PANASONIC DZ2J140

DZ2J140
Silicon epitaxial planar type
Unit: mm
For constant voltage / For surge absorption circuit
 Features
 Excellent rising characteristics of zener current Iz
 Low zener operating resistance RZ
 Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
 Marking Symbol: TJ, TU
 Packaging
DZ2J140×0L Embossed type (Thermo-compression sealing): 3 000 pcs / reel (standard)
 Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Repetitive peak forward current
IFRM
200
mA
Total power dissipation *1
PT
200
mW
Electrostatic discharge *2
ESD
±8
kV
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
1: Cathode
2: Anode
Panasonic
JEITA
Code
SMini2-F5-B
SC-90A

Note) *1: Mounted on glass epoxy print board. (45 mm × 45 mm × 1 mm)
Solder in (Recommended land pattern)
*2: Test method:IEC61000-4-2 (C = 150 pF, R = 330 Ω, Contact discharge:10 times)
 Common Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
1.0
V
14.70
V
Forward voltage
VF
IF = 10 mA
Zener voltage *1, 2, 4
VZ
IZ = 5 mA
Zener operating resistance
RZ
IZ = 5 mA
40
W
Zener rise operating resistance
RZK
IZ = 0.5 mA
80
W
Reverse current
IR
VR = 10.0 V
0.05
mA
Temperature coefficient of zener voltage *3
SZ
IZ = 5 mA
13.30
11.6
mV/°C
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Absolute frequency of input and output is 5 MHz.
3. *1: The temperature must be controlled 25°C for VZ measurement. VZ value measured at other temperature must be adjusted to VZ (25°C)
*2 : VZ guaranteed 20 ms after current flow.
*3 : Tj = 25°C to 150°C
*4 : Rank classification
Code
M
0
Rank
M
No-rank
VZ
13.65 to 14.35
13.30 to 14.70
Marking Symbol
TU
TJ
Publication date: June 2012
Ver. DED
1
DZ2J140
DZ2J140_IF-VF
103
IZ  VZ
102
Ta = 25°C
1
10−1
10−5
1
10−1
10−2
0.4
0.8
1.2
Forward voltage VF (V)
10−3
0
5
10
100
16
12
8
4
0
0
2
4
6
8
Zener current IZ (mA)
(2)
Rth(j-l) = 80°C/W
102
0.9
10
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
(45 mm × 45 mm × 1 mm)
0.9
Solder in :
0.9
50
80
120
160
Ambient temperature Ta (°C)
2
5
0
0
200
1
10−3
1.1
10−1
10
Time t (s)
Ver. DED
2
4
6
8
10
Reverse voltage VR (V)
12
PZSM  tW
2.4
Thermal resistance Rth (°C/W)
0.9
0.9
100
12
DZ2J024_PZSM-tW
(1)
1.1
10
10
10
103
2.4
150
8
15
Rth  t
200
6
Ct  VR
DZ2J__Rth-t
Mounted on glass epoxy print board.
(45 mm × 45 mm × 1 mm)
Solder in :
0.9
4
Ta = 25°C
PT  Ta
40
2
Reverse voltage VR (V)
20
DZ2J__ PT-Ta
0
0
DZ2J140_Ct-VR
20
Zener current IZ (mA)
0
10−11
Terminal capacitance Ct (pF)
Temparature coefficient of zener voltage SZ (mV/°C)
10
250
25
SZ  IZ
100
1
20
10−9
DZ2J140_SZ-IZ
Ta = 25°C
1
0.1
15
Zener voltage VZ (V)
RZ  IZ
1 000
10
10−7
103
Non-repetitive reverse surge power dissipation PZSM (W)
0
DZ2J140_RZ-IZ
Zener operating resistance RZ (Ω)
Ta = 25°C
Ta = 25°C
Reverse current IR (mA)
10
10−2
Total power dissipation PT (mW)
IR  VR
10
Zener current IZ (mA)
Forward current IF (mA)
102
10−3
DZ2J140_IR-VR
DZ2J140_IZ-VZ
IF  VF
102
Ta = 25°C
10
1
10−1 2
10
103
Pulse width tW (µs)
104
DZ2J140
SMini2-F5-B
Unit: mm
1.25 ±0.10
+0.05
0.35 ±0.05
0.13 −0.02
2.50 ±0.20
1.70 ±0.10
2
5°
0 to 0.05
0.40 ±0.10
1
0.50 ±0.05
(0.15)
0.70 ±0.10
5°
 Land Pattern (Reference) (Unit: mm)
Ver. DED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
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Consult our sales staff in advance for information on the following applications:
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Standards in advance to make sure that the latest specifications satisfy your requirements.
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defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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