Data Sheet

62
'
PMEG4005EPK
40 V, 0.5 A low VF MEGA Schottky barrier rectifier
Rev. 2 — 6 March 2012
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a leadless ultra small
SOD1608 (DFN1608D-2) Surface-Mounted Device (SMD) plastic package with visible
and solderable side pads.
1.2 Features and benefits
 Average forward current: IF(AV) ≤ 0.5 A
 AEC-Q101 qualified
 Reverse voltage: VR ≤ 40 V
 Solderable side pads
 Low forward voltage VF ≤ 590 mV
 Package height typ. 0.37 mm
 Low reverse current
 Ultra small and leadless SMD plastic
package
1.3 Applications
 Low voltage rectification
 Low power consumption applications
 High efficiency DC-to-DC conversion
 Ultra high-speed switching
 Switch mode power supply
 Reverse polarity protection
 LED backlight for mobile application
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
average forward
current
δ = 0.5; f = 20 kHz; Tamb ≤ 115 °C;
square wave
IF(AV)
Min
Typ
Max
Unit
-
-
0.5
A
δ = 0.5; f = 20 kHz; Tsp ≤ 140 °C;
square wave
-
-
0.5
A
[1]
VR
reverse voltage
Tj = 25 °C
-
-
40
V
VF
forward voltage
IF = 500 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02; Tj = 25 °C
-
530
590
mV
IR
reverse current
VR = 10 V; Tj = 25 °C
-
0.4
2
µA
trr
reverse recovery time
IR = 0.5 A; IF = 0.5 A; IR(meas) = 0.1 A;
Tj = 25 °C
-
2
-
ns
[1]
Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
PMEG4005EPK
NXP Semiconductors
40 V, 0.5 A low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Pin
Pinning information
Symbol Description
1
K
cathode[1]
2
A
anode
Simplified outline
Graphic symbol
1
1
2
2
sym001
Transparent top view
SOD1608 (DFN1608D-2)
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PMEG4005EPK
DFN1608D-2
Leadless ultra small plastic package; 2 terminals
SOD1608
4. Marking
Table 4.
Marking codes
Type number
Marking code
PMEG4005EPK
0010 0000
VENDOR CODE
CATHODE BAR
READING DIRECTION
READING EXAMPLE:
0111
1011
MARKING CODE
(EXAMPLE)
READING DIRECTION
006aac909
Fig 1.
SOD1608 binary marking code description
PMEG4005EPK
Product data sheet
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage
Tj = 25 °C
-
40
V
IF
forward current
Tsp ≤ 135 °C
-
0.7
A
average forward current
δ = 0.5; f = 20 kHz; square wave;
Tamb ≤ 115 °C
-
0.5
A
-
0.5
A
IF(AV)
[1]
δ = 0.5; f = 20 kHz; square wave;
Tsp ≤ 140 °C
IFRM
repetitive peak forward current
tp ≤ 1 ms; δ ≤ 0.25
-
2
A
IFSM
non-repetitive peak forward
current
tp = 8 ms; Tj(init) = 25 °C; square wave
-
3
A
Ptot
total power dissipation
Tamb ≤ 25 °C
[2][3]
-
390
mW
[4][3]
-
830
mW
[1][3]
-
1470
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1]
Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Reflow soldering is the only recommended soldering method.
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
thermal resistance
from junction to
ambient
Conditions
in free air
thermal resistance
from junction to solder
point
Min
Typ
Max
Unit
[1][2][3]
-
-
320
K/W
[1][4][3]
-
-
150
K/W
[1][5][3]
-
-
85
K/W
[6]
-
-
20
K/W
[1]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PRare a significant
part of the total power losses.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Reflow soldering is the only recommended soldering method.
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[5]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
[6]
Soldering point of cathode tab.
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Product data sheet
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Rev. 2 — 6 March 2012
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PMEG4005EPK
NXP Semiconductors
40 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aad010
103
duty cycle =
Zth(j-a)
(K/W)
1
0.75
0.5
0.33
102
0.25
0.2
0.1
0.05
0
0.02
0.01
10
10-3
10-2
10-1
1
10
102
tp (s)
103
FR4 PCB, standard footprint
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aad011
103
Zth(j-a)
(K/W)
duty cycle =
1
0.75
102
0.5
0.33
0.2
0.25
0.1
0.05
0
10
10-3
0.02
0.01
10-2
10-1
1
10
102
tp (s)
103
FR4 PCB, mounting pad for cathode 1 cm2
Fig 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG4005EPK
Product data sheet
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PMEG4005EPK
NXP Semiconductors
40 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aad012
102
duty cycle = 1
0.75
Zth(j-a)
(K/W)
0.5
0.33
0.25
0.2
0.1
0
0.05
0.02
0.01
10
10-3
10-2
10-1
1
102
10
103
tp (s)
Ceramic PCB, Al2O3, standard footprint
Fig 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
7. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 100 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02; Tj = 25 °C
-
380
420
mV
IF = 500 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02; Tj = 25 °C
-
530
590
mV
VR = 10 V; Tj = 25 °C
-
0.4
2
µA
VR = 40 V; Tj = 25 °C
-
2
10
µA
VR = 1 V; f = 1 MHz; Tj = 25 °C
-
30
35
pF
VR = 10 V; f = 1 MHz; Tj = 25 °C
-
10
15
pF
IR
Cd
reverse current
diode capacitance
trr
reverse recovery time
IF = 0.5 A; IR = 0.5 A; IR(meas) = 0.1 A;
Tj = 25 °C
-
2
-
ns
VFRM
peak forward recovery
voltage
IF = 0.5 A; dIF/dt = 20 A/µs; Tj = 25 °C
-
545
-
mV
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Product data sheet
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aad013
10
IR
(A)
IF
(A)
1
006aad014
10-3
(1)
10-4
(2)
10-5
(1)
10-6
(2)
10-1
(3)
10-7
(3) (4) (5)
10-2
10-8
(4)
10-9
10-3
10-10
10-4
0.0
0.4
0.8
VF (V)
1.2
10-11
0
10
20
(1) Tj = 150 °C
(1) Tj = 125 °C
(2) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = 25 °C
(4) Tj = −40 °C
30
40
VR (V)
(5) Tj = −40 °C
Fig 5.
Forward current as a function of forward
voltage; typical values
Fig 6.
006aad015
50
Reverse current as a function of reverse
voltage; typical values
006aad016
0.4
Cd
(pF)
PF(AV)
(W)
(4)
(3)
40
0.3
30
(2)
0.2
(1)
20
0.1
10
0
0
10
20
30
VR (V)
0.0
0.00
40
f = 1 MHz; Tamb = 25 °C
0.25
0.50
IF(AV) (A)
0.75
Tj = 150 °C
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1
Fig 7.
Diode capacitance as a function of reverse
voltage; typical values
PMEG4005EPK
Product data sheet
Fig 8.
Average forward power dissipation as a
function of average forward current; typical
values
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aad017
0.05
006aad018
0.75
PR(AV)
(W)
(1)
IF(AV)
(A)
0.04
(2)
0.50
(1)
0.03
(2)
(3)
(3)
0.02
0.25
(4)
(4)
0.01
0.00
0
10
20
30
VR (V)
40
0.00
0
25
50
75
100
125
Tj = 125 °C
FR4 PCB, standard footprint
(1) δ = 1
Tj = 150 °C
(2) δ = 0.9
(1) δ = 1 (DC)
(3) δ = 0.8
(2) δ = 0.5; f = 20 kHz
(4) δ = 0.5
(3) δ = 0.2; f = 20 kHz
150
175
Tamb (°C)
(4) δ = 0.1; f = 20 kHz
Fig 9.
Average reverse power dissipation as a
function of reverse voltage; typical values
006aad019
0.75
Fig 10. Average forward current as a function of
ambient temperature; typical values
006aad020
0.75
(1)
(1)
IF(AV)
(A)
IF(AV)
(A)
(2)
(2)
0.50
0.50
(3)
(3)
0.25
0.25
(4)
0.00
0
(4)
25
50
75
100
125
150
175
Tamb (°C)
0.00
0
25
50
75
100
125
150
175
Tamb (°C)
FR4 PCB, mounting pad for cathode 1 cm2
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
Tj = 150 °C
(1) δ = 1 (DC)
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 11. Average forward current as a function of
ambient temperature; typical values
PMEG4005EPK
Product data sheet
Fig 12. Average forward current as a function of
ambient temperature; typical values
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PMEG4005EPK
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
006aad021
0.75
(1)
IF(AV)
(A)
(2)
0.50
(3)
0.25
(4)
0.00
0
25
50
75
100
125
150
175
Tsp (°C)
Tj = 150 °C
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 13. Average forward current as a function of solder point temperature; typical values
8. Test information
IF
IR(meas)
time
IR
trr
006aad022
Fig 14. Reverse recovery definition
PMEG4005EPK
Product data sheet
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
IF
time
VF
VFRM
VF
time
001aab912
Fig 15. Forward recovery definition
P
tcy
duty cycle δ =
tp
tcy
tp
t
006aac658
Fig 16. Duty cycle definition
The current ratings for the typical waveforms are calculated according to the equations:
IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with
IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics
Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and
is suitable for use in automotive applications.
PMEG4005EPK
Product data sheet
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
9. Package outline
0.40
0.34
0.85
0.75
1
0.80
0.72
1.65
1.55
0.40
0.32
2
0.75
0.67
0.04
Dimensions in mm
11-11-21
Fig 17. Package outline SOD1608 (DFN1608D-2)
10. Soldering
Footprint information for reflow soldering of SOD1608 package
SOD1608
1.15
0.75
1.05
0.65
0.95
0.55
0.9 0.8 0.7
0.7 0.8 0.9
1
2
0.1
0.2
1.8
1.9
2.0
solder land
solder land plus solder paste
solder paste deposit
solder resist
occupied area
Dimensions in mm
sod1608_fr
Fig 18. Reflow soldering footprint for SOD1608 (DFN1608D-2)
PMEG4005EPK
Product data sheet
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
11. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG4005EPK v.2
20120306
Product data sheet
-
PMEG4005EPK v.1
-
-
Modifications:
PMEG4005EPK v.1
PMEG4005EPK
Product data sheet
•
Fig 14. and 15: corrected title
20120306
Product data sheet
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term 'short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URLhttp://www.nxp.com.
12.2 Definitions
Preview— The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft— The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet— A short data sheet is an extract from a full data sheet with
the same product type number(s) and title. A short data sheet is intended for
quick reference only and should not be relied upon to contain detailed and full
information. For detailed and full information see the relevant full data sheet,
which is available on request via the local NXP Semiconductors sales office.
In case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Product specification— The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability— Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with theTerms and conditions of commercial saleof NXP Semiconductors.
PMEG4005EPK
Product data sheet
Right to make changes— NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications— This NXP Semiconductors
product has been qualified for use in automotive applications. Unless
otherwise agreed in writing, the product is not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
NXP Semiconductors product can reasonably be expected to result in
personal injury, death or severe property or environmental damage. NXP
Semiconductors and its suppliers accept no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer's own risk.
Quick reference data— The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications— Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values— Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Export control— This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Terms and conditions of commercial sale— NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
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agreed in a valid written individual agreement. In case an individual
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Translations— A non-English (translated) version of a document is for
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conveyance or implication of any license under any copyrights, patents or
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12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G
reenChip,HiPerSmart,HITAG,I²C-buslogo,ICODE,I-CODE,ITEC,Labelution
,MIFARE,MIFARE Plus,MIFARE Ultralight,MoReUse,QLPAK,Silicon
Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMediaand
UCODE— are trademarks of NXP B.V.
HD RadioandHD Radiologo — are trademarks of iBiquity Digital Corporation.
13. Contact information
For more information, please visit:http://www.nxp.com
For sales office addresses, please send an email to:[email protected]
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40 V, 0.5 A low VF MEGA Schottky barrier rectifier
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
12.1
12.2
12.3
12.4
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
Thermal characteristics . . . . . . . . . . . . . . . . . . .3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Test information . . . . . . . . . . . . . . . . . . . . . . . . . .8
Quality information . . . . . . . . . . . . . . . . . . . . . . .9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Contact information. . . . . . . . . . . . . . . . . . . . . .13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 6 March 2012
Document identifier: PMEG4005EPK
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