SQ3427EV Datasheet

SQ3427EV
www.vishay.com
Vishay Siliconix
Automotive P-Channel 60 V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
RDS(on) () at VGS = -10 V
0.095
RDS(on) () at VGS = -4.5 V
0.135
ID (A)
• AEC-Q101 qualified c
• 100 % Rg and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
-5.3
Configuration
Single
Package
TSOP-6
TSOP-6 Single
D
6
• TrenchFET® power MOSFET
-60
(1, 2, 5, 6) D
S
4
D
5
(3) G
2
D
1
D
Top View
3
G
(4) S
P-Channel MOSFET
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Marking Code: 8R
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-Source Voltage
VDS
-60
Gate-Source Voltage
VGS
± 20
Continuous Drain Current
TC = 25 °C
TC = 125 °C
Continuous Source Current (Diode Conduction)
Pulsed Drain Current
IS
a
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation a
ID
L = 0.1 mH
TC = 25 °C
TC = 125 °C
Operating Junction and Storage Temperature Range
V
-5.3
-3
-6.3
IDM
-21
IAS
-21
EAS
22
PD
UNIT
5
1.6
A
mJ
W
TJ, Tstg
-55 to +175
°C
SYMBOL
LIMIT
UNIT
RthJA
110
RthJF
30
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
Junction-to-Foot (Drain)
PCB
Mount b
°C/W
Notes
a. Pulse test; pulse width  300 μs, duty cycle  2 %.
b. When mounted on 1" square PCB (FR4 material).
c. Parametric verification ongoing.
S15-1676-Rev. A, 16-Jul-15
Document Number: 67987
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ3427EV
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current a
Drain-Source On-State Resistance a
Forward Transconductancea
VDS
VGS = 0, ID = -250 μA
-60
-
-
VGS(th)
VDS = VGS, ID = -250 μA
-1.5
-2
-2.5
IGSS
IDSS
ID(on)
RDS(on)
gfs
VDS = 0 V, VGS = ± 20 V
-
± 100
VGS = 0 V
VDS = -60 V
-
-
VGS = 0 V
VDS = -60 V, TJ = 125 °C
-
-
-50
VGS = 0 V
VDS = -60 V, TJ = 175 °C
-
-
-150
VGS = -10 V
VDS  -5 V
-10
-
-
VGS = -10 V
ID = -4.5 A
-
0.079
0.095
nA
-1
VGS = -10 V
ID = -4.5 A, TJ = 125 °C
-
-
0.148
VGS = -10 V
ID = -4.5 A, TJ = 175 °C
-
-
0.178
VGS = -4.5 V
ID = -3.5 A
-
0.112
0.135
-
9
-
-
700
1000
-
90
120
-
50
80
VDS = -15 V, ID = -4 A
V
μA
A

S
Dynamic b
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge c
Qg
Gate-Source Charge c
Qgs
Gate-Drain Charge c
Qgd
Gate Resistance
Turn-On Delay Time c
Rise Time c
Turn-Off Delay Time c
Fall Time c
Rg
VGS = 0 V
VGS = -10 V
VDS = -30 V, f = 1 MHz
VDS = -30 V, ID = -5 A
f = 1 MHz
td(on)
tr
td(off)
VDD = -30 V, RL = 6 
ID  -5 A, VGEN = -10 V, Rg = 1 
tf
Source-Drain Diode Ratings and Characteristics
-
15.3
22
-
2.5
-
-
5.4
-
2.5
5
7.5
-
8
12
-
24
35
-
25
38
-
33
50
pF
nC

ns
b
Pulsed Current a
ISM
Forward Voltage
VSD
IF = -1.6 A, VGS = 0 V
-
-
-21
A
-
-0.8
-1.2
V
Notes
a. Pulse test; pulse width  300 μs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
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Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.

S15-1676-Rev. A, 16-Jul-15
Document Number: 67987
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ3427EV
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
20
0.5
VGS = 10 V thru 5 V
0.4
RDS(on) - On-Resistance (Ω)
ID - Drain Current (A)
16
12
VGS = 4 V
8
0.3
0.2
VGS = 4.5 V
0.1
4
VGS = 3 V
VGS = 10 V
VGS = 1 V, 2 V
0
0
2
4
6
0.0
8
10
0
4
VDS - Drain-to-Source Voltage (V)
5
20
4
16
3
TC = 25 °C
2
1
20
12
TC = 25 °C
8
4
TC = 125 °C
TC = 125 °C
TC = - 55 °C
TC = - 55 °C
0
0
0
1
2
3
4
VGS - Gate-to-Source Voltage (V)
0
5
2
4
6
8
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
10
Transfer Characteristics
1200
15
TC = 25 °C
1000
TC = - 55 °C
12
Ciss
gfs - Transconductance (S)
C - Capacitance (pF)
16
On-Resistance vs. Drain Current and Gate Voltage
ID - Drain Current (A)
ID - Drain Current (A)
Output Characteristics
8
12
ID - Drain Current (A)
800
600
400
Coss
200
9
TC = 125 °C
6
3
Crss
0
0
0
10
20
30
40
50
60
0
2
4
6
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
Capacitance
Transconductance
S15-1676-Rev. A, 16-Jul-15
8
10
Document Number: 67987
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ3427EV
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Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.5
10
0.4
RDS(on) - On-Resistance (Ω)
VGS - Gate-to-Source Voltage (V)
ID = 5 A
8
6
4
0.3
TJ = 150 °C
0.2
0.1
2
TJ = 25 °C
0.0
0
0
5
10
15
0
20
2
Qg - Total Gate Charge (nC)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Gate Charge
On-Resistance vs. Gate-to-Source Voltage
2.0
1.0
1.7
0.7
VGS = 10V
VGS(th) Variance (V)
RDS(on) - On-Resistance (Normalized)
ID = 4.5 A
1.4
VGS = 4.5 V
1.1
0.8
ID = 5 mA
0.1
- 0.2
0.5
- 50 - 25
- 0.5
0
25
50
75
100
125
150
175
- 50 - 25
0
25
50
75
100
TJ - Junction Temperature (°C)
TJ - Temperature (°C)
On-Resistance vs. Junction Temperature
Threshold Voltage
125
150
175
125
150
175
- 61
VDS - Drain-to-Source Voltage (V)
10
IS - Source Current (A)
ID = 250 μA
0.4
1
TJ = 150 °C
0.1
TJ = 25 °C
0.01
0.001
0.0
0.2
0.4
0.6
0.8
1.0
1.2
- 63
ID = 1 mA
- 65
- 67
- 69
- 71
- 73
- 75
- 50 - 25
0
25
50
75
100
VSD - Source-to-Drain Voltage (V)
TJ - Junction Temperature (°C)
Source-Drain Diode Forward Voltage
Drain-to-Source Voltage vs. Junction Temperature
S15-1676-Rev. A, 16-Jul-15
Document Number: 67987
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ3427EV
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
100
IDM Limited
ID - Drain Current (A)
10
100 μs
1 ms
1
10 ms
Limited by RDS(on)*
100 ms
1 s, 10 s, DC
0.1
TC = 25 °C
Single Pulse
0.01
0.01
BVDSS Limited
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.05
PDM
0.1
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 110 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
S15-1676-Rev. A, 16-Jul-15
Document Number: 67987
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ3427EV
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
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Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?67987.
S15-1676-Rev. A, 16-Jul-15
Document Number: 67987
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Ordering Information
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Vishay Siliconix
TSOP-6
Ordering codes for the SQ rugged series power MOSFETs in the TSOP-6 package:
DATASHEET PART NUMBER
OLD ORDERING CODE a
NEW ORDERING CODE
SQ3410EV
SQ3410EV-T1-GE3
SQ3410EV-T1_GE3
SQ3418AEEV
-
SQ3418AEEV-T1_GE3
SQ3418EV
-
SQ3418EV-T1_GE3
SQ3419AEEV
-
SQ3419AEEV-T1_GE3
SQ3419EV
-
SQ3419EV-T1_GE3
SQ3425EV
-
SQ3425EV-T1_GE3
SQ3426AEEV
-
SQ3426AEEV-T1_GE3
SQ3426EV
-
SQ3426EV-T1_GE3
SQ3427AEEV
-
SQ3427AEEV-T1_GE3
SQ3427EV
-
SQ3427EV-T1_GE3
SQ3456BEV
SQ3456BEV-T1-GE3
SQ3456BEV-T1_GE3
SQ3457EV
SQ3457EV-T1-GE3
SQ3457EV-T1_GE3
SQ3460EV
SQ3460EV-T1-GE3
SQ3460EV-T1_GE3
SQ3461EV
-
SQ3461EV-T1_GE3
SQ3469EV
SQ3469EV-T1-GE3
SQ3469EV-T1_GE3
SQ3481EV
SQ3481EV-T1-GE3
SQ3481EV-T1_GE3
SQ3985EV
-
SQ3985EV-T1_GE3
Note
a. Old ordering code is obsolete and no longer valid for new orders
Revision: 03-Nov-15
Document Number: 65849
1
For technical questions, contact: [email protected]
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
TSOP: 5/6−LEAD
JEDEC Part Number: MO-193C
e1
e1
5
4
6
E1
1
2
5
4
E
E1
1
3
2
3
-B-
e
b
E
-B-
e
0.15 M C B A
5-LEAD TSOP
b
0.15 M C B A
6-LEAD TSOP
4x 1
-A-
D
0.17 Ref
c
R
R
A2 A
L2
Gauge Plane
Seating Plane
Seating Plane
0.08
C
L
A1
-C-
(L1)
4x 1
MILLIMETERS
Dim
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
L2
R
Min
Nom
Max
Min
Nom
Max
0.91
-
1.10
0.036
-
0.043
0.01
-
0.10
0.0004
-
0.004
0.90
-
1.00
0.035
0.038
0.039
0.30
0.32
0.45
0.012
0.013
0.018
0.10
0.15
0.20
0.004
0.006
0.008
2.95
3.05
3.10
0.116
0.120
0.122
2.70
2.85
2.98
0.106
0.112
0.117
1.55
1.65
1.70
0.061
0.065
0.067
0.95 BSC
0.0374 BSC
1.80
1.90
2.00
0.071
0.075
0.079
0.32
-
0.50
0.012
-
0.020
0.60 Ref
0.024 Ref
0.25 BSC
0.010 BSC
0.10
-
-
0.004
-
-
0
4
8
0
4
8
7 Nom
1
ECN: C-06593-Rev. I, 18-Dec-06
DWG: 5540
Document Number: 71200
18-Dec-06
INCHES
7 Nom
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1
AN823
Vishay Siliconix
Mounting LITTLE FOOTR TSOP-6 Power MOSFETs
Surface mounted power MOSFET packaging has been based on
integrated circuit and small signal packages. Those packages
have been modified to provide the improvements in heat transfer
required by power MOSFETs. Leadframe materials and design,
molding compounds, and die attach materials have been
changed. What has remained the same is the footprint of the
packages.
The basis of the pad design for surface mounted power MOSFET
is the basic footprint for the package. For the TSOP-6 package
outline drawing see http://www.vishay.com/doc?71200 and see
http://www.vishay.com/doc?72610 for the minimum pad footprint.
In converting the footprint to the pad set for a power MOSFET, you
must remember that not only do you want to make electrical
connection to the package, but you must made thermal connection
and provide a means to draw heat from the package, and move it
away from the package.
In the case of the TSOP-6 package, the electrical connections are
very simple. Pins 1, 2, 5, and 6 are the drain of the MOSFET and
are connected together. For a small signal device or integrated
circuit, typical connections would be made with traces that are
0.020 inches wide. Since the drain pins serve the additional
function of providing the thermal connection to the package, this
level of connection is inadequate. The total cross section of the
copper may be adequate to carry the current required for the
application, but it presents a large thermal impedance. Also, heat
spreads in a circular fashion from the heat source. In this case the
drain pins are the heat sources when looking at heat spread on the
PC board.
Since surface mounted packages are small, and reflow soldering
is the most common form of soldering for surface mount
components, “thermal” connections from the planar copper to the
pads have not been used. Even if additional planar copper area is
used, there should be no problems in the soldering process. The
actual solder connections are defined by the solder mask
openings. By combining the basic footprint with the copper plane
on the drain pins, the solder mask generation occurs automatically.
A final item to keep in mind is the width of the power traces. The
absolute minimum power trace width must be determined by the
amount of current it has to carry. For thermal reasons, this
minimum width should be at least 0.020 inches. The use of wide
traces connected to the drain plane provides a low impedance
path for heat to move away from the device.
REFLOW SOLDERING
Vishay Siliconix surface-mount packages meet solder reflow
reliability requirements. Devices are subjected to solder reflow as a
test preconditioning and are then reliability-tested using
temperature cycle, bias humidity, HAST, or pressure pot. The
solder reflow temperature profile used, and the temperatures and
time duration, are shown in Figures 2 and 3.
Figure 1 shows the copper spreading recommended footprint for
the TSOP-6 package. This pattern shows the starting point for
utilizing the board area available for the heat spreading copper. To
create this pattern, a plane of copper overlays the basic pattern on
pins 1,2,5, and 6. The copper plane connects the drain pins
electrically, but more importantly provides planar copper to draw
heat from the drain leads and start the process of spreading the
heat so it can be dissipated into the ambient air. Notice that the
planar copper is shaped like a “T” to move heat away from the
drain leads in all directions. This pattern uses all the available area
underneath the body for this purpose.
0.167
4.25
0.074
1.875
0.014
0.35
0.122
3.1
0.026
0.65
0.049
1.25
0.049
1.25
0.010
0.25
FIGURE 1. Recommended Copper Spreading Footprint
Document Number: 71743
27-Feb-04
Ramp-Up Rate
+6_C/Second Maximum
Temperature @ 155 " 15_C
120 Seconds Maximum
Temperature Above 180_C
70 − 180 Seconds
Maximum Temperature
240 +5/−0_C
Time at Maximum Temperature
20 − 40 Seconds
Ramp-Down Rate
+6_C/Second Maximum
FIGURE 2. Solder Reflow Temperature Profile
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1
AN823
Vishay Siliconix
10 s (max)
255 − 260_C
1X4_C/s (max)
3-6_C/s (max)
217_C
140 − 170_C
60 s (max)
60-120 s (min)
Pre-Heating Zone
3_C/s (max)
Reflow Zone
Maximum peak temperature at 240_C is allowed.
FIGURE 3. Solder Reflow Temperature and Time Durations
THERMAL PERFORMANCE
TABLE 1.
Equivalent Steady State Performance—TSOP-6
Thermal Resistance Rqjf
30_C/W
On-Resistance vs. Junction Temperature
1.6
VGS = 4.5 V
ID = 6.1 A
1.4
rDS(on) − On-Resiistance
(Normalized)
A basic measure of a device’s thermal performance is the
junction-to-case thermal resistance, Rqjc, or the
junction-to-foot thermal resistance, Rqjf. This parameter is
measured for the device mounted to an infinite heat sink and
is therefore a characterization of the device only, in other
words, independent of the properties of the object to which the
device is mounted. Table 1 shows the thermal performance
of the TSOP-6.
1.2
1.0
0.8
0.6
−50
SYSTEM AND ELECTRICAL IMPACT OF
TSOP-6
−25
0
25
50
75
100
125
150
TJ − Junction Temperature (_C)
FIGURE 4. Si3434DV
In any design, one must take into account the change in
MOSFET rDS(on) with temperature (Figure 4).
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2
Document Number: 71743
27-Feb-04
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR TSOP-6
0.099
0.039
0.020
0.019
(1.001)
(0.508)
(0.493)
0.064
(1.626)
0.028
(0.699)
(3.023)
0.119
(2.510)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
APPLICATION NOTE
Return to Index
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Document Number: 72610
Revision: 21-Jan-08
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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
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Document Number: 91000