VS-GB150TH120U Datasheet

VS-GB150TH120U
www.vishay.com
Vishay Semiconductors
Molding Type Module IGBT,
2 in 1 Package, 1200 V and 150 A
FEATURES
• 10 μs short circuit capability
• Low switching losses
• Rugged with ultrafast performance
• VCE(on) with positive temperature coefficient
• Low inductance case
• Fast and soft reverse recovery antiparallel FWD
• Isolated copper baseplate using DCB (Direct Copper
Bonding) technology
Double INT-A-PAK
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
PRODUCT SUMMARY
VCES
1200 V
• Inductive heating
IC at TC = 80 °C
150 A
• Electronic welder
VCE(on) (typical)
at IC = 150 A, TJ = 25 °C
3.10 V
• Switching mode power supplies
Speed
8 kHz to 30 kHz
Package
Double INT-A-PAK
Circuit
Half bridge
DESCRIPTION
Vishay’s IGBT power module provides ultrafast switching
speed as well as short circuit ruggedness. It is designed for
applications such as electronic welder and inductive
heating.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MAX.
Collector to emitter voltage
VCES
1200
Gate to emitter voltage
VGES
± 20
Collector current
Pulsed collector current
Diode continuous forward current
Diode maximum forward current
Maximum power dissipation
Short circuit withstand time
RMS isolation voltage
UNITS
V
TC = 25 °C
280
TC = 80 °C
150
tp = 1 ms
300
TC = 80 °C
150
tp = 1 ms
300
PD
TJ = 150 °C
1147
W
TSC
TJ = 125 °C
10
μs
2500
V
IC
ICM
(1)
IF
IFM
(1)
VISOL
f = 50 Hz, t = 1 min
A
Note
(1) Repetitive rating: Pulse width limited by maximum junction temperature.
Revision: 10-Jun-15
Document Number: 94714
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-GB150TH120U
www.vishay.com
Vishay Semiconductors
IGBT ELECTRICAL SPECIFICATIONS (TC = 25 °C unless otherwise noted)
PARAMETER
Collector to emitter breakdown voltage
SYMBOL
V(BR)CES
TEST CONDITIONS
TJ = 25 °C
MIN.
TYP.
MAX.
1200
-
-
VGE = 15 V, IC = 150 A, TJ = 25 °C
-
3.10
3.60
VGE = 15 V, IC = 150 A, TJ = 125 °C
-
3.45
-
UNITS
Collector to emitter saturation voltage
VCE(sat)
V
Gate to emitter threshold voltage
VGE(th)
VCE = VGE, IC = 1.5 mA, TJ = 25 °C
4.4
5.2
6.0
Collector cut-off current
ICES
VCE = VCES, VGE = 0 V, TJ = 25 °C
-
-
5.0
mA
Gate to emitter leakage current
IGES
VGE = VGES, VCE = 0 V, TJ = 25 °C
-
-
400
nA
UNITS
SWITCHING CHARACTERISTICS
PARAMETER
Turn-on delay time
Rise time
Turn-off delay time
Fall time
SYMBOL
MIN.
TYP.
MAX.
td(on)
-
612
-
tr
-
116
-
td(off)
-
546
-
tf
TEST CONDITIONS
VCC = 600 V, IC = 150 A, Rg = 6.8 ,
VGE = ± 15 V, TJ = 25 °C
-
125
-
Turn-on switching loss
Eon
-
17.7
-
Turn-off switching loss
Eoff
-
8.9
-
Turn-on delay time
td(on)
-
609
-
tr
-
116
-
-
564
-
-
148
-
Rise time
Turn-off delay time
Fall time
td(off)
tf
VCC = 600 V, IC = 150 A, Rg = 6.8 ,
VGE = ± 15 V, TJ = 125 °C
Turn-on switching loss
Eon
-
17.5
-
Turn-off switching loss
Eoff
-
11.0
-
Input capacitance
Cies
Output capacitance
Coes
Reverse transfer capacitance
Cres
SC data
ISC
VGE = 0 V, VCE = 30 V, f = 1.0 MHz
tp  10 μs, VGE = 15 V, TJ = 25 °C, 
VCC = 600 V, VCEM  1200 V
-
12.7
-
-
1.14
-
-
0.46
-
-
1400
-
ns
mJ
ns
mJ
nF
A
Internal gate rsistance
Rg
-
2.4
-

Stray inductance
LCE
-
-
18
nH
-
0.32
-
m
MIN.
TYP.
MAX.
UNITS
Module lead resistance, terminal to chip
RCC’+EE’
TC = 25 °C
DIODE ELECTRICAL SPECIFICATIONS (TC = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Forward voltage
VF
Reverse recovery charge
Qrr
Peak reverse recovery current
Irr
Reverse recovery energy
Erec
TEST CONDITIONS
IF = 100 A
IF = 150 A, VR = 600 V,
dIF/dt = -1500 A/μs
VGE = -15 V
TJ = 25 °C
-
1.75
2.15
TJ = 125 °C
-
1.80
-
TJ = 25 °C
-
8.2
-
TJ = 125 °C
-
19.1
-
TJ = 25 °C
-
85
-
TJ = 125 °C
-
125
-
TJ = 25 °C
-
4.2
-
TJ = 125 °C
-
8.4
-
V
μC
A
mJ
Revision: 10-Jun-15
Document Number: 94714
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-GB150TH120U
www.vishay.com
Vishay Semiconductors
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNITS
TJ
-
-
150
°C
TStg
-40
-
125
°C
-
-
0.109
-
-
0.180
-
0.035
-
Maximum junction temperature range
Storage temperature range
TEST CONDITIONS
IGBT
Junction to case
RJC
Diode
Case to sink (Conductive grease applied)
RCS
Power terminal screw: M5
2.5 to 5.0
Mounting screw: M6
3.0 to 6.0
Mounting torque
Nm
Weight
Weight of module
-
60
300
250
50
Eon,Eoff (mJ)
25 °C
200
125 °C
150
100
300
-
g
VCC = 600 V
Rg = 6.8 Ω
VGE = ± 15 V
TJ = 125 °C
VGE = 15 V
IC (A)
K/W
40
Eon
30
20
Eoff
50
10
0
0
0
1
2
3
4
0
5
100
150
200
250
VCE (V)
IC (A)
Fig. 1 - IGBT Typical Output Characteristics
Fig. 3 - IGBT Switching Loss vs. IC
300
80
300
VCE = 20 V
VCC = 600 V
IC = 150 A
VGE = ± 15 V
TJ = 125 °C
70
250
60
200
125 °C
Eon,Eoff (mJ)
IC (A)
50
150
100
25 °C
50
Eon
40
30
Eoff
20
50
10
0
0
4
5
6
7
8
9
10
11
0
10
20
30
40
VGE (V)
Rg (Ω)
Fig. 2 - IGBT Typical Transfer Characteristics
Fig. 4 - IGBT Switching Loss vs. Rg
50
Revision: 10-Jun-15
Document Number: 94714
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-GB150TH120U
www.vishay.com
Vishay Semiconductors
350
300
IC, Module
IC (A)
250
200
150
100
Rg = 6.8 Ω
VGE = ± 15 V
TJ = 125 °C
50
0
0
300
600
900
1200
1500
VCE (V)
Fig. 5 - RBSOA
100
IGBT
ZthJC (K/W)
10-1
10-2
10-3
10-3
10-2
10-1
100
101
t (s)
Fig. 6 - IGBT Transient Thermal Impedance
12
300
250
10
25 °C
Erec
8
E (mJ)
IF (A)
200
125 °C
150
6
4
100
VCC = 600 V
Rg = 6.8 Ω
VGE = - 15 V
TJ = 125 °C
2
50
0
0
0
0.5
1
1.5
2
2.5
3
0
50
100
150
200
250
VF (V)
IF (A)
Fig. 7 - Diode Typical Forward Characteristics
Fig. 8 - Diode Switching Loss vs. IF
300
Revision: 10-Jun-15
Document Number: 94714
4
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-GB150TH120U
www.vishay.com
Vishay Semiconductors
12
10
E (mJ)
8
Erec
6
4
VCC = 600 V
IC = 150 A
VGE = - 15 V
TJ = 125 °C
2
0
0
10
30
20
40
50
Rg (Ω)
Fig. 9 - Diode Switching Loss vs. Rg
100
DIODE
ZthJC (K/W)
10-1
10-2
10-3
10-3
10-2
10-1
100
101
t (s)
Fig. 10 - Diode Transient Thermal Impedance
CIRCUIT CONFIGURATION
6
7
1
2
3
5
4
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95525
Revision: 10-Jun-15
Document Number: 94714
5
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
Double INT-A-PAK
DIMENSIONS in millimeters (inches)
26
23 ± 0.3
6
7.2 ± 0.6
31 ± 0.5
2.8 x 0.5
16
3-M6
30.5 ± 0.5
Mounting depth max. 11
Ø
6.
4
±
28 ± 0.3
28 ± 0.3
20.1
0.
2
6
22
35.4
27 ± 0.4
3
15 ± 0.4
2
30
48 ± 0.4
61.4
1
6
93 ± 0.4
106.4
Revision: 27-May-13
Document Number: 95525
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000