PANASONIC XN09D61

Composite Transistors
XN09D61
Silicon PNP epitaxial planar type (Tr)
Silicon epitaxial planar type (SBD)
Unit: mm
0.50+0.10
–0.05
0.16+0.10
–0.06
0.30+0.10
–0.05
1
2
3
(0.95) (0.95)
1.9±0.1
2.90+0.20
–0.05
■ Basic Part Number
• 2SA2046 + MA3ZD12
1.1+0.2
–0.1
Rating
Unit
VCBO
−15
V
Collector-emitter voltage
(Base open)
VCEO
−15
V
Emitter-base voltage
(Collector open)
VEBO
−5
V
Collector current
IC
−1.5
A
Peak collector current
ICP
−3
A
Reverse voltage
VR
20
V
Repetitive peak reverse voltage
VRRM
25
V
Forward current (Average)
IF(AV)
700
mA
Non-repetitive peak
IFSM
2
A
PT
600
mW
0 to 0.1
Parameter
SBD
Symbol
Collector-base voltage
(Emitter open)
1: Emitter
2: Base
3: Anode
Total power dissipation *
Junction temperature
Tj
125
°C
Storage temperature
Tstg
−55 to +125
°C
4: Collector (Cathode)
5: Collector (Cathode)
6: Collector (Cathode)
Mini6-G1 Package
Marking Symbol: RA
Internal Connection
forward surge current
Overall
1.1+0.3
–0.1
Display at No.1 lead
10°
■ Absolute Maximum Ratings Ta = 25°C
Tr
2.8+0.2
–0.3
4
5°
• Two elements incorporated into one package (Tr + SBD)
• Reduction of the mounting area and assembly cost by one half
• Low collector-emitter saturation voltage VCE(sat)
5
1.50+0.25
–0.05
6
(0.65)
■ Features
0.4±0.2
For DC-DC converter
6
5
4
1
2
3
Note) *: Measuring on ceramic substrate at 15 mm × 15 mm × 0.6 mm
■ Electrical Characteristics Ta = 25°C ± 3°C
• Tr
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = −10 µA, IE = 0
−15
V
Collector-emitter voltage (Base open)
VCEO
IC = −1 mA, IB = 0
−15
V
Emitter-base voltage (Collector open)
VEBO
IE = −10 µA, IC = 0
−5
Collector-base cutoff current (Emitter open)
ICBO
VCB = −10 V, IE = 0
hFE
VCE = −2 V, IC = −100 mA
VCE(sat)
IC = −750 mA, IB = −15 mA
−90
IC = −1.5 A, IB = −50 mA
−130
Forward current transfer ratio *
Collector-emitter saturation voltage *
Conditions
Min
Typ
Max
Unit
V
− 0.1
160
µA
560

−200
mV
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Pulse measurement
Publication date: June 2003
SJJ00247BED
1
XN09D61
■ Electrical Characteristics (continued) Ta = 25°C ± 3°C
• Tr (continued)
Parameter
Symbol
Collector output capacitance
(Common base, input open circuited)
Cob
Typ
Max
Unit
VCB = −10 V, IE = 0, f = 1 MHz
25
35
pF
fT
VCB = −2 V, IE = 100 mA, f = 200 MHz
270
MHz
Turn-on time
ton
Refer to the switching time measurement circuit
25
ns
Storage time
tstg
70
ns
Turn-off time
toff
15
ns
Transition frequency
Conditions
Min
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Switching time measurement circuit
IB2
IB1
Input
Output
RB
PW = 20 µs
DC ≤ 1%
RL
470 µF
VCC = −5 V
−20IB1 = 20IB2 = IC = −750 mA
• SBD
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Forward voltage
VF
IF = 700 mA
0.45
V
Reverse current
IR
VR = 20 V
200
µA
Terminal capacitance
Ct
VR = 0, f = 1 MHz
Reverse recovery time
trr
IF = IR = 100 mA, Irr = 10 mA
RL = 100 Ω
100
pF
7
ns
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for diodes.
2. Schottky barrier diode is frail with static electricity, and it should be kept in safety from shock of static electricity and static
electricity level.
Common characteristics chart
Total power dissipation PT (mW)
PT  Ta
600
400
200
0
0
40
80
120
Ambient temperature Ta (°C)
2
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XN09D61
Characteristics charts of Tr
IC  VCE
IC  I B
Collector current IC (A)
−250 µA
− 0.06
−200 µA
−150 µA
− 0.04
−100 µA
− 0.02
0
−50 µA
0
−2
−4
−6
− 0.20
− 0.03
Base current IB (A)
IB = −300 µA
− 0.08
− 0.15
− 0.02
− 0.10
− 0.01
− 0.05
0
−8
0
Collector-emitter voltage VCE (V)
VCE = −2 V
Collector current IC (A)
Ta = 75°C
− 0.08
25°C
−25°C
− 0.04
0
Collector-emitter saturation voltage VCE(sat) (V)
IC  VBE
− 0.12
− 0.4
− 0.4
− 0.8
−1.2
Base-emitter voltage VBE (V)
− 0.8
− 0.2
0
− 0.4
− 0.6
− 0.8
Base-emitter voltage VBE (V)
VCE(sat)  IC
hFE  IC
−10
IC / IB = 50
−1
− 0.01
− 0.01
0
−1.2
Base current IB (mA)
Ta = 75°C
25°C
−25°C
− 0.1
0
VCE = −2 V
Ta = 25°C
VCE = −2 V
Ta = 25°C
− 0.1
−1
Collector current IC (A)
VCE = −2 V
Forward current transfer ratio hFE
Ta = 25°C
IB  VBE
− 0.04
− 0.25
Collector current IC (A)
− 0.10
−10
300
Ta = 75°C
25°C
200
−25°C
100
0
− 0.001
− 0.01
− 0.1
−1
−10
Collector current IC (A)
Cob  VCB
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
1 000
f = 1 MHz
Ta = 25°C
100
10
0
−10
−20
−30
Collector-base voltage VCB (V)
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XN09D61
Characteristics charts of SBD
IF  V F
IR  Ta
25°C
0.4
−25°C
0
0.4
0.8
Forward voltage VF (V)
4
1.2
1 000
Terminal capacitance Ct (pF)
Ta = 85°C
0.8
0
Ct  VR
104
Reverse current IR (mA)
Forward current IF (A)
1.2
103
102
10
1
−25
−5
15
35
55
75
Ambient temperature Ta (°C)
SJJ00247BED
f = 1 MHz
Ta = 25°C
100
10
0
10
20
Reverse voltage VR (V)
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
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permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL