VS-GB75YF120UT Datasheet

VS-GB75YF120UT
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Vishay Semiconductors
IGBT 4 pack Module, 75 A
FEATURES
• Square RBSOA
• HEXFRED® low Qrr, low switching energy
• Positive VCE(on) temperature coefficient
• Copper baseplate
• Low stray inductance design
• UL approved file E78996
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
ECONO2 4 pack
BENEFITS
PRODUCT SUMMARY
• Benchmark efficiency for SMPS appreciation in particular
HF welding
VCES
1200 V
IC at TC = 67 °C
75 A
• Rugged transient performance
VCE(on) (typical)
3.4 V
• Low EMI, requires less snubbing
Speed
8 kHz to 30 kHz
Package
ECONO2 4 pack
Circuit
4 pack with thermistor
• Direct mounting to heatsink space saving
• PCB solderable terminals
• Low junction to case thermal resistance
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Collector to emitter voltage
Continuous collector current
SYMBOL
TEST CONDITIONS
VCES
IC
Pulsed collector current (See fig. C.T.5)
ICM
Clamped inductive load current
ILM
TC = 25 °C
TC = 80 °C
MAX.
UNITS
1200
V
100
67
200
200
TC = 25 °C
Diode continuous forward current
IF
Diode maximum forward current
IFM
150
Gate to emitter voltage
VGE
± 20
Maximum power dissipation (IGBT)
PD
Maximum operating junction temperature
TC = 80 °C
A
60
40
TC = 25 °C
480
TC = 80 °C
270
TJ
150
Storage temperature range
TStg
-40 to +125
Isolation voltage
VISOL
AC 2500 (min)
V
W
°C
V
Revision: 05-Apr-16
Document Number: 93172
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown voltage
Collector to emitter voltage
Gate threshold voltage
Threshold voltage temperature coefficient
Zero gate voltage collector current
SYMBOL
VBR(CES)
VCE(ON)
VGE(th)
VGE(th)/TJ
ICES
Diode forward voltage drop
VFM
Gate to emitter leakage current
IGES
TEST CONDITIONS
VGE = 0 V, IC = 500 μA
MIN.
TYP.
MAX.
1200
-
-
IC = 75 A, VGE = 15 V
-
3.4
4.0
IC = 100 A, VGE = 15 V
-
3.8
4.5
IC = 75 A, VGE = 15 V, TJ = 125 °C
-
4.0
4.5
IC = 100 A, VGE = 15 V, TJ = 125 °C
-
4.53
5.1
VCE = VGE, IC = 250 μA
UNITS
V
4.0
5.0
6.0
VCE = VGE, IC = 1 mA (25 °C to 125 °C)
-
-11
-
VGE = 0 V, VCE = 1200 V
-
7
250
VGE = 0 V, VCE = 1200 V, TJ = 125 °C
-
580
2000
IF = 75 A
-
3.7
4.9
IF = 100 A
-
4.1
5.5
IF = 75 A, TJ = 125 °C
-
3.7
5.1
IF = 100 A, TJ = 125 °C
-
4.2
5.7
VGE = ± 20 V
-
-
± 200
nA
MIN.
TYP.
MAX.
UNITS
-
630
-
-
65
-
mV/°C
μA
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Total gate charge (turn-on)
QG
Gate to emitter charge (turn-on)
QGE
Gate to collector charge (turn-on)
QGC
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on delay time
td(on)
Rise time
Turn-off delay time
Fall time
tr
td(off)
TEST CONDITIONS
IC = 75 A
VCC = 600 V
VGE = 15 V
IC = 75 A, VCC = 600 V
VGE = 15 V, Rg = 5 , L = 500 μH
TJ = 25 °C (1)
IC = 75 A, VCC = 600 V
VGE = 15 V, Rg = 5 , L = 500 μH
TJ = 125 °C (1)
IC = 75 A, VCC = 600 V
VGE = 15 V, Rg = 5 , L = 500 μH
TJ = 125 °C
tf
Reverse bias safe operating area
RBSOA
TJ = 150 °C, IC = 200 A
Rg = 10 , VGE = 15 V to 0 V
Short circuit safe operating area
SCSOA
TJ = 150 °C
VCC = 900 V, VP = 1200 V
Rg = 10 , VGE = 15 V to 0 V
Diode peak reverse recovery current
Irr
Diode reverse recovery time
trr
Total reverse recovery charge
Qrr
-
250
-
-
1.74
-
-
1.46
-
-
3.20
-
-
2.44
-
-
2.35
-
-
4.79
-
-
268
-
-
43
-
-
308
-
-
127
-
-
-
TJ = 25 °C
-
13
18
TJ = 125 °C
-
19
23
-
132
189
-
200
270
TJ = 125 °C
VCC = 200 V
IF = 50 A
dI/dt = 10 A/μs
mJ
ns
Fullsquare
10
TJ = 25 °C
nC
TJ = 25 °C
-
858
1700
TJ = 125 °C
-
1900
3105
μs
A
ns
nC
Note
(1) Energy losses include “tail” and diode reverse recovery
Revision: 05-Apr-16
Document Number: 93172
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INTERNAL NTC - THERMISTOR SPECIFICATIONS
PARAMETER
SYMBOL
VALUE
UNITS
R25
TC = 25 °C
5000
R100
TC = 100 °C
493 ± 5 %

R2 = R25 exp. [B25/50 (1/T2 - 1/(298.15 K))]
3375 ± 5 %
K
220
°C
Dissipation constant
2
mW/°C
Thermal time constant
8
s
UNITS
Resistance
B-value
B25/50
TEST CONDITIONS
Maximum operating temperature
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Junction to case IGBT
Junction to case DIODE
Case to sink, flat, greased surface
SYMBOL
MIN.
TYP.
MAX.
RthJC (IGBT)
-
-
0.26
RthJC (DIODE)
-
-
0.56
RthCS (MODULE)
-
0.02
-
2.7
-
3.3
Nm
-
170
-
g
Mounting torque (M5)
Weight
°C/W
1000
160
140
100
100
10
IC (A)
TC (°C)
120
80
60
1
40
0.1
20
0
0.01
0
20
40
60
80
100
120
1
10
100
IC (A)
1000
10000
VCE (V)
Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
Fig. 3 - Forward SOA
TC = 25 °C; TJ  150 °C
1000
500
400
IC (A)
PD (W)
100
300
200
10
100
0
1
0
20
40
60
80
100 120 140 160
TC (°C)
Fig. 2 - Power Dissipation vs. Case Temperature
10
100
1000
10000
VCE (V)
Fig. 4 - Reverse Bias SOA
TJ = 150 °C; VGE = 15 V
Revision: 05-Apr-16
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160
Vishay Semiconductors
20
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 9V
140
120
VCE (V)
100
ICE (A)
16
ICE = 75A
ICE = 50A
14
ICE = 25A
18
80
60
12
10
8
6
40
4
20
2
0
0
0
1
2
3
4
5
7
6
9
11
15
17
19
VGE (V)
VCE (V)
Fig. 5 - Typical IGBT Output Characteristics
TJ = 25 °C; tp = 500 μs
Fig. 8 - Typical VCE vs. VGE
TJ = 25 °C
20
160
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 9V
140
120
ICE = 75A
ICE = 50A
18
16
ICE = 25A
14
VCE (V)
100
ICE (A)
13
80
60
12
10
8
6
40
4
20
2
0
0
1
2
3
4
5
6
7
7
8
9
11
13
15
17
VCE (V)
VGE (V)
Fig. 6 - Typical IGBT Output Characteristics
TJ = 125 °C; tp = 500 μs
Fig. 9 - Typical VCE vs. VGE
TJ = 125 °C
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
19
300
TJ = 25°C
TJ = 125°C
250
200
ICE (A)
IF (A)
0
150
100
Tj = 25°C
Tj = 125°C
50
0
0.0
1.0
2.0
3.0
4.0
5.0
5
6
7
8
9
10
11
12
VF (V)
VGE (V)
Fig. 7 - Typical Diode Forward Characteristics
tp = 500 μs
Fig. 10 - Typical Transfer Characteristics
VCE = 20 V; tp = 500 μs
Revision: 05-Apr-16
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1000
1
tdOFF
Switching Time (ns)
TJ = 125°C
ICES (mA)
0.1
0.01
tdON
tF
100
tR
TJ = 25°C
10
0.001
400
600
800
1000
20
1200
30
40
50
Fig. 11 - Typical Zero Gate Voltage Collector Current
80
Fig. 14 - Typical Switching Time vs. IC
TJ = 125 °C; L = 500 μH; VCC = 600 V, Rg = 5 ; VGE = 15 V
5.5
14000
5
12000
TJ = 25°C
4.5
10000
Energy (μJ)
Vgeth (V)
70
IC (A)
VCES (V)
4
TJ = 125°C
3.5
8000
EON
6000
3
4000
2.5
2000
2
EOFF
0
0
0.2
0.4
0.6
0.8
1
0
10
20
30
40
50
RG (Ω)
IC (mA)
Fig. 15 - Typical Energy Loss vs. Rg
TJ = 125 °C; L = 500 μH; VCC = 600 V, IC = 75 A; VGE = 15 V
Fig. 12 - Typical Threshold Voltage
2500
Switching Time (ns)
10000
2000
Energy (μJ)
60
EON
EOFF
1500
1000
tdOFF
tdON
tF
100
tR
1000
30
40
50
60
70
80
IC (A)
Fig. 13 - Typical Energy Loss vs. IC
TJ = 125 °C; L = 500 μH; VCC = 600 V, Rg = 5 ; VGE = 15 V
10
0
10
20
30
40
50
RG (Ω)
Fig. 16 - Typical Switching Time vs. Rg
TJ = 125 °C; L = 500 μH; VCC = 600 V, IC = 75 A; VGE = 15 V
Revision: 05-Apr-16
Document Number: 93172
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100
120
100
80
5 ohm
60
IRR (A)
IRR (A)
80
60
27 ohm
40
40
20
47 ohm
20
0
0
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
0
10
20
30
40
50
RG (Ω)
IF (A)
Fig. 19 - Typical Diode IRR vs. Rg
TJ = 125 °C; IF = 75 A
Fig. 17 - Typical Diode IRR vs. IF
TJ = 125 °C
100
16
14
80
10
60
VGE (V)
IRR (A)
12
40
typical value
8
6
4
20
2
0
400
800
1200
1600
0
2000
0
100
200
300
400
500
600
700
dIF / dt (A/ μs)
QG, Total Gate Charge (nC)
Fig. 18 - Typical Diode IRR vs. dIF/dt
VCC = 600 V; IF = 75 A
Fig. 20 - Typical Gate Charge vs. VGE
ICE = 5.0 A; L = 600 μH
1
Thermal Response (ZthJC )
D = 0.50
0.1
0.20
0.10
0.05
0.01
0.001
0.0001
1E-005
1E-006
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
0.001
0.01
0.1
1
10
t1, Rectangular Pulse Duration (s)
Fig. 21 - Maximum Transient Thermal Impedance, Junction to Case (IGBT)
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Driver
L
+ VCC
-
D.U.T.
0
D +
C -
1K
900 V
D.U.T.
Fig. 22 - Gate Charge Circuit (Turn-Off)
Fig. 24 - S.C. SOA Circuit
L
Diode clamp/
D.U.T.
+
-
80 V
L
+
-
-5V
D.U.T.
D.U.T./
Driver
1000 V
Rg
+
VCC
Rg
Fig. 23 - RBSOA Circuit
Fig. 25 - Switching Loss Circuit
R=
VCC
ICM
D.U.T.
+
VCC
Rg
Fig. 26 - Resistive Load Circuit
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ORDERING INFORMATION TABLE
Device code
VS-
G
B
75
Y
F
120
U
T
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Insulated gate bipolar transistor (IGBT)
3
-
B = IGBT Gen 5
4
-
Current rating (75 = 75 A)
5
-
Circuit configuration (Y = 4 pack)
6
-
Package indicator (F = ECONO2)
7
-
Voltage rating (120 = 1200 V)
8
-
Speed/type (U = Ultrafast IGBT)
9
-
T = Thermistor
CIRCUIT CONFIGURATION
48 49
21 22
QB1
QB3
41
28
43
QB2
29
5
6
7
15
16
17
QB4
37
32
38
33
10
12
23 24
46 47
NTC
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95540
Revision: 05-Apr-16
Document Number: 93172
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Outline Dimensions
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ECONO2 4PACK U Series
DIMENSIONS in millimeters
Y2:1
1
Z2:1
0.85
0.6
0.5
1.15 -- 0.02
0.06
0.8 ± 0.03
Ø 6 (x 4)
Ø 4.5
Ø 2.2
13.2 ± 0.15
105 ± 0.1
see note (1)
1.15 -- 0.02
0.06
+ 10
20.5 - 0.5
Ø 2.6
Y
7.5
Z
1.5
17 ± 0.5
X2:1
30.48
0.8 ± 0.03
22.86
22.86
11.43 11.43
5 6 7
10
12
11.43
15.24
19.05
7.62 7.62
21 ± 0.03
21 22
49 48
10.5
45.4 ± 0.2
Ø 5.5 ± 0.05
11.43 11.43
29 28
23 24
33 32
47 46
38 37
42 ± 0.15
43 41
21 ± 0.03
7.62 7.62
15 16 17
7.62
7.5 - 0.3
19.05
22.86
26.67
39.49
39.49
93 ± 0.15
107.8 ± 0.2
Revision: 21-Mar-13
Document Number: 95540
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
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Revision: 02-Oct-12
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Document Number: 91000