54105 Serial Communication
Overview
The ISL54105 uses a 2-wire serial bus for communication
with its host. SCL is the Serial Clock line, driven by the host
and SDA is the Serial Data line, which can be driven by all
devices on the bus. SDA is open drain to allow multiple
devices to share the same bus simultaneously.
Communication is accomplished in three steps:
1. The Host selects the ISL54105 it wishes to communicate
with.
2. The Host writes the initial ISL54105 Configuration
Register address it wishes to write to or read from.
3. The Host writes to or reads from the ISL54105’s
Configuration Register. The ISL54105’s internal address
pointer auto increments, so to read registers 0x00
through 0x1B, for example, one would write 0x00 in step
2, then repeat step three 28 times, with each read
returning the next register value.
Once the serial address has been transmitted and
acknowledged, one or more bytes of information can be
written to or read from the slave. Communication with the
selected device in the selected direction (read or write) is
ended by a STOP command, where SDA rises while SCL is
high (Figure 14), or a second START command, which is
commonly used to reverse data direction without
relinquishing the bus.
Data on the serial bus must be valid for the entire time SCL
is high (Figure 16). To achieve this, data being written to the
ISL54105 is latched on a delayed version of the rising edge
of SCL. SCL is delayed and deglitched inside the ISL54105
for three crystal clock periods (120ns for a 25MHz crystal) to
eliminate spurious clock pulses that could disrupt serial
communication.
When the contents of the ISL54105 are being read, the SDA
line is updated after the falling edge of SCL, delayed and
deglitched in the same manner.
Configuration Register Write
Figure 17 shows two views of the steps necessary to write
one or more words to the Configuration Register.
Configuration Register Read
Figure 18 shows two views of the steps necessary to read
one or more words from the Configuration Register.
SCL
SDA
START
STOP
FIGURE 14. VALID START AND STOP CONDITIONS
13
FN6723.0
June 11, 2008
ISL54105
SCL FROM
HOST
1
8
9
DATA OUTPUT
FROM TRANSMITTER
DATA OUTPUT
FROM RECEIVER
START
ACKNOWLEDGE
FIGURE 15. ACKNOWLEDGE RESPONSE FROM RECEIVER
SCL
SDA
DATA STABLE
DATA CHANGE
DATA STABLE
FIGURE 16. VALID DATA CHANGES ON THE SDA BUS
Signals the beginning of serial I/O
START Command
ISL54105 Serial Bus
R/W
ISL54105 Device Select Address Write
ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0
The first 7 bits of the first byte select the ISL54105 on the 2-wire
bus at the address set by the ADDR[6:0} pins. The R/W bit is a
0, indicating that the next transaction will be a write.
0
ISL54105 Register Address Write
A7
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
This is the address of the ISL54105’s configuration register that
the following byte will be written to.
ISL54105 Register Data Write(s)
This is the data to be written to the ISL54105’s configuration register.
Note: The ISL54105’s Configuration Register’s address pointer auto
increments after each data write: repeat this step to write multiple
sequential bytes of data to the Configuration Register.
(Repeat if desired)
Signals the ending of serial I/O
STOP Command
Signals from
the Host
SDA Bus
Signals from
the ISL54105
S
T Serial Bus
A
R Address
T
Register
Address
aaaaaaa0
AAAAAAAA
A
C
K
S
T
O
P
Data
Write*
* The data write step may be repeated to write to the
ISL54105’s Configuration Register sequentially, beginning at
the Register Address written in the previous step.
dddddddd
A
C
K
A
C
K
FIGURE 17. CONFIGURATION REGISTER WRITE
14
FN6723.0
June 11, 2008
ISL54105
Signals the beginning of serial I/O
START Command
ISL54105 Serial Bus
R/W
ISL54105 Device Select Address Write
ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0
A7
A6
A5
A4
A3
A2
A1
0
The first 7 bits of the first byte select the ISL54105 on the 2-wire
bus at the address set by the ADDR[6:0} pins. R/W = 0,
indicating that the next transaction will be a write.
ISL54105 Register Address Write
A0
This sets the initial address of the ISL54105’s configuration
register for subsequent reading.
Ends the previous transaction and starts a new one
ISL54105 Serial Bus
R/W
ISL54105 Serial Bus Address Write
ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0
1
START Command
This is the same 7-bit address that was sent previously, however
the R/W bit is now a 1, indicating that the next transaction(s) will
be a read.
ISL54105 Register Data Read(s)
D7
D6
D5
D4
D3
D2
D1
D0
Note: The ISL54105’s Configuration Register’s address pointer
auto increments after each data read: repeat this step to read
multiple sequential bytes of data from the Configuration Register.
Signals the ending of serial I/O
(Repeat if desired)
STOP Command
Signals from
the Host
SDA Bus
Signals from
the ISL54105
S
T Serial Bus
A
R Address
T
R
E
S
T Serial Bus
A Address
R
T
Register
Address
aaaaaaa0
AAAAAAAA
A
C
K
This is the data read from the ISL54105’s configuration register.
Data
Read*
aaaaaaa1
A
C
K
S
T
O
AP
C
K
* The data read step may be repeated to read
from the ISL54105’s Configuration Register
sequentially, beginning at the Register
Address written in the two steps previous.
Adddddddd
C
K
FIGURE 18. CONFIGURATION REGISTER READ
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
15
FN6723.0
June 11, 2008
ISL54105
Package Outline Drawing
L72.10x10B
72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN)
Rev 0, 5/07
10.00
A
9.75
X
B
EXPOSED PAD AREA
Z
72
72
1
6
PIN 1
INDEX AREA
1
9.75
8.50 REF.
(4X)
6
PIN #1 INDEX AREA
10.00
68X 0.50
4 0.23
(4X)
0.15
72X 0.40 ±0.1 mm
4.70 REF.
(4X)
TOP VIEW
0.100 M C A B
BOTTOM VIEW
PACKAGE OUTLINE
R0.200
10.00
0.450
4.70
(0
.1
AR 2 5
O )
U
N
D
)
(68X 0.50)
C0.400 X 45°
(4X)
(72X 0.23)
(A
L
(72X 0.20)
(72X 0.60)
LL
R0.200
TYP.
1
TYPICAL RECOMMENDED LAND PATTERN
DETAIL “X”
72
R0.115
TYP.
DETAIL “Z”
11° ±1° ALL AROUND
Y
9.75
10.00
R0.200 MAX
ALL AROUND
SIDE VIEW
0.100 C
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
0.65
0.85
2. Dimensioning and tolerancing conform to JESD-MO220.
3. Unless otherwise specified, tolerance : Decimal ± 0.05;
body tolerance: ±0.1mm
0.19~ 0.245
SEATING
PLANE
0.08 C
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
16
e
0.25 ±0.02
C
b
0.100 M C A B
0.050 M C
DETAIL “Y”
FN6723.0
June 11, 2008
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