DATASHEET

NS
ESIG
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®
DU C
D FO E PROSingle
Digitally Controlled Potentiometer
E
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M M E B S TI TU
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SU
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2316
NOT SSIBLE Data
September 9, 2009
ISL2 Sheet
PO
ISL22416
Low Noise, Low Power, SPI® Bus, 128 Taps
Features
The ISL22416 integrates a single digitally controlled
potentiometer (DCP) and non-volatile memory on a
monolithic CMOS integrated circuit.
• 128 resistor taps
The digitally controlled potentiometer is implemented with a
combination of resistor elements and CMOS switches. The
position of the wiper is controlled by the user through the SPI
serial interface. The potentiometer has an associated
volatile Wiper Register (WR) and a non-volatile Initial Value
Register (IVR) that can be directly written to and read by the
user. The contents of the WR controls the position of the
wiper. At power-up, the device recalls the contents of the
DCP’s IVR to the WR.
• Non-volatile storage of wiper position
(XDCP™)
FN6227.2
• SPI serial interface
• Wiper resistance: 70 typical @ VCC = 3.3V
• Shutdown mode
• Shutdown current 5µA max
• Power supply: 2.7V to 5.5V
• 50kor 10k total resistance
• High reliability
- Endurance: 1,000,000 data changes per bit per register
- Register data retention: 50 years @ T  +55°C
The DCP can be used as a three-terminal potentiometer or
as a two-terminal variable resistor in a wide variety of
applications including control, parameter adjustments, and
signal processing.
• 10 Ld MSOP and 10 Ld TDFN package
• Pb-free (RoHS compliant)
Pinout
ISL22416
(10 LD TDFN)
TOP VIEW
ISL22416
(10 LD MSOP)
TOP VIEW
SCK
1
10
VCC
SCK
1 O
10 VCC
SDO
2
9
RH
SDO
2
9 RH
SDI
3
8
RW
SDI
3
8 RW
4
7
RL
CS
4
7 RL
SHDN
5
6 GND
CS
SHDN
5
6
GND
Ordering Information
PART NUMBER
(Note)
PART MARKING
RESISTANCE OPTION
(k)
TEMP. RANGE
(°C)
PACKAGE
(Pb-free)
PKG. DWG. #
ISL22416UFU10Z*
416UZ
50
-40 to +125
10 Ld MSOP
M10.118
ISL22416UFRT10Z*
416U
50
-40 to +125
10 Ld 3x3 TDFN
L10.3x3B
ISL22416WFU10Z*
416WZ
10
-40 to +125
10 Ld MSOP
M10.118
ISL22416WFRT10Z*
416W
10
-40 to +125
10 Ld 3x3 TDFN
L10.3x3B
*Add “-TK” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) and XDCP are registered trademarks of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2006, 2008, 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL22416
Block Diagram
VCC
SCK
SDO
SPI
INTERFACE
SDI
CS
POWER-UP
INTERFACE,
CONTROL
AND
STATUS
LOGIC
RH
WR
RL
IVR
NON-VOLATILE
REGISTER
SHDN
RW
GND
Pin Descriptions
MSOP/TDFN PIN NUMBER
SYMBOL
1
SCK
SPI interface clock input
2
SDO
Push-pull/Open Drain Data Output of the SPI serial interface
3
SDI
Data Input of the SPI serial interface
4
CS
Chip Select active low input
5
SHDN
6
GND
7
RL
“Low” terminal of DCP
8
RW
“Wiper” terminal of DCP
9
RH
“High” terminal of DCP
10
VCC
Power supply pin
2
DESCRIPTION
Shutdown active low input
Device ground pin
FN6227.2
September 9, 2009
ISL22416
Absolute Maximum Ratings
Thermal Information
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage at any Digital Interface Pin
with Respect to GND . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Voltage at any DCP pin with Respect to GND . . . . . . . -0.3V to VCC
IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
Latchup (Note 1) . . . . . . . . . . . . . . . . . . Class II, Level B @ +125°C
ESD
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5kV
Charge Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1kV
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
10 Lead MSOP (Note 2). . . . . . . . . . . .
162
N/A
10 Lead TDFN (Notes 2, 3) . . . . . . . . .
74
7
Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature Range (Extended Industrial). . . . . . . .-40°C to +125°C
Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5mW
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.0mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: using a max positive pulse of 6.5V on the SHDN pin, and using
a max negative pulse of -1V for all pins.
2. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Analog Specifications
SYMBOL
RTOTAL
Over recommended operating conditions, unless otherwise stated. Parameters with MIN and/or MAX limits are
100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not
production tested.
PARAMETER
RH to RL Resistance
TEST CONDITIONS
MIN
TYP
(Note 4)
MAX
UNIT
W option
10
k
U option
50
k
RH to RL Resistance Tolerance
W and U option
End-to-End Temperature Coefficient
W option
±50
ppm/°C
(Note 18)
U option
±80
ppm/°C
(Note 18)
Wiper Resistance
VCC = 3.3V, wiper current = VCC/RTOTAL
70
VRH, VRL
VRH and VRL Terminal Voltages
VRH and VRL to GND
CH/CL/CW
(Note 18)
Potentiometer Capacitance
RW
ILkgDCP
Leakage on DCP Pins
-20
+20
0
200
VCC
10/10/25
Voltage at pin from GND to VCC
0.1
%

V
pF
1
µA
VOLTAGE DIVIDER MODE (0V @ RL; VCC @ RH; measured at RW, unloaded)
INL
(Note 9)
Integral Non-linearity
Monotonic over all tap positions, W and U
option
-1
1
LSB
(Note 5)
DNL
(Note 8)
Differential Non-linearity
Monotonic over all tap positions, W and U
option
-0.5
0.5
LSB
(Note 5)
ZSerror
(Note 6)
Zero-scale Error
W option
LSB
(Note 5)
FSerror
(Note 7)
Full-scale Error
Ratiometric Temperature Coefficient
TCV
(Note 10, 18)
3
0
1
5
U option
0
0.5
2
W option
-5
-1
0
U option
-2
-1
0
DCP register set to 40 hex for W and U
option
±4
LSB
(Note 5)
ppm/°C
FN6227.2
September 9, 2009
ISL22416
Analog Specifications
SYMBOL
Over recommended operating conditions, unless otherwise stated. Parameters with MIN and/or MAX limits are
100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not
production tested. (Continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
(Note 4)
MAX
UNIT
RESISTOR MODE (Measurements between RW and RL with RH not connected, or between RW and RH with RL not connected)
RINL
(Note 14)
Integral Non-linearity
DCP register set between 10 hex and 7F
hex; monotonic over all tap positions;
W and U option
-1
1
MI
(Note 11)
RDNL
(Note 13)
Differential Non-linearity
W option
-1
1
MI
(Note 11)
U option
-0.5
0.5
MI
(Note 11)
W option
0
1
5
MI
(Note 11)
U option
0
0.5
2
MI
(Note 11)
Roffset
(Note 12)
Offset
Operating Specifications Over the recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
(Note 4)
MAX
UNIT
ICC1
VCC Supply Current (Volatile
Write/Read)
fSCK = 5MHz; (for SPI Active, Read and
Volatile Write states only)
0.5
mA
ICC2
VCC Supply Current (Non-volatile
Write/Read)
fSCK = 5MHz; (for SPI Active, Read and
Non-volatile Write states only)
3
mA
VCC Current (Standby)
VCC = +5.5V @ +85°C, SPI interface in
standby state
5
µA
VCC = +5.5V @ +125°C, SPI interface in
standby state
7
µA
VCC = +3.6V @ +85°C, SPI interface in
standby state
3
µA
VCC = +3.6V @ +125°C, SPI interface in
standby state
5
µA
VCC = +5.5V @ +85°C, SPI interface in
standby state
3
µA
VCC = +5.5V @ +125°C, SPI interface in
standby state
5
µA
VCC = +3.6V @ +85°C, SPI interface in
standby state
2
µA
VCC = +3.6V @ +125°C, SPI interface in
standby state
4
µA
1
µA
ISB
ISD
ILkgDig
VCC Current (Shutdown)
Leakage Current, at Pins SHDN, SCK, Voltage at pin from GND to VCC,
SDI, SDO and CS
SDO is inactive
-1
tWRT
(Note 18)
Wiper Response Time
Wiper Response Time after SPI write to WR
register
1.5
µs
tShdnRec
(Note 18)
DCP Recall Time from Shutdown
Mode
From rising edge of SHDN signal to wiper
stored position and RH connection
1.5
µs
SCK rising edge of last bit of ACR data byte
to wiper stored position and RH connection
1.5
µs
VPOR
VCC Ramp
Power-on Recall Voltage
VCC Ramp Rate
Minimum VCC at which memory recall occurs
2.0
0.2
4
2.6
V
V/ms
FN6227.2
September 9, 2009
ISL22416
Operating Specifications Over the recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested. (Continued)
SYMBOL
tD
PARAMETER
Power-up Delay
TEST CONDITIONS
MIN
TYP
(Note 4)
VCC above VPOR, to DCP Initial Value
Register recall completed, and SPI Interface
in standby state
MAX
UNIT
3
ms
EEPROM SPECIFICATION
EEPROM Endurance
EEPROM Retention
tWC
(Note 16)
Temperature T  +55°C
1,000,000
Cycles
50
Years
Non-volatile Write Cycle Time
12
20
ms
SERIAL INTERFACE SPECIFICATIONS
VIL
SHDN, SCK, SDI, and CS Input Buffer
LOW Voltage
-0.3
0.3*VCC
V
VIH
SHDN, SCK, SDI, and CS Input Buffer
HIGH Voltage
0.7*VCC
VCC + 0.3
V
Hysteresis
SHDN, SCK, SDI, and CS Input Buffer
Hysteresis
0.05*
VCC
SDO Output Buffer LOW Voltage
IOL = 4mA
0.4
V
Rpu
(Note 17)
SDO Pull-up Resistor Off-chip
Maximum is determined by tRO and tFO with
maximum bus load Cb = 30pF, fSCK = 5MHz
2
k
Cpin
(Note 18)
SHDN, SCK, SDI, SDO and CS Pin
Capacitance
10
pF
fSCK
SPI Frequency
5
MHz
tCYC
SPI Clock Cycle Time
200
ns
tWH
SPI Clock High Time
100
ns
tWL
SPI Clock Low Time
100
ns
tLEAD
Lead Time
250
ns
tLAG
Lag Time
250
ns
tSU
SDI, SCK and CS Input Setup Time
50
ns
tH
SDI, SCK and CS Input Hold Time
50
ns
tRI
SDI, SCK and CS Input Rise Time
10
ns
tFI
SDI, SCK and CS Input Fall Time
10
20
ns
SDO Output Disable Time
0
100
ns
350
ns
VOL
tDIS
0
V
tV
SDO Output Valid Time
tHO
SDO Output Hold Time
tRO
SDO Output Rise Time
Rpu = 2k, Cbus = 30pF
60
ns
tFO
SDO Output Fall Time
Rpu = 2k, Cbus = 30pF
60
ns
tCS
CS Deselect Time
0
2
ns
µs
NOTES:
4. Typical values are for TA = +25°C and 3.3V supply voltage.
5. LSB: [V(RW)127 – V(RW)0]/127. V(RW)127 and V(RW)0 are V(RW) for the DCP register set to 7F hex and 00 hex respectively. LSB is the
incremental voltage when changing from one tap to an adjacent tap.
6. ZS error = V(RW)0/LSB.
7. FS error = [V(RW)127 – VCC]/LSB.
5
FN6227.2
September 9, 2009
ISL22416
NOTES: (Continued)
8. DNL = [V(RW)i – V(RW)i-1]/LSB-1, for i = 1 to 127. i is the DCP register setting.
9. INL = [V(RW)i – (i • LSB) – V(RW)0]/LSB for i = 1 to 127
Max  V  RW  i  – Min  V  RW  i 
10 6
-  --------------------- for i = 16 to 127 decimal, T = -40°C to 125°C. Max( ) is the maximum value of the wiper
10. TC V = -------------------------------------------------------------------------------------------- Max  V  RW  i  + Min  V  RW  i    2 +165°C
voltage and Min ( ) is the minimum value of the wiper voltage over the temperature range.
11. MI = |RW127 – RW0|/127. MI is a minimum increment. RW127 and RW0 are the measured resistances for the DCP register set to 7F hex and
00 hex respectively.
12. Roffset = RW0/MI, when measuring between RW and RL.
Roffset = RW127/MI, when measuring between RW and RH.
13. RDNL = (RWi – RWi-1)/MI -1, for i = 1 to 127.
14. RINL = [RWi – (MI • i) – RW0]/MI, for i = 1 to 127.
6
 Max  Ri  – Min  Ri  
10
15. TC = ---------------------------------------------------------------  ----------------- for i = 16 to 127, T = -40°C to 125°C. Max( ) is the maximum value of the resistance and Min ( ) is
R
 Max  Ri  + Min  Ri    2 165°C
the minimum value of the resistance over the temperature range.
16. tWC is the time from the end of a Write sequence of SPI serial interface, to the end of the self-timed internal non-volatile write cycle.
17. Rpu is specified for the highest data rate transfer for the device. Higher value pull-up can be used at lower data rates.
18. Limits should be considered typical and are not production tested.
Timing Diagrams
Input Timing
tCS
CS
SCK
tSU
SDI
tH
tLAG
tCYC
tLEAD
...
tWH
tWL
...
MSB
tRI
tFI
LSB
HIGH IMPEDANCE
SDO
Output Timing
CS
SCK
...
tV
SDO
SDI
MSB
tHO
tDIS
...
LSB
ADDR
6
FN6227.2
September 9, 2009
ISL22416
XDCP Timing (for All Load Instructions)
CS
tWC
SCK
...
tWRT
...
MSB
SDI
LSB
VW
SDO
HIGH IMPEDANCE
Typical Performance Curves
100
1.2
80
1.0
70
60
ISB (µA)
WIPER RESISITANCE ()
1.4
VCC = 3.3V, T = +125°C
90
50
40
30
0.6
0.4
T = +25°C
VCC = 3.3V, T = -40°C
VCC = 3.3V, T = +20°C
20
0.2
10
0
T = +125°C
0.8
0
20
40
60
80
100
0
2.7
120
3.2
3.7
TAP POSITION (DECIMAL)
4.2
4.7
5.2
VCC (V)
FIGURE 1. WIPER RESISTANCE vs TAP POSITION
[ I(RW) = VCC/RTOTAL ] FOR 10k (W)
FIGURE 2. STANDBY ICC vs VCC
0.2
0.2
T = +25°C
T = +25°C
VCC = 2.7V
0.1
INL (LSB)
DNL (LSB)
0.1
0
-0.1
VCC = 2.7V
0
-0.1
VCC = 5.5V
-0.2
0
20
VCC = 5.5V
40
60
80
100
120
TAP POSITION (DECIMAL)
FIGURE 3. DNL vs TAP POSITION IN VOLTAGE DIVIDER
MODE FOR 10k (W)
7
-0.2
0
20
40
60
80
100
120
TAP POSITION (DECIMAL)
FIGURE 4. INL vs TAP POSITION IN VOLTAGE DIVIDER
MODE FOR 10k (W)
FN6227.2
September 9, 2009
ISL22416
Typical Performance Curves
(Continued)
0.0
1.3
10k
1.1
-0.3
ZSERROR (LSB)
ZSERROR (LSB)
0.9
0.7
0.5
VCC = 2.7V
VCC = 5.5V
0.3
0.1
-0.3
-40
-20
0
20
VCC = 5.5V
50k
-0.6
-0.9
10k
-1.2
50k
-0.1
VCC = 2.7V
40
60
80
100
-1.5
-40
120
-20
0
TEMPERATURE (°C)
20
40
60
80
FIGURE 5. ZSERROR vs TEMPERATURE
0.4
T = +25°C
T = +25°C
VCC = 5.5V
0.2
VCC = 5.5V
0.2
INL (LSB)
0
DNL (LSB)
120
FIGURE 6. FSERROR vs TEMPERATURE
0.4
-0.2
-0.4
0
-0.2
-0.4
VCC = 2.7V
-0.6
16
36
VCC = 2.7V
56
76
96
-0.6
16
116
36
TAP POSITION (DECIMAL)
FIGURE 7. DNL vs TAP POSITION IN RHEOSTAT MODE FOR
10k (W)
56
76
96
TAP POSITION (DECIMAL)
116
FIGURE 8. INL vs TAP POSITION IN RHEOSTAT MODE FOR
10k (W)
1.0
105
90
0.5
75
VCC = 2.7V
TCv (ppm/°C)
END TO END RTOTAL CHANGE (%)
100
TEMPERATURE (ºC)
50k
0.0 VCC = 5.5V
10k
-0.5
60
45
50k
30
10k
15
-1.0
-40
-20
0
20
40
60
80
TEMPERATURE (ºC)
FIGURE 9. END TO END RTOTAL % CHANGE vs
TEMPERATURE
8
100
120
0
16
36
56
76
96
TAP POSITION (DECIMAL)
FIGURE 10. TC FOR VOLTAGE DIVIDER MODE IN ppm
FN6227.2
September 9, 2009
ISL22416
Typical Performance Curves
(Continued)
OUTPUT
INPUT
300
TCr (ppm/°C)
250
200
150
50k
10k
100
WIPER AT MID POINT (POSITION 40h)
RTOTAL = 9.5k
50
0
16
36
56
76
96
TAP POSITION (DECIMAL)
FIGURE 11. TC FOR RHEOSTAT MODE IN ppm
FIGURE 12. FREQUENCY RESPONSE (2.6MHz)
SCL
SIGNAL AT WIPER
(WIPER UNLOADED)
SIGNAL AT WIPER
(WIPER UNLOADED MOVEMENT
FROM 7Fh TO 00h)
WIPER MID POINT MOVEMENT
FROM 3Fh TO 40h
FIGURE 13. MIDSCALE GLITCH, CODE 3Fh TO 40h
FIGURE 14. LARGE SIGNAL SETTLING TIME
SHDN
Pin Description
Potentiometer Pins
RH AND RL
The high (RH) and low (RL) terminals of the ISL22416 are
equivalent to the fixed terminals of a mechanical
potentiometer. RH and RL are referenced to the relative
position of the wiper and not the voltage potential on the
terminals. With WR set to 127 decimal, the wiper will be
closest to RH, and with the WR set to 0, the wiper is closest
to RL.
RW
The SHDN pin forces the resistor to end-to-end open circuit
condition on RH and shorts RW to RL. When SHDN is
returned to logic high, the previous latch settings put RW at
the same resistance setting prior to shutdown. This pin is
logically ANDed with SHDN bit in ACR register. SPI interface
is still available in shutdown mode and all registers are
accessible. This pin must remain HIGH for normal operation.
RH
RW
RW is the wiper terminal and is equivalent to the movable
terminal of a mechanical potentiometer. The position of the
wiper within the array is determined by the WR register.
RL
FIGURE 15. DCP CONNECTION IN SHUTDOWN MODE
9
FN6227.2
September 9, 2009
ISL22416
Bus Interface Pins
SERIAL CLOCK (SCK)
This is the serial clock input of the SPI serial interface.
SERIAL DATA OUTPUT (SDO)
The SDO is an open drain serial data output pin. During a
read cycle, the data bits are shifted out at the falling edge of
the serial clock SCK, while the CS input is low.
SDO requires an external pull-up resistor for proper
operation.
SERIAL DATA INPUT (SDI)
The SDI is the serial data input pin for the SPI interface. It
receives device address, operation code, wiper address and
data from the SPI external host device. The data bits are
shifted in at the rising edge of the serial clock SCK, while the
CS input is low.
CHIP SELECT (CS)
CS LOW enables the ISL22416, placing it in the active
power mode. A HIGH to LOW transition on CS is required
prior to the start of any operation after power up. When CS is
HIGH, the ISL22416 is deselected and the SDO pin is at
high impedance, and (unless an internal write cycle is
underway) the device will be in the standby state.
Principles of Operation
The ISL22416 is an integrated circuit incorporating one DCP
with its associated registers, non-volatile memory and the
SPI serial interface providing direct communication between
host and potentiometer and memory. The resistor array is
comprised of individual resistors connected in series. At
either end of the array and between each resistor is an
electronic switch that transfers the potential at that point to
the wiper.
The electronic switches on the device operate in a “make
before break” mode when the wiper changes tap positions.
When the device is powered down, the last value stored in
IVR will be maintained in the non-volatile memory. When
power is restored, the contents of the IVR is recalled and
loaded into the WR to set the wiper to the initial value.
DCP Description
The DCP is implemented with a combination of resistor
elements and CMOS switches. The physical ends of each
DCP are equivalent to the fixed terminals of a mechanical
potentiometer (RH and RL pins). The RW pin of the DCP is
connected to intermediate nodes, and is equivalent to the
wiper terminal of a mechanical potentiometer. The position of
the wiper terminal within the DCP is controlled by a 7-bit
volatile Wiper Register (WR). When the WR of a DCP
contains all zeroes (WR<6:0>: 00h), its wiper terminal (RW) is
closest to its “Low” terminal (RL). When the WR register of a
DCP contains all ones (WR<6:0>: 7Fh), its wiper terminal
10
(RW) is closest to its “High” terminal (RH). As the value of the
WR increases from all zeroes (0) to all ones (127 decimal),
the wiper moves monotonically from the position closest to RL
to the closest to RH. At the same time, the resistance between
RW and RL increases monotonically, while the resistance
between RH and RW decreases monotonically.
While the ISL22416 is being powered up, the WR is reset to
40h (64 decimal), which locates RW roughly at the center
between RL and RH. After the power supply voltage
becomes large enough for reliable non-volatile memory
reading, the WR will be reload with the value stored in a
non-volatile Initial Value Register (IVR).
The WR and IVR can be read or written to directly using the
SPI serial interface as described in the following sections.
Memory Description
The ISL22416 contains one non-volatile 7-bit register, known
as the Initial Value Register (IVR), volatile 7-bit Wiper Register
(WR), and volatile 8-bit Access Control Register (ACR). The
memory map is shown in Table 1. The non-volatile register
(IVR) at address 0, contain initial wiper position and volatile
registers (WR) contain current wiper position.
TABLE 1. MEMORY MAP
ADDRESS
NON-VOLATILE
VOLATILE
2
—
ACR
1
Reserved
0
IVR
WR
The non-volatile IVR and volatile WR registers are
accessible with the same address.
The Access Control Register (ACR) contains information
and control bits described in Table 2.
The VOL bit (ACR<7>) determines whether the access is to
wiper registers WR or initial value registers IVR.
TABLE 2. ACCESS CONTROL REGISTER (ACR)
BIT #
7
BIT NAME VOL
6
5
4
3
2
1
0
SHDN
WIP
0
0
0
0
0
If VOL bit is 0, the non-volatile IVR register is accessible. If
VOL bit is 1, only the volatile WR is accessible. Note, value
is written to IVR register also is written to the WR. The
default value of this bit is 0.
The SHDN bit (ACR<6>) disables or enables Shutdown mode.
This bit is logically ANDed with SHDN pin. When this bit is 0,
DCP is in Shutdown mode. Default value of SHDN bit is 1.
The WIP bit (ACR<5>) is read only bit. It indicates that
non-volatile write operation is in progress. The WIP bit can be
read repeatedly after a non-volatile write to determine if the
write has been completed. It is impossible to write to the WR or
ACR while WIP bit is 1.
FN6227.2
September 9, 2009
ISL22416
Shutdown Mode
The device can be put in Shutdown mode either by pulling the
SHDN pin to GND or setting the SHDN bit in the ACR register
to 0. The truth table for Shutdown mode is in Table 3.
TABLE 3. SHUTDOWN MODE
SHDN PIN
SHDN BIT
MODE
High
1
Normal operation
Low
1
Shutdown
High
0
Shutdown
Low
0
Shutdown
The internal non-volatile write cycle starts after rising edge of
CS and takes up to 20ms.
Read Operation
SPI Serial Interface
The ISL22416 supports an SPI serial protocol, mode 0. The
device is accessed via the SDI input and SDO output with
data clocked in on the rising edge of SCK, and clocked out
on the falling edge of SCK. CS must be LOW during
communication with the ISL22416. SCK and CS lines are
controlled by the host or master. The ISL22416 operates
only as a slave device.
All communication over the SPI interface is conducted by
sending the MSB of each byte of data first.
The first byte sent to the ISL22416 from the SPI host is the
Identification Byte. A valid Identification Byte contains 0101
as the four MSBs, with the following four bits set to 0.
TABLE 4. IDENTIFICATION BYTE FORMAT
1
0
A read operation to the ISL22416 is a three byte operation. It
requires first, the CS transition from HIGH to LOW, then a
valid Identification Byte, then a valid instruction byte followed
by “dummy” Data Byte is sent to SDI pin. The SPI host reads
the data from SDO pin on falling edge of SCK. The host
terminates the read operation by pulling the CS pin from
LOW to HIGH (see Figure 17).
In order to read back the non-volatile IVR, it is recommended
that the application reads the ACR first to verify the WIP bit
is 0. If the WIP bit (ACR[5]) is not 0, the host should repeat
its reading sequence again.
Applications Information
Communicating with ISL22416
Protocol Conventions
0
by Data Byte is sent to SDI pin. The host terminates the write
operation by pulling the CS pin from LOW to HIGH. For a
write to address 0 (WR), the byte at address 2 (ACR<7>)
determines if the Data Byte is to be written to volatile or both
volatile and non-volatile registers. Refer to “Memory
Description” on page 10 and Figure 16.
1
0
0
0
(MSB)
0
(LSB)
The next byte sent to the ISL22416 contains the instruction
and register pointer information. The four MSBs are the
instruction and two LSBs are register address (see Table 5).
TABLE 5. IDENTIFICATION BYTE FORMAT
7
6
5
4
3
2
1
0
I3
I2
I1
I0
0
0
R1
R0
Communication with ISL22416 proceeds using SPI interface
through the ACR (address 10b), IVR (address 00b) and WR
(address 00b) registers.
The wiper of the potentiometer is controlled by the WR
register. Writes and reads can be made directly to this
register to control and monitor the wiper position without any
non-volatile memory changes. This is done by setting MSB
bit at address 10b to 1.
The non-volatile IVR stores the power up value of the wiper.
IVR is accessible when MSB bit at address 10b is set to 0.
Writing a new value to the IVR register will set a new power
up position for the wiper. Also, writing to this register will load
the same value into the WR as the IVR. Reading from the
IVR will not change the WR, if its contents are different.
There are only two valid instruction sets:
1011(binary) - is a Read operation
1100(binary) - is a Write operation
There are only two registers address possible for this DCP. If
the R1, R0 bits are zero, then the read or write is to either the
IVR or the WR register (depends of VOL bit at ACR). If the R1
bit is 1 and R0 bit is 0, then the operation is on the ACR.
Write Operation
A Write operation to the ISL22416 is a three-byte operation.
It requires first, the CS transition from HIGH to LOW, then a
valid Identification Byte, then a valid instruction byte followed
11
FN6227.2
September 9, 2009
ISL22416
CS
SCK
SDI
0
1
0
0
1
0
0
0
0
I3
I2
I1
I0
0
0
R1 R0
0
D6 D5 D4
D3
D2
D1 D0
D2
D1 D0
FIGURE 16. THREE BYTE WRITE SEQUENCE
CS
SCK
SDI
DON’T CARE
0
1
0
0
1
0
0
0
0
I3
I2
I1
I0
0
0
R1 R0
SDO
0
D6 D5 D4
D3
FIGURE 17. THREE BYTE READ SEQUENCE
Examples
B. Reading from the WR
This sequence will read the value from the WR (volatile):
A. Writing to the IVR
This sequence will write a new value (77h) to the IVR
(non-volatile):
Set the ACR (Addr 02h) for NV write (40h)
Write to ACR first to access the WR
Send the ID byte, Instruction Byte, then the Data byte
0 1 0 1 0 0 0 0 1 1 0 0 0 0 1 0 1 1 0 0 0 0 0 0
Send the ID byte, Instruction Byte, then the Data byte
(Sent to DI)
0 1 0 1 0 0 0 0 1 1 0 0 0 0 1 0 0 1 0 0 0 0 0 0
(Sent to DI)
Read the data from WR (Addr 00h)
Send the ID byte, Instruction Byte, then Read the Data byte
Set the IVR (Addr 00h) to 77h
0 1 0 1 0 0 0 0 1 0 1 1 0 0 0 0 x x x x x x x x
Send the ID byte, Instruction Byte, then the Data byte
(Out on DO)
0 1 0 1 0 0 0 0 1 1 0 0 0 0 0 0 0 1 1 1 0 1 1 1
(Sent to DI)
12
FN6227.2
September 9, 2009
ISL22416
Mini Small Outline Plastic Packages (MSOP)
N
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
E
INCHES
SYMBOL
-B-
INDEX
AREA
1 2
0.20 (0.008)
A B C
TOP VIEW
4X 
0.25
(0.010)
R1
R
GAUGE
PLANE
SEATING
PLANE -CA
4X 
A2
A1
b
-H-
0.10 (0.004)
L
SEATING
PLANE
C
-A-
e
D
0.20 (0.008)
C
C
a
SIDE VIEW
CL
E1
0.20 (0.008)
C D
-B-
END VIEW
MILLIMETERS
MAX
MIN
MAX
NOTES
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.007
0.011
0.18
0.27
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
L1
MIN
0.020 BSC
0.50 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N
10
10
7
R
0.003
-
0.07
-
-
R1
0.003
-
0.07
-
-

5o
15o
5o
15o
-

0o
6o
0o
6o
Rev. 0 12/02
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. - H - Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums -A -H- .
and - B -
to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only
13
FN6227.2
September 9, 2009
ISL22416
Thin Dual Flat No-Lead Plastic Package (TDFN)
L10.3x3B
2X
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
0.15 C A
A
D
MILLIMETERS
2X
0.15 C B
E
SYMBOL
MIN
NOMINAL
MAX
NOTES
A
0.70
0.75
0.80
-
A1
-
-
0.05
-
A3
6
INDEX
AREA
b
0.20 REF
0.18
D
TOP VIEW
D2
B
A
C
SEATING
PLANE
D2
6
INDEX
AREA
0.08 C
A3
SIDE VIEW
(DATUM B)
0.10 C
7
8
7, 8
-
3.00 BSC
1.49
e
1.64
1.74
7, 8
0.50 BSC
-
k
0.20
-
-
L
0.30
0.40
0.50
8
N
10
2
Nd
5
3
2. N is the number of terminals.
NX k
3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
E2
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
E2/2
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
NX L
N-1
NX b
e
(Nd-1)Xe
REF.
BOTTOM VIEW
5
0.10 M C A B
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. COMPLIANT TO JEDEC MO-229-WEED-3 except for
dimensions E2 & D2.
CL
NX (b)
2.48
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
(DATUM A)
8
2.38
NOTES:
2
N
5, 8
Rev. 0 2/06
D2/2
1
E2
0.30
3.00 BSC
2.23
E
//
0.25
-
(A1)
9 L
5
e
SECTION "C-C"
C C
TERMINAL TIP
FOR ODD TERMINAL/SIDE
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
14
FN6227.2
September 9, 2009
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