DATASHEET

X9C303
®
Logarithmic Digitally Controlled Potentiometer (XDCP™)
Data Sheet
January 30, 2009
Terminal Voltage ±5V, 100 Taps, Log Taper
FN8223.2
Features
• Solid-state potentiometer
Description
• Three-wire serial interface
The Intersil X9C303 is a digitally controlled potentiometer
(XDCP). The device consists of a resistor array, wiper
switches, a control section, and nonvolatile memory. The
wiper position is controlled by a three-wire interface.
• 100 wiper tap points
- Wiper position stored in nonvolatile memory and
recalled on power-up
• 99 resistive elements, log taper
- Temperature compensated
- End-to-end resistance, 32kΩ ±15%
- Terminal voltages, ±5V
The resistor array is composed of 99 resistive elements.
Between each element and at either end are tap points
accessible to the wiper terminal. The position of the wiper
element is controlled by the CS, U/D, and INC inputs. The
position of the wiper can be stored in nonvolatile memory
and then be recalled upon a subsequent power-up
operation.
• Low power CMOS
- VCC = 5V
- Active current, 3mA max.
- Standby current, 750µA max.
The device can be used as a three-terminal potentiometer or
as a two-terminal variable resistor in a wide variety of
applications ranging from control, to signal processing, to
parameter adjustment. Digitally-controlled potentiometers
provide three powerful application advantages; (1) the
variability and reliability of a solid-state potentiometer, (2) the
flexibility of computer-based digital controls, and (3) the use
of nonvolatile memory for potentiometer settings retention.
• High reliability
- Endurance, 100,000 data changes per bit
- Register data retention, 100 years
• Packages
- 8 Ld TSSOP
- 8 Ld SOIC
- 8 Ld PDIP
• Pb-free available (RoHS compliant)
Block Diagram
U/D
INC
CS
7-BIT
UP/DOWN
COUNTER
99
RH/VH
98
97
7-BIT
NONVOLATILE
MEMORY
96
ONE
OF
ONEHUNDRED
DECODER
TRANSFER
GATES
RESISTOR
ARRAY
2
VCC
VSS
STORE AND
RECALL
CONTROL
CIRCUITRY
1
0
RL/VL
RW/VW
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005, 2007, 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X9C303
Ordering Information
PART
NUMBER
PART
MARKING
TEMP. RANGE
(°C)
PKG.
DWG. #
PACKAGE
X9C303P
X9C303P
0 to +70
8 Ld PDIP
MDP0031
X9C303PI
X9C303P I
-40 to +85
8 Ld PDIP
MDP0031
X9C303PIZ (Notes 1, 2)
X9C303P ZI
-40 to +85
8 Ld PDIP (300 mil) (Pb-free)
MDP0031
X9C303PZ (Notes 1, 2)
X9C303P Z
0 to +70
8 Ld PDIP (300 mil) (Pb-free)
MDP0031
X9C303S8*,
X9C303S
0 to +70
8 Ld SOIC (150 mil)
MDP0027
X9C303S8I*
**
X9C303S I
-40 to +85
8 Ld SOIC (150 mil)
MDP0027
X9C303S8IZ* (Note 1)
X9C303S ZI
-40 to +85
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
X9C303S8Z* (Note 1)
X9C303S Z
0 to +70
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
X9C303V8*, **
9C303
0 to +70
8 Ld TSSOP (4.4mm)
M8.173
X9C303V8I*
C303 I
-40 to +85
8 Ld TSSOP (4.4mm)
M8.173
X9C303V8IZ* (Note 1)
C303 IZ
-40 to +85
8 Ld TSSOP (4.4mm) (Pb-free)
M8.173
X9C303V8Z* (Note 1)
9C303 Z
0 to +70
8 Ld TSSOP (4.4mm) (Pb-free)
M8.173
X9C303S8I-2.7
X9C303S G
-40 to +85
8 Ld SOIC (150 mil)
MDP0027
-40 to +85
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
X9C303S8IZ-2.7 (Note 1) X9C303S ZG
*Add “T1” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
**Add “T2” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
2. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
Pin Descriptions
returned HIGH while the INC input is also HIGH. After the store
operation is complete, the device will be placed in the low
power standby mode until the device is selected once again.
VH and VL
The high (VH) and low (VL) terminals of the device are
equivalent to the fixed terminals of a mechanical
potentiometer. The minimum voltage is –5V and the
maximum is +5V. It should be noted that the terminology of
VL and VH references the relative position of the terminal in
relation to wiper movement direction selected by the U/D
input and not the voltage potential on the terminal.
VW
Pinouts
X9C303
(8 LD SOIC, 8 LD PDIP)
TOP VIEW
INC
1
U/D
2
8
VCC
7
CS
X9C303
VW is the wiper terminal, equivalent to the movable terminal
of a mechanical potentiometer. The position of the wiper
within the array is determined by the control inputs. The
wiper terminal series resistance is typically 40Ω.
VH
3
6
VL
VSS
4
5
VW
Up/Down (U/D)
X9C303
(8 LD TSSOP)
TOP VIEW
The U/D input controls the direction of the wiper movement
and whether the counter is incremented or decremented.
Increment (INC)
The INC input is negative-edge triggered. Toggling INC will
move the wiper and either increment or decrement the counter
in the direction indicated by the logic level on the U/D input.
CS
1
VCC
2
INC
3
U/D
4
8
VL
7
VW
6
VSS
5
VH
X9C303
Chip Select (CS)
The device is selected when the CS input is LOW. The current
counter value is stored in nonvolatile memory when CS is
2
FN8223.2
January 30, 2009
X9C303
Pin Names
SYMBOL
DESCRIPTION
VH
High Terminal (Potentiometer)
VW
Wiper Terminal (Potentiometer)
VL
Low Terminal (Potentiometer)
VSS
Ground
VCC
Supply Voltage
U/D
Up/Down Control Input
INC
Increment Control Input
CS
Chip Select Control Input
NC
No Connection
When the device is powered-down, the last counter position
stored will be maintained in the nonvolatile memory. When
power is restored, the contents of the memory are recalled
and the counter is reset to the value last stored.
Instructions and Programming
The INC, U/D and CS inputs control the movement of the
wiper along the resistor array. With CS set LOW, the device is
selected and enabled to respond to the U/D and INC inputs.
HIGH to LOW transitions on INC will increment or decrement
(depending on the state of the U/D input) a seven-bit counter.
The output of this counter is decoded to select one of
one-hundred wiper positions along the resistive array.
Potentiometer Relationships
S100
VH
(VS)
R99
S99
R98
S98
VW
S3
R2
S2
R1
S1
VL
R +R +...+R
V
1
2
i
W
G i = 20Log ------------------------------------------------- = --------- ( V L = 0V )
V
R
S
TOTAL
R +R +...+R
= R
1
2
99
TOTAL
(REFER TEST CIRCUIT 1)
Principles of Operation
There are three sections of the X9C303: the input control,
counter and decode section; the nonvolatile memory; and the
resistor array. The input control section operates just like an
up/down counter. The output of this counter is decoded to turn
on a single electronic switch connecting a point on the resistor
array to the wiper output. Under the proper conditions, the
contents of the counter can be stored in nonvolatile memory
and retained for future use. The resistor array is comprised of
99 individual resistors connected in series. At either end of the
array and between each resistor is an electronic switch that
transfers the potential at that point to the wiper.
The wiper, when at either fixed terminal, acts like its
mechanical equivalent and does not move beyond the last
position. That is, the counter does not wrap around when
clocked to either extreme.
3
The electronic switches on the device operate in a “make
before break” mode when the wiper changes tap positions. If
the wiper is moved several positions, multiple taps are
connected to the wiper for tIW (INC to VW change). The
RTOTAL value for the device can temporarily be reduced by a
significant amount if the wiper is moved several positions.
The value of the counter is stored in nonvolatile memory
whenever CS transitions HIGH while the INC input is also
HIGH.
The system may select the X9C303, move the wiper, and
deselect the device without having to store the latest wiper
position in nonvolatile memory. The wiper movement is
performed as previously described ; once the new position is
reached, the system would the keep INC LOW while taking
CS HIGH. The new wiper position would be maintained until
changed by the system or until a power-down/up cycle
recalled the previously stored data.
This would allow the system to always power-up to a preset
value stored in nonvolatile memory; then during system
operation minor adjustments could be made. The
adjustments might be based on user preference: system
parameter changes due to temperature drift, etc.
The state of U/D may be changed while CS remains LOW.
This allows the host system to enable the device and then
move the wiper up and down until the proper trim is attained.
Mode Selection
CS
INC
U/D
MODE
L
H
Wiper Up
L
L
Wiper Down
H
X
Store Wiper Position
X
X
Standby Current
L
X
No Store, Return to Standby
L
H
Wiper Up (not recommended)
L
L
Wiper Down (not recommended)
H
FN8223.2
January 30, 2009
X9C303
Symbol Table
WAVEFORM
INPUTS
OUTPUTS
Must be
steady
Will be
steady
May change
from Low to
High
Will change
from Low to
High
May change
from High to
Low
Will change
from High to
Low
Don’t Care:
Changes
Allowed
Changing:
State Not
Known
N/A
Center Line
is High
Impedance
Typical Electrical Taper
100
R(VH - VW)
R(VW - VL)
90
% TOTAL RESISTANCE
80
70
60
50
40
30
20
10
99
96
93
90
87
84
81
78
75
72
69
66
63
60
57
54
51
45
48
42
39
36
33
30
27
24
21
18
15
9
12
6
3
0
0
TAP
Test Circuit #1
Test Circuit #2
Circuit #3 SPICE Macro Model
VH
VH
RTOTAL
TEST POINT
VS
TEST POINT
VW
VW
VL
VL
FORCE
CURRENT
RL
RH
CH
CW
10pF
25pF
CL
10pF
RW
4
FN8223.2
January 30, 2009
X9C303
Absolute Maximum Ratings
Thermal Information
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage on CS, INC, U/D and VCC with Respect to VSS . -1V to +7V
Voltage on VH and VL Referenced to VSS . . . . . . . . . . . . -8V to +8V
ΔV = |VH - VL| X9C303 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10V
Wiper Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1mA
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
Recommended Operating Conditions
Commercial Temperature Range. . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +85°C
Military Temperature Range. . . . . . . . . . . . . . . . . . .-55°C to +125°C
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
Power Rating at +25°C X9C303 . . . . . . . . . . . . . . . . . . . . . . .10mW
Physical Characteristics
Marking Includes
Manufacturer’s Trademark
Resistance Value or Code
Date Code
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
Analog Specifications
Over recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
LIMITS
SYMBOL
RTOTAL
PARAMETER
TEST CONDITIONS
MIN
End-to-End Resistance
TYP
(Note 3)
MAX
UNIT
κΩ
32
End-to-End Resistance Tolerance
-15
+15
%
VH
VH Terminal Voltage
-5
+5
V
VL
VL Terminal Voltage
-5
+5
V
RW
Wiper Resistance
Max Wiper Current ±1mA
100
Ω
Tap Position Relative Step Size Error
Error = log (Vw(n)) - log (Vw(n - 1))
for tap n = 2 - 99, VH-VL = 10V
0.115
dB
Resistor Noise
At 1kHz
23
nV(RMS)/
√Hz
Charge Pump Noise
At 850kHz
20
mV(RMS)
End-to-End Resistance
Temperature Coefficient
T = -40°C to +85°C
±400
ppm/°C
Ratiometric Temperature Coefficient
Tap position 84
±20
ppm/°C
Potentiometer Capacitance
See “Circuit #3 SPICE Macro Model” on
page 4
10/10/25
pF
CH/CL/CW
(Note 5)
5
40
0.005
FN8223.2
January 30, 2009
X9C303
DC Electrical Specifications
Over recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
ICC
Vcc Active Current
CS = VIL, U/D = VIL or VIH and
INC = 0.4V to 2.4V @ Max tCYC
ISB
Standby Supply Current
CS = VCC - 0.3V, U/D and INC = VSS or
VCC - 0.3V
ILI
CS, INC, U/D Input Leakage Current
VIN = VSS to VCC
VIH
CS, INC, U/D Input HIGH Voltage
VIL
CS, INC, U/D Input LOW voltage
CIN (Note 5)
CS, INC, U/D Input Capacitance
TYP
(Note 3)
MAX
UNIT
1
3
mA
200
750
µA
+10
µA
-10
2
V
0.8
VCC = 5V, VIN = VSS,
TA = +25°C, f = 1MHz
V
10
pF
EEPROM SPECS
EEPROM Endurance
Wiper storage operations over
recommended operation conditions
EEPROM Retention
At +55°C
100,000
Cycles
100
Years
NOTES:
3. Typical values are for TA = +25°C and nominal supply voltage.
Standard Parts
PART NUMBER
MAXIMUM RESISTANCE
WIPER INCREMENTS
MINIMUM RESISTANCE
32kΩ
Log Taper
40Ω Typical
X9C303
AC Conditions of Test
Input Pulse Levels
0V to 3V
Input Rise and Fall Times
10ns
Input Reference Levels
1.5V
AC Electrical Specifications
Over recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
LIMITS
SYMBOL
PARAMETER
MIN
TYP
(Note 4)
MAX
UNIT
tCl
CS to INC Set-up
100
ns
tlD
INC HIGH to U/D Change
100
ns
tDI
U/D to INC Set-up
2.9
µs
tlL
INC LOW Period
1
µs
tlH
INC HIGH Period
1
µs
tlC
INC Inactive to CS Inactive
1
µs
tCPH
CS Deselect Time
20
ms
tIW (Note 5)
INC to VW Change
tCYC
INC Cycle Time
6
100
2
µs
µs
FN8223.2
January 30, 2009
X9C303
AC Electrical Specifications
Over recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested. (Continued)
LIMITS
SYMBOL
PARAMETER
tR, tF (Note 5)
tPU (Note 5)
TYP
(Note 4)
MIN
INC Input Rise and Fall Time
Power-up to Wiper Stable
MAX
UNIT
500
ns
500
tR VCC (Note 5) VCC Power-up Rate
µs
0.2
50
mV/µs
AC Timing Diagram
CS
tCYC
tCI
tIL
tCPH
tIC
tIH
90%
INC
90%
10%
tID
tDI
tF
tR
U/D
tIW
(NOTE 6)
MI
VW
NOTES:
4. Typical values are for TA = +25°C and nominal supply voltage.
5. This parameter is not 100% tested.
6. MI in the “AC Timing Diagram” refers to the minimum incremental change in the VW output due to a change in the wiper position.
7
FN8223.2
January 30, 2009
X9C303
Thin Shrink Small Outline Plastic Packages (TSSOP)
N
INDEX
AREA
E
0.25(0.010) M
E1
2
INCHES
SYMBOL
3
0.05(0.002)
-A-
8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
GAUGE
PLANE
-B1
M8.173
B M
SEATING PLANE
L
A
D
-C-
e
α
A1
b
0.10(0.004) M
0.25
0.010
A2
c
0.10(0.004)
C A M
B S
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
MIN
MAX
MILLIMETERS
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
8o
0o
N
α
8
0o
8
7
8o
Rev. 1 12/00
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
8
FN8223.2
January 30, 2009
X9C303
Small Outline Package Family (SO)
A
D
h X 45°
(N/2)+1
N
A
PIN #1
I.D. MARK
E1
E
c
SEE DETAIL “X”
1
(N/2)
B
L1
0.010 M C A B
e
H
C
A2
GAUGE
PLANE
SEATING
PLANE
A1
0.004 C
0.010 M C A B
L
b
0.010
4° ±4°
DETAIL X
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
INCHES
SYMBOL
SO-14
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
TOLERANCE
NOTES
A
0.068
0.068
0.068
0.104
0.104
0.104
0.104
MAX
-
A1
0.006
0.006
0.006
0.007
0.007
0.007
0.007
±0.003
-
A2
0.057
0.057
0.057
0.092
0.092
0.092
0.092
±0.002
-
b
0.017
0.017
0.017
0.017
0.017
0.017
0.017
±0.003
-
c
0.009
0.009
0.009
0.011
0.011
0.011
0.011
±0.001
-
D
0.193
0.341
0.390
0.406
0.504
0.606
0.704
±0.004
1, 3
E
0.236
0.236
0.236
0.406
0.406
0.406
0.406
±0.008
-
E1
0.154
0.154
0.154
0.295
0.295
0.295
0.295
±0.004
2, 3
e
0.050
0.050
0.050
0.050
0.050
0.050
0.050
Basic
-
L
0.025
0.025
0.025
0.030
0.030
0.030
0.030
±0.009
-
L1
0.041
0.041
0.041
0.056
0.056
0.056
0.056
Basic
-
h
0.013
0.013
0.013
0.020
0.020
0.020
0.020
Reference
-
16
20
24
28
Reference
-
N
SO-8
SO16
(0.150”)
8
14
16
Rev. M 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
9
FN8223.2
January 30, 2009
X9C303
Plastic Dual-In-Line Packages (PDIP)
E
D
A2
SEATING
PLANE
L
N
A
PIN #1
INDEX
E1
c
e
b
A1
NOTE 5
1
eA
eB
2
N/2
b2
MDP0031
PLASTIC DUAL-IN-LINE PACKAGE
INCHES
SYMBOL
PDIP8
PDIP14
PDIP16
PDIP18
PDIP20
TOLERANCE
A
0.210
0.210
0.210
0.210
0.210
MAX
A1
0.015
0.015
0.015
0.015
0.015
MIN
A2
0.130
0.130
0.130
0.130
0.130
±0.005
b
0.018
0.018
0.018
0.018
0.018
±0.002
b2
0.060
0.060
0.060
0.060
0.060
+0.010/-0.015
c
0.010
0.010
0.010
0.010
0.010
+0.004/-0.002
D
0.375
0.750
0.750
0.890
1.020
±0.010
E
0.310
0.310
0.310
0.310
0.310
+0.015/-0.010
E1
0.250
0.250
0.250
0.250
0.250
±0.005
e
0.100
0.100
0.100
0.100
0.100
Basic
eA
0.300
0.300
0.300
0.300
0.300
Basic
eB
0.345
0.345
0.345
0.345
0.345
±0.025
L
0.125
0.125
0.125
0.125
0.125
±0.010
N
8
14
16
18
20
Reference
NOTES
1
2
Rev. C 2/07
NOTES:
1. Plastic or metal protrusions of 0.010” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions E and eA are measured with the leads constrained perpendicular to the seating plane.
4. Dimension eB is measured with the lead tips unconstrained.
5. 8 and 16 lead packages have half end-leads as shown.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
10
FN8223.2
January 30, 2009
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