ESD3V3U1U-02LRH Data Sheet (1.2 MB, EN)

TVS Diodes
Transient Voltage Suppressor Diodes
ESD3V3U1U Series
Uni-directional Ultra-low Capacitance ESD / Transient Protection Diode
ESD3V3U1U-02LS
ESD3V3U1U-02LRH
Data Sheet
Revision 1.0, 2011-04-12
Final
Industrial and Multi-Market
Edition 2011-04-12
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2011 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
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and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
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Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
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be endangered.
ESD3V3U1U Series
Revision History
Page or Item
Subjects (major changes since previous revision)
Revision 1.0, 2011-04-12
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™,
CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™,
EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™,
ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™,
PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SMARTi™,
SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™,
XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™,
REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership.
Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation
Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation.
FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of
Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of
INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of
Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP.
MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2010-06-09
Final Data Sheet
3
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
1.1
1.2
Uni-directional Ultra-low Capacitance ESD / Transient Protection Diode . . . . . . . . . . . . . . . . . . . 7
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
3.1
3.2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Typical Characteristics at TA=25°C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5
Ordering Information Scheme (Examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6
6.1
6.2
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PG-TSSLP-2-1 (mm) [3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PG-TSLP-2-7 (mm)[3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Final Data Sheet
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Revision 1.0, 2011-04-12
ESD3V3U1U Series
List of Figures
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Figure 16
Figure 17
Figure 18
Pin Configuration and Schematic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions of Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Line capacitance CL=f(VR) f = 1MHz, from pin 1 to pin 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Line capacitance CL=f(f), from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Line capacitance CL=f(TA), from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Reverse current IR=f(TA) , VR=3.3 V, from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Clamping voltage VTLP=f(ITLP), from pin 1 to pin 2[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Forward clamping voltage VTLP=f(ITLP) , from pin 2 to pin 1[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Single line, uni-directional ESD / Transient protection[2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PG-TSSLP-2-1: Package overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PG-TSSLP-2-1: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PG-TSSLP-2-1: Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PG-TSSLP-2-1: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PG-TSLP-2-7: Package overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PG-TSLP-2-7: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PG-TSLP-2-7: Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PG-TSLP-2-7: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Final Data Sheet
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ESD3V3U1U Series
List of Tables
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Rating at TA = 25 °C, unless otherwise specified. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Characteristics at TA = 25 °C, unless otherwise specifie . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Final Data Sheet
6
7
8
8
9
9
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ESD3V3U1U Series
Uni-directional Ultra-low Capacitance ESD / Transient Protection Diode
1
Uni-directional Ultra-low Capacitance ESD / Transient Protection
Diode
1.1
Features
•
•
•
•
•
ESD / Transient protection of high speed data lines exceeding
– IEC61000-4-2 (ESD): ±20 kV (air / contact)
– IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns)
– IEC61000-4-5 (surge): 3 A (8/20 μs)
Maximum working voltage: VRWM = 3.3 V
Ultra low capacitance: CL = 0.4 pF (typical)
Low clamping voltage, low dynamic resistance RDYN = 0.6 Ω (typical)
Pb-free (RoHS compliant) and halogen free package, very small form factor down to 0.62 x 0.32 x 0.31 mm3
1.2
•
•
•
Application Examples
HDMI, USB 2.0/USB 3.0, DisplayPort, DVI
10/100/1000 Ethernet, Firewire, S-ATA
Mobile HDMI Link, MDDI, MIPI, etc.
2
Product Description
Pin 1
Pin 1
Pin 2
TSLP-2
Pin 1 marking
(lasered)
TSSLP -2
Pin 1
Pin 2
Pin 2
a) Pin configuration
b) Schematic diagram
P G-TS (S)LP -2-S ingle_Die_diode_P inConf_and_S chematicDiag.v st. vs d
Figure 1
Pin Configuration and Schematic Diagram
Table 1
Ordering Information
Type
Package
Configuration
ESD3V3U1U-02LS
PG-TSSLP-2-1
1 line, uni-directional
Z
1 line, uni-directional
E3
ESD3V3U1U-02LRH PG-TSLP-2-7
Final Data Sheet
7
Marking code
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Characteristics
3
Characteristics
Table 2
Maximum Rating at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
VESD
–
–
20
kV
IPP
–
–
3
A
Operating temperature range
TOP
-55
–
125
°C
Storage temperature
1) VESD according to IEC61000-4-2
2) IPP according to IEC61000-4-5
Tstg
-65
–
150
°C
ESD (air / contact) discharge
1)
Peak pulse current (tp = 8/20 μs)
2)
Electrical Characteristics at TA = 25 °C, unless otherwise specified
3.1
R DYN: Dynamic resistance
IF
V BR: Breakdown voltage
V RWM: Maximum working voltage
IPP
R DYN
V CL: Clamping voltage
V FC: Forward clamping voltage
I PP: Peak pulse current
IF
VCL
VBR
VRWM
VR
VF
IRWM
VF
VFC
IR
V F: Forward voltage
I F: Forward current
RDYN
V R: Reverse voltage
I PP
I R: Reverse current
IR
Diode_Charac teris tic _Curv e_Uni-direc tional. vs d
Figure 2
Definitions of Electrical Characteristics
Table 3
DC Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Reverse working voltage VRWM
–
–
3.3
V
Pin 1 to Pin 2
Breakdown voltage
VBR
5
–
–
V
IBR = 1 mA, from Pin 1
to Pin 2
Reverse current
IR
–
<1
50
nA
VR = 3.3 V, from Pin 1
to Pin 2
Final Data Sheet
8
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Characteristics
Table 4
RF Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
1)
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
Line capacitance
CL
–
0.4
0.6
pF
VR = 0 V, f = 1 MHz
Serie inductance
LS
–
0.2
–
nH
ESD3V3U1U-02LS
–
0.4
–
nH
ESD3V3U1U-02LRH
Unit
Note /
Test Condition
V
IPP = 16 A,
1) Total capacitance line to ground
Table 5
ESD Characteristics at TA = 25 °C, unless otherwise specifie
Parameter
Symbol
Clamping voltage
VCL
Values
Min.
Typ.
Max.
–
19
–
from Pin 1 to Pin 2
–
28
–
V
IPP = 30 A,
from Pin 1 to Pin 2
Forward clamping voltage VFC
–
10
–
V
IPP = 16 A,
from Pin 2 to Pin 1
–
17
–
V
IPP = 30 A,
from Pin 2 to Pin 1
Dynamic resistance
1)
RDYN
–
0.6
–
Ω
Pin 1 to Pin 2
–
0.5
–
Ω
Pin 2 to Pin 1
1) Please refer to Application Note AN210. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window: t1 = 30 ns
to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP charactertistics between IPP1 = 10 A and
IPP2 = 40 A.
Final Data Sheet
9
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Characteristics
Typical Characteristics at TA=25°C, unless otherwise specified
3.2
0.6
CL [pF]
0.5
0.4
0.3
0.2
Figure 3
0
0.5
1
1.5
VR [V]
2
2.5
3
2500
3000
Line capacitance CL=f(VR) f = 1MHz, from pin 1 to pin 2
0.6
CL [pF]
0.5
0.4
3.3V
0V
0.3
0.2
0
500
1000
1500
2000
f [MHz]
Figure 4
Line capacitance CL=f(f), from pin 1 to pin 2
Final Data Sheet
10
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Characteristics
0.6
CL [pF]
0.5
3.3V
0.4
0V
0.3
0.2
-50
Figure 5
-25
0
25
TA [°C]
50
75
100
Line capacitance CL=f(TA), from pin 1 to pin 2
10
-6
IR [A]
10-7
10
-8
10
-9
10-10
Figure 6
10
-11
10
-12
25
50
75
TA [°C]
100
125
Reverse current IR=f(TA) , VR=3.3 V, from pin 1 to pin 2
Final Data Sheet
11
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Characteristics
RDYN=0.6Ω
20
10
10
5
0
0
10
15
20
25
VTLP [V]
30
35
40
0
20
ESD3V3U1U-02xx
RDYN
RDYN=0.5Ω
30
ITLP [A]
5
Clamping voltage VTLP=f(ITLP), from pin 1 to pin 2[1]
40
Figure 8
15
15
20
10
10
5
0
0
0
5
10
15
20
25
VTLP [V]
30
35
40
Equivalent VIEC [kV]
ITLP [A]
30
Figure 7
20
ESD3V3U1U-02xx
RDYN
Equivalent VIEC [kV]
40
Forward clamping voltage VTLP=f(ITLP) , from pin 2 to pin 1[1]
Final Data Sheet
12
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Application Information
4
Application Information
Application_ESD3V3U1U-02xxx.vsd
Figure 9
Single line, uni-directional ESD / Transient protection[2]
Final Data Sheet
13
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Ordering Information Scheme (Examples)
5
ESD
Ordering Information Scheme (Examples)
0P1
RF
- XX YY
Package
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
For Radio Frequency Applications
Line Capacitance CL in pF: (i.e.: 0P1 = 0.1pF)
ESD 5V3 U n U - XX YY
Package or Application
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
S = SOT363
U = SC74
XX = Application family:
LC = Low Clamp
HDMI
Uni- / Bi-directional or Rail to Rail protection
Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines)
Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF)
Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V)
Figure 10
Ordering information scheme
Final Data Sheet
14
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Package Information
6
Package Information
6.1
PG-TSSLP-2-1 (mm) [3]
Top view
Bottom view
0.31 +0.01
-0.02
0.62 ±0.035
2
1
0.2 ±0.025 1)
0.355 ±0.025
0.32 ±0.035
0.26 ±0.025 1)
Cathode
marking
1) Dimension applies to plated terminal
TSSLP-2-1,-2-PO V05
PG-TSSLP-2-1: Package overview
0.19
0.24
Solder mask
0.19
0.57
0.62
Copper
0.19
0.27
0.14
0.32
0.24
Figure 11
Stencil apertures
TSSLP-2-1,-2-FP V02
Figure 12
PG-TSSLP-2-1: Footprint
0.35
Cathode
marking
Figure 13
PG-TSSLP-2-1: Packing
Figure 14
PG-TSSLP-2-1: Marking (example)
Final Data Sheet
8
0.73
4
0.43
TSSLP-2-1,-2-TP V03
15
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Package Information
6.2
PG-TSLP-2-7 (mm)[3]
Top view
Bottom view
0.39 +0.01
-0.03
0.6 ±0.05
0.05 MAX.
1±0.05
0.65 ±0.05
2
0.25 ±0.035 1)
1
0.5 ±0.035 1)
Cathode
marking
1) Dimension applies to plated terminal
TSLP 2 7 PO V02
0.45
Copper
Solder mask
0.375
0.35
0.275
1
0.925
0.3
0.6
0.275
PG-TSLP-2-7: Package overview
0.35
Figure 15
Stencil apertures
TSLP-2-7-FP V01
Figure 16
PG-TSLP-2-7: Footprint
0.5
1.16
Orientation
marking
Figure 17
PG-TSLP-2-7: Packing
Figure 18
PG-TSLP-2-7: Marking (example)
Final Data Sheet
8
4
0.76
TSLP-2-7-TP V03
16
Revision 1.0, 2011-04-12
ESD3V3U1U Series
Terminology
Terminology
CL
Line capacitance
EFT
Electrical Fast Transient
ESD
Electrostatic Discharge
HDMI
High Definition Multimedia Interface
IEC
International Electrotechnical Commission
IPP
Peak pulse current
IR
Reverse current
IRWM
Maximum Reverse working Current
LCD
Liquid Crystal Display
LS
Serial inductance
MDDI
Mobile Display Digital Interface
MIPI
Mobile Industrial Processor Interface
RoHS
Restriction of Hazardous Substances Directive
S-ATA
Serial Advanced Technology Attachment
TA
Ambient temperature
TOP
Operation temperature
tp
Pulse duration
Tstg
Storage temperature
USB
Universal Serial Bus
VBR
Breakdown Voltage
VCL
Reverse Clamping Voltage
VESD
Electrostatic Discharge Voltage
VFC
Forward Clamping Voltage
VR
Reverse Voltage
VRWM
Maximum Reverse Working Voltage
Final Data Sheet
17
Revision 1.0, 2011-04-12
ESD3V3U1U Series
References
References
[1]
Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP
Characterization Methodology
[2]
Infineon AG - Application Note AN140: ESD Protection for Digital High-Speed Interfaces (HDMI, FireWire,
...) using ESD5V3U1U)
[3]
Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Package
Final Data Sheet
18
Revision 1.0, 2011-04-12
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Published by Infineon Technologies AG