Catalog

X-ray TDI camera
C12200 series
High speed readout
Large field of view
High Resolution
High Sensitivity
Evolutional high speed scanning with
TDI technology
High speed readout
36.8
m/min.
Detection area
293
mm
Horizontal spatial
resolution
6144
pixels
X-ray TDI camera C12200 Series is useful for in-line
applications requiring high-speed operation with high
sensitivity. TDI imaging is appropriate for applications where
it is desired to record a linear movement, or where the aspect
ratio of the subject being imaged is significantly asymmetric.
Low brightness under high resolution usage, a problem with
conventional line sensor cameras, is improved with this X-ray
TDI camera, making it suitable for applications which require
high resolution.
Printed circuit board (PCB) inspection
Surface-mounted component inspection
Battery inspection
High-resolution in-line non-destructive inspection
TDI technology
Time Delay Integration is a technology of scanning in
which a frame transfer device produces a continuous
video image of a moving object by means of a stack
of linear arrays aligned with and synchronized to the
motion of the object to be imaged in such a way that,
as the image moves from one line to the next, the
integrated charge moves along with it, providing
higher resolution at lower light levels than is possible
with a line-scan camera.
Shield box
X-ray source
Object motion
Object
X-ray TDI camera
Conveyor belt
TDI sensor
Signal intensity
Features
High S/N ratio with 12 bit (-321) /16 bit (-461) output
Camera Link interface (Base configuration)
Single power supply (+15 V) operation
Real time dark current / shading correction function
Frame readout mode for easy installation alignment
High-resolution, High-speed Camera with a Large Field of View for In-line
100 % X-ray Inspection
High speed readout
Large field of view
High Resolution
High Sensitivity
TDI technology offers all four simultaneously.
High resolution
image acquisition
X-ray Source
Large field of view
Object
X-ray
TDI Camera
High speed readout
*C12200-321 measurement image
SPECIFICATIONS
Type number
Scintillator
Window
Effective X-ray tube voltage range
CCD pixel size
Number of pixels
X-ray sensitive area
TDI line rate
1×1
C12200-461
CsI Scintillator
FOS (Fiber optic plate with scintillator)
Approx. 25 kV to 90 kV *1
48 μm × 48 μm
6144 (H) × 110 (V) *2
4608 (H) × 110 (V)
221.1 mm (H) × 5.2 mm (V)
293.4 mm (H) × 5.2 mm (V)
Max. 8.0 kHz (23.04 m/min)
Max. 6.4 kHz (36.864 m/min)
5.0 MHz
12 bit
16 bit
Camera Link
Base Configuration
40 MHz
50 MHz
12 bit digital output
16 bit digital output
DC +15 V
Approx. 40 VA
C12200-321
Binning 2 × 2
CCD pixel clock
A/D converter
Digital interface
Interface (Camera Link)
Pixel clock (Camera Link)
Output signals (Image data)
Power supply
Power consumption
*1 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance.
*2 "Active CCD pixel number" is all outputting pixel number including overlapped pixel. When the overlapped pixels are deleted, actual pixel numbers will vary. And also, X-ray sensitive area will vary.
Dead space between chips
Wide detection width with no dead areas.
C12200-461 offers a wide detection area with no dead areas due to its
staggered sensors.
C12200-321
(Unit: mm)
Dead space 1
Center chip
Left chip
Edge pixel
Right chip
Center chip
10 pixels
C12200-461
(Min. 4 pixels,
Max. 16 pixels)
Dead space 2:
130 μm min.
200 μm max.
±50 μm MAX.
Edge pixel
±50 μm MAX.
Dead space 1:
130 μm min.
200 μm max.
Dead space 2
Overlapped type measurement example
15.1±0.5
C12200-321 has a following dead space between chips.
MEASUREMENT EXAMPLES
Inspection of a solder's back fillet
Soldering failure
Normal soldering
Line scan
Line scan
Profile
If the back fillet of the solder on a PCB has a defect, a
connection error will occur even with small vibrations. For
observation of the back fillet part, X-ray transmission
technique has been applied but only with an off-line system.
Our X-ray TDI camera realizes in-line inspection because it
can acquire high speed profile data with high sensitivity. 3D
brightness level can be displayed using software.
3D display
Defect point
Lithium-ion battery inspection
In case of 2D sensor, the dimensional measurement cannot
be implemented correctly because the image is distorted on
the corner areas of the X-ray irradiation. The long length
sample needs to be located on center of X-ray source, so
the sample has to be relocated each time. X-ray TDI
camera can capture the image with no distortion by line
scan method, so it is not necessary to relocate the samples
and it enables the continuous inspection for long length
object without stopping.
Inspection by
2D sensor
X-ray image intensifier
(I.I.) camera :
Not necessary to relocate the samples and possible
to inspect the long length object with no distortion.
The image is distorted on the
corner areas in thickness direction,
and the dimensional measurement
cannot be implemented correctly.
Inspection by
X-ray TDI camera
X-ray TDI camera :
The non-distortion image can be
realized since X-ray is radiated
vertically to the object and the
dimensional measurement can be
implemented correctly.
Slack of rolling
Possible to inspect the mismatch of rolling and measure
the length of electrode with no distortion.
Short of the solution
Condition of the connection on electrode
MEASUREMENT EXAMPLES
Void inspection of BGAs (Ball Grid array)
X-ray TDI camera
Line sensor reduced
X-ray irradiation area
X-ray light
source
X-ray TDI camera can inspect the samples easily by high
speed scan with narrow irradiate area.
S/N ratio is one of advantage and low X-ray radiation is
enough to inspect the void existence.
Furthermore it contribute to make a smaller size of system
by reducing a lot of X-ray irradiation.
DIMENSIONAL OUTLINES
X-ray TDI camera can reduce the X-ray irradiation
on the sample dramatically by high speed with
narrow irradiation area. So it can reduce the risks
to break down the ICs on the PC.
(Sensor position)
160
30
10.6
15.1
4-Φ4.5
228
300
360
134
123
6(Sensor range)
112
64
11
160
50.05
5.5
370
25
5.5
(Unit: mm)
C12200-461 (Approx. 7 kg)
32
(Sensor range)
11
221
Moving direction
293
239
250
C12200-321 (Approx. 5 kg)
Object
(Sensor range)
270
302.2
6−Φ4.5
66
50
147
42.4
(Approx. 2 kg)
32.5
A8206-35 (Option)
(Sensor position)
50
10.7
(Sensor position)
(38.264)
16.1 2-M4 D=6
OPTIONS
Power supply unit : A8206-35
Power cable 5 m : A10847-05
Software API Support (Microsoft Windows) : DCAM-API (http://www.dcamapi.com)
Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.
Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative.
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications and external appearance are subject to change without notice.
© 2016 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Systems Division
812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail: [email protected]
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Cat. No. SFAS0026E12
JUN/2016 HPK
Created in Japan