DATASHEET

ISL5861
Data Sheet
October 7, 2015
12-bit, +3.3V, 130/210+MSPS, High Speed
D/A Converter
The ISL5861 is a 12-bit, 130/210+MSPS (Mega Samples
Per Second), CMOS, high speed, low power, D/A (digital to
analog) converter, designed specifically for use in high
performance communication systems such as base
transceiver stations utilizing 2.5G or 3G cellular protocols.
This device complements the ISL5x61 family of high speed
converters, which include 10, 12, and 14-bit devices.
Ordering Information
PART
NUMBER
TEMP.
RANGE
(oC)
FN6008.3
Features
• Speed Grades . . . . . . . . . . . . . . . . 130M and 210+MSPS
• Low Power . . . . . 103mW with 20mA Output at 130MSPS
• Adjustable Full Scale Output Current . . . . . 2mA to 20mA
• +3.3V Power Supply
• 3V LVCMOS Compatible Inputs
• Excellent Spurious Free Dynamic Range
(73dBc to Nyquist, f S = 130MSPS, fOUT = 10MHz)
• UMTS Adjacent Channel Power =70dB at 19.2MHz
• EDGE/GSM SFDR = 90dBc at 11MHz in 20MHz Window
PACKAGE
28 Ld SOIC
(Pb-free)
PKG.
DWG. #
M28.3
CLOCK
SPEED
ISL5861IBZ
(See Note) (No
longer
available,
recommended
replacement:
ISL5861IAZ)
-40 to 85
130MHz
ISL5861IAZ
(See Note)
-40 to 85
28 Ld TSSOP M28.173 130MHz
(Pb-free)
ISL5861/2IBZ
(See Note) (No
longer
available,
recommended
replacement:
ISL5861IAZ)
-40 to 85
28 Ld SOIC
(Pb-free)
ISL5861/2IAZ
(See Note)
-40 to 85
28 Ld TSSOP M28.173 210MHz
(Pb-free)
ISL5861EVAL1
25
SOIC Evaluation Platform 210MHz
• Pin compatible, 3.3V, Lower Power Replacement For The
AD9752 and HI5860
• Pb-free available
Applications
• Cellular Infrastructure - Single or Multi-Carrier: IS-136,
IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA
M28.3
210MHz
• BWA Infrastructure
• Medical/Test Instrumentation
• Wireless Communication Systems
• High Resolution Imaging Systems
• Arbitrary Waveform Generators
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
1
Pinout
ISL5861
TOP VIEW
D11 (MSB) 1
28 CLK
D10 2
27 DVDD
D9 3
26 DCOM
D8 4
25 NC
D7 5
24 AVDD
D6 6
23 COMP
D5 7
22 IOUTA
D4 8
21 IOUTB
D3 9
20 ACOM
D2 10
19 NC
D1 11
18 FSADJ
D0 (LSB) 12
17 REFIO
DCOM 13
16 REFLO
DCOM 14
15 SLEEP
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas LLC
Copyright © Intersil Americas LLC 2001, 2004, 2015 All Rights Reserved
ISL5861
Typical Applications Circuit
ISL5861
ONE CONNECTION
(25, 19) NC
D11
D11 (MSB) (1)
D10
D10 (2)
D9
D9 (3)
D8
D8 (4)
D7
D7 (5)
D6
D6 (6)
D5
D5 (7)
D4
D4 (8)
D3
D3 (9)
D2
D2 (10)
D1
D1 (11)
D0
D0 (LSB) (12)
(15) SLEEP
(16) REFLO
DCOM
(17) REFIO
0.1F
(18) FSADJ
RSET
1:1, Z1:Z2
(22) IOUTA
(21) IOUTB
REPRESENTS
ANY 50 LOAD
(23) COMP
0.1F
(20) ACOM
BEAD
+
10F
10H
FERRITE
BEAD
(24) AVDD
DVDD (27)
+
10H
0.1F
0.1F
10F
Functional Block Diagram
IOUTA
IOUTB
CASCODE
(LSB) D0
D1
D2
CURRENT
SOURCE
INPUT
LATCH
D3
38
D4
D5
SWITCH
MATRIX
38
7 LSBs
+
31 MSB
SEGMENTS
D6
D7
D8
D9
D10
D11
UPPER
5-BIT
DECODER
COMP
CLK
INT/EXT
VOLTAGE
BIAS
GENERATION
REFERENCE
REFLO REFIO
2
1.91k
(50)
50
CLK (28)
DCOM (26, 13, 14)
50
ACOM
FSADJ
SLEEP
+3.3V (VDD)
ISL5861
Pin Descriptions
PIN NO.
PIN NAME
DESCRIPTION
1-12
D11 (MSB) Through
D0 (LSB)
15
SLEEP
Control Pin for Power-Down mode. Sleep Mode is active high; Connect to ground for Normal Mode. Sleep pin
has internal 20A active pulldown current.
16
REFLO
Connect to analog ground to enable internal 1.2V reference or connect to AVDD to disable internal reference.
17
REFIO
Reference voltage input if internal reference is disabled. Reference voltage output if internal reference is
enabled. Use 0.F cap to ground when internal reference is enabled.
18
FSADJ
Full Scale Current Adjust. Use a resistor to ground to adjust full scale output current. Full Scale Output Current
= 32 x VFSADJ/RSET.
19, 25
NC
21
IOUTB
The complementary current output of the device. Full scale output current is achieved when all input bits are
set to binary 0.
22
IOUTA
Current output of the device. Full scale output current is achieved when all input bits are set to binary 1.
23
COMP
Connect 0.1F capacitor to ACOM.
24
AVDD
Analog Supply (+3.0V to +3.6V).
20
ACOM
Connect to Analog Ground.
26, 13, 14
DCOM
Connect to Digital Ground.
27
DVDD
Digital Supply (+3.0V to +3.6V).
28
CLK
Digital Data Bit 11, (Most Significant Bit) through Digital Data Bit 0, (Least Significant Bit).
No Connect. These should be grounded, but can be left disconnected.
Clock Input.
3
ISL5861
Absolute Maximum Ratings
Thermal Information
Digital Supply Voltage DVDD to DCOM . . . . . . . . . . . . . . . . . +3.6V
Analog Supply Voltage AVDD to ACOM. . . . . . . . . . . . . . . . . . +3.6V
Grounds, ACOM TO DCOM . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Digital Input Voltages (D9-D0, CLK, SLEEP). . . . . . . . DVDD + 0.3V
Reference Input Voltage Range. . . . . . . . . . . . . . . . . . AVDD + 0.3V
Analog Output Current (IOUT) . . . . . . . . . . . . . . . . . . . . . . . . . 24mA
Thermal Resistance (Typical, Note 1)
Operating Conditions
JA(oC/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
110
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC - Lead Tips Only)
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. JA is measured with the component mounted on an evaluation PC board in free air.
AVDD = DVDD = +3.3V, VREF = Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values
Electrical Specifications
TA = -40oC TO 85oC
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
12
-
-
Bits
-1.25
0.5
+1.25
LSB
-1
0.5
SYSTEM PERFORMANCE
Resolution
Integral Linearity Error, INL
“Best Fit” Straight Line (Note 7)
Differential Linearity Error, DNL
(Note 7)
Offset Error, IOS
IOUTA (Note 7)
Offset Drift Coefficient
(Note 7)
-
Full Scale Gain Error, FSE
With External Reference (Notes 2, 7)
+1
LSB
+0.006
% FSR
0.1
-
ppm
FSR/oC
-3
0.5
+3
% FSR
With Internal Reference (Notes 2, 7)
-3
0.5
+3
% FSR
With External Reference (Note 7)
-
50
-
ppm
FSR/oC
With Internal Reference (Note 7)
-
100
-
ppm
FSR/oC
2
-
20
mA
(Note 3)
-1.0
-
1.25
V
Maximum Clock Rate, fCLK
ISL5861/2IA, ISL5861/2IB
210
250
-
MHz
Maximum Clock Rate, fCLK
ISL5861IA, ISL5861IB
130
150
-
MHz
Full Scale Gain Drift
-0.006
Full Scale Output Current, IFS
Output Voltage Compliance Range
DYNAMIC CHARACTERISTICS
Output Rise Time
Full Scale Step
-
1.5
-
ns
Output Fall Time
Full Scale Step
-
1.5
-
ns
-
10
-
pF
IOUTFS = 20mA
-
50
-
pA/Hz
IOUTFS = 2mA
-
30
-
pA/Hz
fCLK = 210MSPS, fOUT = 80.8MHz, 30MHz Span (Notes 4, 7)
-
73
-
dBc
fCLK = 210MSPS, fOUT = 40.4MHz, 30MHz Span (Notes 4, 7)
-
80
-
dBc
fCLK = 130MSPS, fOUT = 20.2MHz, 20MHz Span (Notes 4, 7)
-
85
-
dBc
Output Capacitance
Output Noise
AC CHARACTERISTICS (Using Figure 13 with RDIFF = 50 and RLOAD= 50, Full Scale Output = -2.5dBm
Spurious Free Dynamic Range,
SFDR Within a Window
4
ISL5861
AVDD = DVDD = +3.3V, VREF = Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values (Continued)
Electrical Specifications
TA = -40oC TO 85oC
PARAMETER
TEST CONDITIONS
Spurious Free Dynamic Range,
SFDR to Nyquist (fCLK/2)
MIN
TYP
MAX
UNITS
fCLK = 210MSPS, fOUT = 80.8MHz (Notes 4, 7)
-
51
-
dBc
fCLK = 210MSPS, fOUT = 40.4MHz (Notes 4, 7, 9)
-
60
-
dBc
fCLK = 200MSPS, fOUT
= 20.2MHz, T = 25oC (Notes 4, 7)
60
62
-
dBc
fCLK = 200MSPS, fOUT
= 20.2MHz, T = -40oC to 85oC (Notes 4, 7)
58
-
-
dBc
fCLK = 130MSPS, fOUT = 50.5MHz (Notes 4, 7)
-
57
-
dBc
fCLK = 130MSPS, fOUT = 40.4MHz (Notes 4, 7)
-
62
-
dBc
fCLK = 130MSPS, fOUT = 20.2MHz (Notes 4, 7)
-
69
-
dBc
fCLK = 130MSPS, fOUT = 10.1MHz (Notes 4, 7)
-
73
-
dBc
fCLK = 130MSPS, fOUT
= 5.05MHz, T = 25oC (Notes 4, 7)
70
77
-
dBc
fCLK = 130MSPS, fOUT
= 5.05MHz, T = -40oC to 85oC (Notes 4, 7)
68
-
-
dBc
fCLK = 100MSPS, fOUT = 40.4MHz (Notes 4, 7)
-
60
-
dBc
fCLK = 80MSPS, fOUT = 30.3MHz (Notes 4, 7)
-
63
-
dBc
fCLK = 80MSPS, fOUT = 20.2MHz (Notes 4, 7)
-
69
-
dBc
fCLK = 80MSPS, fOUT = 10.1MHz (Notes 4, 7, 9)
-
70
-
dBc
fCLK = 80MSPS, fOUT = 5.05MHz (Notes 4, 7)
-
76
-
dBc
fCLK = 50MSPS, fOUT = 20.2MHz (Notes 4, 7)
-
68
-
dBc
fCLK = 50MSPS, fOUT = 10.1MHz (Notes 4, 7)
-
73
-
dBc
fCLK = 50MSPS, fOUT = 5.05MHz (Notes 4, 7)
-
77
-
dBc
fCLK = 210MSPS, fOUT = 28.3MHz to 45.2MHz, 2.1MHz Spacing,
50MHz Span (Notes 4, 7, 9)
-
65
-
dBc
fCLK = 130MSPS, fOUT =17.5MHz to 27.9MHz, 1.3MHz Spacing,
35MHz Span (Notes 4, 7)
-
68
-
dBc
fCLK = 80MSPS, fOUT = 10.8MHz to 17.2MHz, 811kHz Spacing,
15MHz Span (Notes 4, 7)
-
75
-
dBc
fCLK = 50MSPS, fOUT = 6.7MHz to 10.8MHz, 490kHz Spacing,
10MHz Span (Notes 4, 7)
-
77
-
dBc
-
90
-
dBc
-
70
-
dB
1.2
1.23
1.3
V
-
40
-
ppm/oC
-
0
-
A
Reference Input Impedance
-
1
-
M
Reference Input Multiplying Bandwidth (Note 7)
-
1.0
-
MHz
Spurious Free Dynamic Range,
SFDR in a Window with Eight Tones
Spurious Free Dynamic Range,
fCLK = 78MSPS, fOUT = 11MHz, in a 20MHz Window, RBW=30kHz
SFDR in a Window with EDGE or GSM (Notes 4, 7, 9)
fCLK = 76.8MSPS, fOUT = 19.2MHz, RBW=30kHz (Notes 4, 7, 9)
Adjacent Channel Power Ratio,
ACPR with UMTS
VOLTAGE REFERENCE
Internal Reference Voltage, VFSADJ
Pin 18 Voltage with Internal Reference
Internal Reference Voltage Drift
Internal Reference Output Current
Sink/Source Capability
DIGITAL INPUTS
Reference is not intended to be externally loaded
D11-D0, CLK
Input Logic High Voltage with
3.3V Supply, VIH
(Note 3)
2.3
3.3
-
V
Input Logic Low Voltage with
3.3V Supply, VIL
(Note 3)
-
0
1.0
V
-25
-
+25
A
Sleep Input Current, IIH
5
ISL5861
AVDD = DVDD = +3.3V, VREF = Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values (Continued)
Electrical Specifications
TA = -40oC TO 85oC
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Input Logic Current, IIH, IL
-20
-
+20
A
Clock Input Current, IIH, IL
-10
-
+10
A
-
5
-
pF
Digital Input Capacitance, CIN
TIMING CHARACTERISTICS
Data Setup Time, tSU
See Figure 15
-
1.5
-
ns
Data Hold Time, tHLD
See Figure 15
-
1.5
-
ns
Propagation Delay Time, tPD
See Figure 15
-
1
-
Clock
Period
CLK Pulse Width, tPW1 , tPW2
See Figure 15 (Note 3)
2
-
-
ns
POWER SUPPLY CHARACTERISTICS
AVDD Power Supply
(Note 8)
2.7
3.3
3.6
V
DVDD Power Supply
(Note 8)
2.7
3.3
3.6
V
Analog Supply Current (IAVDD)
3.3V, IOUTFS = 20mA
-
27.5
28.5
mA
3.3V, IOUTFS = 2mA
-
10
-
mA
3.3V (Note 5)
-
3.7
5
mA
3.3V (Note 6)
-
6.5
8
mA
Supply Current (IAVDD) Sleep Mode
3.3V, IOUTFS = Don’t Care
-
1.5
-
mA
Power Dissipation
3.3V, IOUTFS = 20mA (Note 5)
-
103
111
mW
3.3V, IOUTFS = 20mA (Note 6)
-
110
120
mW
3.3V, IOUTFS = 2mA (Note 5)
-
45
-
mW
-0.125
-
+0.125
%FSR/V
Digital Supply Current (IDVDD)
Power Supply Rejection
Single Supply (Note 7)
NOTES:
2. Gain Error measured as the error in the ratio between the full scale output current and the current through RSET (typically 625A). Ideally the
ratio should be 32.
3. Parameter guaranteed by design or characterization and not production tested.
4. Spectral measurements made with differential transformer coupled output and no external filtering. For multitone testing, the same pattern was
used at different clock rates, producing different output frequencies but at the same ratio to the clock rate.
5. Measured with the clock at 130MSPS and the output frequency at 5MHz.
6. Measured with the clock at 200MSPS and the output frequency at 20MHz.
7. See “Definition of Specifications”.
8. Recommended operation is from 3.0V to 3.6V. Operation below 3.0V is possible with some degradation in spectral performance. Reduction in
analog output current may be necessary to maintain spectral performance.
9. See Typical Performance Plots.
6
ISL5861
Typical Performance (+3.3V Supply, Using Figure 13 with RDIFF = 100 and RLOAD= 50)
SPECTRAL MASK FOR
GSM900/DCS1800/PCS1900
P>43dBm NORMAL BTS
WITH 30kHz RBW
FIGURE 1. EDGE AT 11MHz, 78MSPS CLOCK
(91+dBc @ f = +6MHz)
FIGURE 2. EDGE AT 11MHz, 78MSPS CLOCK
(75dBc -NYQUIST, 6dB PAD)
SPECTRAL MASK FOR
GSM900/DCS1800/PCS1900
P>43dBm NORMAL BTS
WITH 30kHz RBW
FIGURE 3. GSM AT 11MHz, 78MSPS CLOCK
(90+dBc @ f = +6MHz, 3dB PAD)
FIGURE 4. GSM AT 11MHz, 78MSPS CLOCK
(75dBc - NYQUIST, 9dB PAD)
FIGURE 5. FOUR EDGE CARRIERS AT 12.4-15.6MHz, 800kHz
SPACING, 78MSPS (71dBc - 20MHz WINDOW)
FIGURE 6. FOUR GSM CARRIERS AT 12.4-15.6MHz, 78MSPS
(73dBc - 20MHz WINDOW, 6dB PAD)
7
ISL5861
Typical Performance (+3.3V Supply, Using Figure 13 with RDIFF = 100 and RLOAD= 50)
(Continued)
SPECTRAL MASK
UMTS TDD
P>43dBm BTS
FIGURE 7. UMTS AT 19.2MHz, 76.8MSPS (70dB 1stACPR,
70dB 2ndACPR)
FIGURE 9. ONE TONE AT 40.4MHz, 210MSPS CLOCK
(61dBc - NYQUIST, 6dB PAD)
FIGURE 11. TWO TONES (CkHzF=6) AT 8.5MHz, 50MSPS
CLOCK, 500kHz SPACING (82dBc - 10MHz
WINDOW, 6dB PAD)
8
FIGURE 8. ONE TONE AT 10.1MHz, 80MSPS CLOCK (71dBc NYQUIST, 6dB PAD)
FIGURE 10. EIGHT TONES (CREST FACTOR=8.9) AT 37MHz,
210MSPS CLOCK, 2.1MHz SPACING
(65dBc - NYQUIST)
FIGURE 12. FOUR TONES (CF=8.1) AT 14MHz, 80MSPS
CLOCK, 800kHz SPACING (70dBc - NYQUIST,
6dB PAD)
ISL5861
Definition of Specifications
Adjacent Channel Power Ratio, ACPR, is the ratio of the
average power in the adjacent frequency channel (or offset)
to the average power in the transmitted frequency channel.
Differential Linearity Error, DNL, is the measure of the
step size output deviation from code to code. Ideally the step
size should be 1 LSB. A DNL specification of 1 LSB or less
guarantees monotonicity.
EDGE, Enhanced Data for Global Evolution, a TDMA
standard for cellular applications which uses 200kHz BW, 8PSK modulated carriers.
Full Scale Gain Drift, is measured by setting the data inputs
to be all logic high (all 1s) and measuring the output voltage
through a known resistance as the temperature is varied
from TMIN to TMAX . It is defined as the maximum deviation
from the value measured at room temperature to the value
measured at either TMIN or TMAX . The units are ppm of FSR
(full scale range) per oC.
Full Scale Gain Error, is the error from an ideal ratio of 32
between the output current and the full scale adjust current
(through RSET).
GSM, Global System for Mobile Communication, a TDMA
standard for cellular applications which uses 200kHz BW,
GMSK modulated carriers.
Integral Linearity Error, INL, is the measure of the worst
case point that deviates from a best fit straight line of data
values along the transfer curve.
Internal Reference Voltage Drift, is defined as the
maximum deviation from the value measured at room
temperature to the value measured at either TMIN or TMAX .
The units are ppm per oC.
Offset Drift, is measured by setting the data inputs to all
logic low (all 0s) and measuring the output voltage at IOUTA
through a known resistance as the temperature is varied
from TMIN to TMAX . It is defined as the maximum deviation
from the value measured at room temperature to the value
measured at either TMIN or TMAX . The units are ppm of FSR
(full scale range) per degree oC.
Offset Error, is measured by setting the data inputs to all
logic low (all 0s) and measuring the output voltage of IOUTA
through a known resistance. Offset error is defined as the
maximum deviation of the IOUTA output current from a value
of 0mA.
Output Voltage Compliance Range, is the voltage limit
imposed on the output. The output impedance should be
chosen such that the voltage developed does not violate the
compliance range.
Power Supply Rejection, is measured using a single power
supply. The nominal supply voltage is varied 10% and the
change in the DAC full scale output is noted.
9
Reference Input Multiplying Bandwidth, is defined as the
3dB bandwidth of the voltage reference input. It is measured
by using a sinusoidal waveform as the external reference
with the digital inputs set to all 1s. The frequency is
increased until the amplitude of the output waveform is
0.707 (-3dB) of its original value.
Spurious Free Dynamic Range, SFDR, is the amplitude
difference from the fundamental signal to the largest
harmonically or non-harmonically related spur within the
specified frequency window.
Total Harmonic Distortion, THD, is the ratio of the RMS
value of the fundamental output signal to the RMS sum of
the first five harmonic components.
UMTS, Universal Mobile Telecommunications System, a
W-CDMA standard for cellular applications which uses
3.84MHz modulated carriers.
Detailed Description
The ISL5861 is a 12-bit, current out, CMOS, digital to analog
converter. The maximum update rate is at least 210+MSPS
and can be powered by a single power supply in the
recommended range of +3.0V to +3.6V. Operation with clock
rates higher than 210MSPS is possible; please contact the
factory for more information. It consumes less than 120mW
of power when using a +3.3V supply, the maximum 20mA of
output current, and the data switching at 210MSPS. The
architecture is based on a segmented current source
arrangement that reduces glitch by reducing the amount of
current switching at any one time. In previous architectures
that contained all binary weighted current sources or a
binary weighted resistor ladder, the converter might have a
substantially larger amount of current turning on and off at
certain, worst-case transition points such as midscale and
quarter scale transitions. By greatly reducing the amount of
current switching at these major transitions, the overall glitch
of the converter is dramatically reduced, improving settling
time, transient problems, and accuracy.
Digital Inputs and Termination
The ISL5861 digital inputs are guaranteed to 3V LVCMOS
levels. The internal register is updated on the rising edge of
the clock. To minimize reflections, proper termination should
be implemented. If the lines driving the clock and the digital
inputs are long 50 lines, then 50 termination resistors
should be placed as close to the converter inputs as possible
connected to the digital ground plane (if separate grounds
are used). These termination resistors are not likely needed
as long as the digital waveform source is within a few inches
of the DAC. For pattern drivers with very high speed edge
rates, it is recommended that the user consider series
termination (50-200prior to the DAC’s inputs in order to
reduce the amount of noise.
ISL5861
Power Supply
Separate digital and analog power supplies are
recommended. The allowable supply range is +2.7V to
+3.6V. The recommended supply range is +3.0 to 3.6V
(nominally +3.3V) to maintain optimum SFDR. However,
operation down to +2.7V is possible with some degradation
in SFDR. Reducing the analog output current can help the
SFDR at +2.7V. The SFDR values stated in the table of
specifications were obtained with a +3.3V supply.
Ground Planes
Separate digital and analog ground planes should be used.
All of the digital functions of the device and their
corresponding components should be located over the
digital ground plane and terminated to the digital ground
plane. The same is true for the analog components and the
analog ground plane.
Noise Reduction
To minimize power supply noise, 0.1F capacitors should be
placed as close as possible to the converter’s power supply
pins, AVDD and DVDD . Also, the layout should be designed
using separate digital and analog ground planes and these
capacitors should be terminated to the digital ground for
DVDD and to the analog ground for AVDD . Additional filtering
of the power supplies on the board is recommended.
Voltage Reference
The internal voltage reference of the device has a nominal
value of +1.23V with a 40ppm/ oC drift coefficient over the
full temperature range of the converter. It is recommended
that a 0.1F capacitor be placed as close as possible to the
REFIO pin, connected to the analog ground. The REFLO pin
(16) selects the reference. The internal reference can be
selected if pin 16 is tied low (ground). If an external
reference is desired, then pin 16 should be tied high (the
analog supply voltage) and the external reference driven into
REFIO, pin 17. The full scale output current of the converter
is a function of the voltage reference used and the value of
RSET. IOUT should be within the 2mA to 20mA range,
though operation below 2mA is possible, with performance
degradation.
If the internal reference is used, VFSADJ will equal
approximately 1.2V (pin 18). If an external reference is used,
VFSADJ will equal the external reference. The calculation for
IOUT (Full Scale) is:
IOUT(Full Scale) = (VFSADJ/RSET) X 32.
If the full scale output current is set to 20mA by using the
internal voltage reference (1.2V) and a 1.91k RSET
resistor, then the input coding to output current will resemble
the following:
10
TABLE 1. INPUT CODING vs OUTPUT CURRENT WITH
INTERNAL REFERENCE AND RSET=1.91K
INPUT CODE (D11-D0)
IOUTA (mA)
IOUTB (mA)
11 11111 11111
20
0
10 00000 00000
10
10
00 00000 00000
0
20
Analog Output
IOUTA and IOUTB are complementary current outputs. The
sum of the two currents is always equal to the full scale
output current minus one LSB. If single ended use is
desired, a load resistor can be used to convert the output
current to a voltage. It is recommended that the unused
output be either grounded or equally terminated. The voltage
developed at the output must not violate the output voltage
compliance range of -1.0V to 1.25V. ROUT (the impedance
loading each current output) should be chosen so that the
desired output voltage is produced in conjunction with the
output full scale current. If a known line impedance is to be
driven, then the output load resistor should be chosen to
match this impedance. The output voltage equation is:
VOUT = IOUT X ROUT.
The most effective method for reducing the power
consumption is to reduce the analog output current, which
dominates the supply current. The maximum recommended
output current is 20mA.
Differential Output
IOUTA and IOUTB can be used in a differential-to-singleended arrangement to achieve better harmonic rejection.
With RDIFF= 50and RLOAD=50, the circuit in Figure 13
will provide a 500mV (-2.5dBm) signal at the output of the
transformer if the full scale output current of the DAC is set
to 20mA (used for the electrical specifications table). Values
of RDIFF= 100and RLOAD=50 were used for the typical
performance curves. The center tap in Figure 13 must be
grounded.
In the circuit in Figure 14, the user is left with the option to
ground or float the center tap. The DC voltage that will exist
at either IOUTA or IOUTB if the center tap is floating is
IOUTDC x (RA//RB) V because RDIFF is DC shorted by the
transformer. If the center tap is grounded, the DC voltage is
0V. Recommended values for the circuit in Figure 14 are
RA=RB=50, RDIFF=100, assuming RLOAD=50. The
performance of Figure 13 and Figure 14 is basically the
same, however leaving the center tap of Figure 14 floating
allows the circuit to find a more balanced virtual ground,
theoretically improving the even order harmonic rejection,
but likely reducing the signal swing available due to the
output voltage compliance range limitations.
ISL5861
Propagation Delay
REQ = 0.5 x (RLOAD // RDIFF)
AT EACH OUTPUT
PIN 21
PIN 22
ISL5861
The converter requires two clock rising edges for data to be
represented at the output. Each rising edge of the clock
captures the present data word and outputs the previous
data. The propagation delay is therefore 1/CLK, plus <2ns of
processing. See Figure 15.
VOUT = (2 x IOUTA x REQ)V
1:1
IOUTB
RDIFF
RLOAD
IOUTA
Test Service
Intersil offers customer-specific testing of converters with a
service called Testdrive. To submit a request, fill out the
Testdrive form. The form can be found by doing an ‘entire
site search’ at www.intersil.com on the words ‘DAC
Testdrive’. Or, send a request to the technical support center.
RLOAD REPRESENTS THE
LOAD SEEN BY THE TRANSFORMER
FIGURE 13. OUTPUT LOADING FOR DATASHEET
MEASUREMENTS
REQ = 0.5 x (RLOAD // RDIFF// RA), WHERE RA=RB
AT EACH OUTPUT
RA
PIN 21
PIN 22
ISL5861
IOUTB
VOUT = (2 x IOUTA x REQ)V
RDIFF
IOUTA
RLOAD
RB
RLOAD REPRESENTS THE
LOAD SEEN BY THE TRANSFORMER
FIGURE 14. ALTERNATIVE OUTPUT LOADING
Timing Diagram
tPW2
tPW1
50%
CLK
tSU
tSU
tHLD
D11-D0
W0
tSU
tHLD
tHLD
W1
W2
W3
tPD
tPD
OUTPUT=W0
IOUT
OUTPUT=W-1
OUTPUT=W1
FIGURE 15. PROPAGATION DELAY, SETUP TIME, HOLD TIME AND MINIMUM PULSE WIDTH DIAGRAM
11
ISL5861
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE
REVISION
CHANGE
October 7, 2015
FN6008.3
- Updated Ordering Information Table on page 1.
- Added Revision History.
- Added About Intersil Verbiage.
- Updated POD M28.3 to latest revision changes are as follow:
Added land pattern.
- Updated POD M28.173 to latest revision changes are as follow:
Convert to new POD format by moving dimensions from table onto drawing and adding land pattern. No
dimension changes.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
eliability reports are also available from our website at www.intersil.com/support.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
12
ISL5861
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
SYMBOL
-B-
1
2
3
L
SEATING PLANE
-A-
A
D
h x 45o
a
e
A1
B
C
0.10(0.004)
0.25(0.010) M
C A M
B S
MAX
MILLIMETERS
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
e
-C-
MIN
0.05 BSC
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6

10.00
-
0.394
N
0.419
1.27 BSC
H
28
0o
10.65
-
28
8o
0o
7
8o
Rev. 1, 1/13
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
TYPICAL RECOMMENDED LAND PATTERN
(1.50mm)
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
(9.38mm)
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
(1.27mm TYP)
(0.51mm TYP)
13
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
ISL5861
Package Outline Drawing
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 5/10
A
9.70± 0.10
1
3
SEE DETAIL "X"
15
28
6.40
PIN #1
I.D. MARK
4.40 ± 0.10
2
3
0.20 C B A
1
14
0.15 +0.05
-0.06
B
0.65
TOP VIEW
END VIEW
1.00 REF
H
- 0.05
0.90 +0.15
-0.10
C
GAUGE
PLANE
1.20 MAX
SEATING PLANE
+0.05
0.25
5
-0.06
0.10 M C B A
0.10 C
0.25
0°-8°
0.05 MIN
0.15 MAX
0.60 ±0.15
SIDE VIEW
DETAIL "X"
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
(5.65)
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
(0.65 TYP)
TYPICAL RECOMMENDED LAND PATTERN
(0.35 TYP)
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
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