Data Sheet

BAS86
Schottky barrier single diode
25 July 2012
Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier diode with an integrated guard ring for stress protection,
encapsulated in a small hermetically sealed SOD80C glass Surface-Mounted Device
(SMD) package with tin-plated metal discs at each end. It is suitable for “automatic
placement” and as such it can withstand immersion soldering.
1.2 Features and benefits
• Low forward voltage
• High breakdown voltage
• Guard ring protected
• Hermetically sealed glass SMD package.
1.3 Applications
• Ultra high-speed switching
• Voltage clamping
• Protection circuits
• Blocking diodes
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
IF(AV)
average forward
current
VR
reverse voltage
VF
forward voltage
[1]
Conditions
[1]
IF = 100 mA; Tamb = 25 °C
Min
Typ
Max
Unit
-
-
200
mA
-
-
50
V
-
-
900
mV
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
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BAS86
NXP Semiconductors
Schottky barrier single diode
2. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
K
cathode[1]
2
A
anode
[1]
Simplified outline
k
Graphic symbol
K
a
A
aaa-003679
LLDS; MiniMelf (SOD80C)
The marking band indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
BAS86
Name
Description
Version
LLDS;
MiniMelf
hermetically sealed glass surface-mounted package; 2
connectors
SOD80C
4. Marking
Table 4.
Marking codes
Type number
Marking code
BAS86
marking band
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VR
Min
Max
Unit
reverse voltage
-
50
V
IF
forward current
-
200
mA
IF(AV)
average forward current
-
200
mA
IFRM
repetitive peak forward current
tp ≤ 1 s; δ ≤ 0.5
-
500
mA
IFSM
non-repetitive peak forward
current
tp = 10 ms; Tj(init) = 25 °C
-
5
A
Tj
junction temperature
-
125
°C
Tamb
ambient temperature
-65
125
°C
Tstg
storage temperature
-65
150
°C
[1]
BAS86
Product data sheet
Conditions
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
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BAS86
NXP Semiconductors
Schottky barrier single diode
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
[1]
[1]
Min
Typ
Max
Unit
-
-
320
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 0.1 mA; Tamb = 25 °C
-
-
300
mV
IF = 1 mA; Tamb = 25 °C
-
-
380
mV
IF = 10 mA; Tamb = 25 °C
-
-
450
mV
IF = 30 mA; Tamb = 25 °C
-
-
600
mV
IF = 100 mA; Tamb = 25 °C
-
-
900
mV
VR = 40 V; Tamb = 25 °C; pulsed;
-
-
5
µA
IR
reverse current
tp ≤ 300 µs; δ ≤ 0.02
Cd
diode capacitance
f = 1 MHz; Tamb = 25 °C; VR = 1 V
-
-
8
pF
trr
reverse recovery time
IF = 10 mA; IR = 10 mA; RL = 100 Ω;
-
-
4
ns
IR(meas) = 1 mA; Tamb = 25 °C
BAS86
Product data sheet
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BAS86
NXP Semiconductors
Schottky barrier single diode
mld357
103
IF
(mA)
(1) (2) (3)
mgc686
105
IR
(nA)
104
(1)
102
(2)
103
102
10
(1)
1
10
(2) (3)
(3)
1
10- 1
0
0.4
0.8
VF (V)
10- 1
1.2
10
20
30
40
VR (V)
50
(1) Tamb = 85 °C
(1) Tamb = 125 °C
(2) Tamb = 25 °C
(2) Tamb = 85 °C
(3) Tamb = −40 °C
(3) Tamb = 25 °C
Fig. 1.
0
Forward current as a function of forward
voltage; typical values
Fig. 2.
mgc687
12
Reverse current as a function of reverse
voltage; typical values
mra540
250
IF(AV)
(mA)
Cd
(pF)
200
8
150
100
4
50
0
0
10
20
30
40
VR (V)
0
50
50
100
Tamb (°C)
150
FR4 PCB, standard footprint
Tamb = 25 °C; f = 1 MHz
Fig. 3.
0
Diode capacitance as a function of reverse
voltage; typical values
Fig. 4.
Average forward current as a function of
ambient temperature; derating curve
8. Test information
BAS86
Product data sheet
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BAS86
NXP Semiconductors
Schottky barrier single diode
tr
D.U.T.
RS = 50 Ω
IF
tp
t
10 %
+ IF
SAMPLING
OSCILLOSCOPE
trr
t
Ri = 50 Ω
V = VR + IF × RS
VR
mga881
(1)
90 %
input signal
output signal
(1) IR = 1 mA
Fig. 5.
Reverse recovery time test circuit and waveforms
9. Package outline
0.3
0.3
3.7
3.3
1.60
1.45
Dimensions in mm
Fig. 6.
06-03-16
LLDS; MiniMelf (SOD80C)
10. Soldering
4.55
4.30
2.30
solder lands
solder paste
2.25 1.70 1.60
solder resist
occupied area
Dimensions in mm
0.90
(2x)
Fig. 7.
sod080c
Reflow soldering footprint for SOD80C (LLDS; MiniMelf)
BAS86
Product data sheet
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BAS86
NXP Semiconductors
Schottky barrier single diode
6.30
4.90
2.70
1.90
solder lands
solder resist
occupied area
2.90 1.70
tracks
Dimensions in mm
sod080c
Fig. 8.
Wave soldering footprint for SOD80C (LLDS; MiniMelf)
11. Revision history
Table 8.
Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
BAS86 v.5
20120725
Product data sheet
-
BAS86 v.4
Modifications:
•
BAS86 v.4
20100908
Product data sheet
-
BAS86 v.3
BAS86 v.3
20000525
Product specification
-
BAS86 v.2
BAS86 v.2
19961001
Product specification
-
BAS86 v.1
BAS86 v.1
19960320
Product specification
-
-
BAS86
Product data sheet
Editorial update
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BAS86
NXP Semiconductors
Schottky barrier single diode
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
12. Legal information
12.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
Definition
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
[2]
[3]
12.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
BAS86
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
All information provided in this document is subject to legal disclaimers.
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Schottky barrier single diode
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
customer (a) shall use the product without NXP Semiconductors’ warranty
of the product for such automotive applications, use and specifications, and
(b) whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
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standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
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between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
BAS86
Product data sheet
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BAS86
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13. Contents
1
1.1
1.2
1.3
1.4
Product profile ....................................................... 1
General description .............................................. 1
Features and benefits ...........................................1
Applications .......................................................... 1
Quick reference data ............................................ 1
2
Pinning information ............................................... 2
3
Ordering information ............................................. 2
4
Marking ................................................................... 2
5
Limiting values .......................................................2
6
Thermal characteristics .........................................3
7
Characteristics ....................................................... 3
8
Test information ..................................................... 4
9
Package outline ..................................................... 5
10
Soldering ................................................................ 5
11
Revision history ..................................................... 6
12
12.1
12.2
12.3
12.4
Legal information ...................................................7
Data sheet status ................................................. 7
Definitions .............................................................7
Disclaimers ...........................................................7
Trademarks .......................................................... 8
© NXP B.V. 2012. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 25 July 2012
BAS86
Product data sheet
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