Material Content Data Sheet Sales Product Name ESD0P8RFL E6327 MA# MA000377940 Package PG-TSLP-4-7 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material non noble metal noble metal organic material plastics inorganic material noble metal non noble metal noble metal noble metal < 10% tin gold silicon nickel gold carbon black epoxy resin silicondioxide gold tin gold silver 7440-31-5 7440-57-5 7440-21-3 7440-02-0 7440-57-5 1333-86-4 60676-86-0 7440-57-5 7440-31-5 7440-57-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 1.02 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.001 0.07 714 0.003 0.28 2768 0.035 3.38 3.73 33779 37261 0.265 25.94 25.94 259439 259439 0.010 0.93 0.93 9344 9344 0.006 0.59 0.081 7.92 0.512 50.14 0.014 1.32 0.025 2.47 0.027 2.64 0.044 4.32 5865 79175 58.65 501440 2. 3. 3.79 24665 6.96 43163 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Infineon Technologies AG Address 81726 München Internet www.infineon.com 37881 26432 Sum in total: 100,00 Company 586480 13216 Important Remarks: 1. Sum [ppm] 69595 1000000