PANASONIC MN101DF09G

MN101D09E
Type
MN101D09E
MN101DF09G
Mask ROM
FLASH
ROM (byte)
80K
128K
RAM (byte)
2K
4K
Internal ROM type
Package (Lead-free)
Minimum Instruction
Execution Time
QFP100-P-1818B
[With main clock operated]
0.1397 µs (at 4.0 V to 5.5 V, 14.32 MHz)
0.1397 µs (at 4.0 V to 5.5 V, 14.32 MHz)
71.5 µs (at 2.7 V to 5.5 V, 14.32 MHz internal
71.5 µs (at 2.7 V to 5.5 V, 14.32 MHz internal
frequency di Vision)
frequency di Vision)
61 µs (at 2.5 V to 5.5 V, 32.768 kHz)
[When sub-clock operated]
61 µs (at 2.5 V to 5.5 V, 32.768 kHz)
 Interrupts
RESET, Runaway, External 0 to 4, Timer 0 to 3, Timer 6, Capstan FG, Control, HSW, Cylinder(Drum) FG, Servo V-sync,
Synchronous output, OSD, XDS, Serial 1, Serial 2, PWM 4, OSD V-sync
 Timer Counter
Timer counter 0 : 8-bit × 1 (timer function)
Clock source................ 1/4, 1/16 of system clock frequency
Interrupt source ........... overflow of timer counter 0
Timer counter 1 : 8-bit × 1 (timer function, linear timer counter function)
Clock source................ 1/4 of system clock frequency; CTL signal
Interrupt source ........... overflow of timer counter 1
Timer counter 2 : 16-bit × 1 (timer function, input capture (CTL specified edge), duty judgment of CTL signal)
Clock source................ 1/4, 1/16, 1/24 of system clock frequency
Interrupt source ........... overflow of timer counter 2; input of CTL specified edge; underflow of timer 2 shift register 4-bit counter;
coincidence of timer 2 shift register with timer 2 shift register compare register
Timer counter 3 : 16-bit × 1 (timer function)
Clock source................ 1/4, 1/16 of system clock frequency
Interrupt source ........... overflow of timer counter 3
Timer counter 5 : 19-bit × 1 (watchdog, stable oscillation waiting function)
Clock source................ system clock
Watchdog interrupt source ... 1/216, 1/219 of timer counter 5 frequency
Clear by stable oscillation ... after 256 counts by timer counter 5 (218 counts of OSC oscillation clock)
Timer counter 6 : 16-bit × 1 (clock function [max. 2 s])
Clock source................ 1/512 of OSC oscillation clock frequency; XI oscillation clock; 1/8, 1/128 of system clock frequency
Interrupt source ........... 1/213, 1/214, 1/215 overflow of timer counter 6
 Serial interface
Serial 1 : 8-bit × 1 (synchronous type)
(transfer direction of MSB/LSB selectable, start condition function)
Clock source................ 1/8, 1/16, 1/32, 1/64, 1/128, 1/256 of system clock frequency; NSBT1 pin input
Serial 2 : 8-bit × 1 (I²C)
(master transmission/reception, slave transmission/reception)
Clock source................ 1/144 to 1/252 of system clock; SCK pin input
MAD00033EEM
MN101D09E
 OSD
Display mode ........................... Menu(Internal synchronized ) display, super impose(external synchronized) display
Applicable broadcasting system.... NTSC, PAL, PAL-M, PAL-N
Screen configuration ................ 24 characters × 2n rows (n = 1 to 6)
Character type .......................... max. 128 character types (variable, include special characters)
Character size ........................... 12 × 18 dots (Vertical direction : 1 dot for 2H at not enlargement)
Enlarged characters .................. each × 2 settings in horizontal and vertical
Character interpolation............. none
Line background color ............. 8-hue settable in the row unit at menu display
Line background intensity........ 8 gradations settable in the row unit
Screen background color.......... 8-hue settable at omenu display
Character color ......................... white
Character intensity ................... 8 gradations settable in the row unit
Frame function ......................... 1-dot frame in 4 directions
Frame intensity......................... 4 gradations settable in the row unit
Blinking.................................... none (covered by software)
Inverted character..................... settable in the character unit
Halftone.................................... none
Input ......................................... composite video signal input (output level : 1 V[p-p] / 2 V[p-p])
Clamp method .......................... sync tip clamp, clamp level in 4 levels
Output ...................................... composite video output
Measure against image fluctuation...... built-in AFC circuit
Dot clock .................................. 1/2 of OSC oscillation clock (automatic phase adjustment)
 XDS
Built-in U.S. closed caption data slicer (optional 1 line data can be extracted.)
 I/O Pins
I/O
56
Common use : 45
Input
1
Common use : 1
 A/D converter
8-bit × 11-ch. (without S/H)
 PWM
13-bit × 2-ch. (at repetition cycle 572 ms at 14.32 MHz),
8-bit × 1-ch. (at repetition cycle 71.5 ms, 0.572 ms, 1.14 ms, 2.29 ms at 14.32 MHz)
 ICR
16-bit × 2-ch.(Speed system),
18-bit × 4-ch.(Phase system)
 OCR
16-bit × 3 (Synchronous output × 2, Rec CTL × 1 )
 Special Ports
3-state output (PTO) VLP pin; CTL input; Capstan FG input; Cylinder(Drum) PG/FG inputs; HSW output; Head amp/ Rotary control
outputs; output of 1/4 OSC oscillation clock (1 V[p-p])
 ROM Correction
Correcting address designation : up to 3 addresses possible
Correction method : correction program being saved in internal RAM
MAD00033EEM
 Electrical Charactreistics (Supply current)
Parameter
Operating supply current
Symbol
Supply current at HALT
min
typ
max
Unit
IDD1
14.32 MHz operation without load, VDD = 5 V
50
100
mA
IDD2
1/1024 of 14.32 MHz operation without load, VDD = 2.7 V
Stop of 14.32 MHz oscillation, VDD = 2.7 V
32 kHz oscillation operation without load
Stop of oscillation without load, VDD = 5 V
2
5
mA
50
100
µA
IDD3
Supply current at STOP
Limit
Condition
IDSP
IDHT0
IDHT1
14.32 MHz oscillation without load, VDD = 5 V
Stop of 14.32 MHz oscillation, VDD = 2.7 V
32 kHz oscillation operation without load
10
µA
5
15
mA
5
20
µA
(Ta = 25°C±2°C , VSS = 0 V)
 Electrical Charactreistics (A/D converter characteristics)
Parameter
Conversion relative error
A/D Conversion Time
Symbol
Condition
Limit
min
typ
∆NLAD
tAD
max
±3
fosc = 14.32 MHz
Analog Input Voltage
8
Unit
LSB
µs
5
V
(Ta = 25°C±2°C , VDD = 5.0 V , VSS = 0 V)
 Development tools
In-circuit Emulator
PX-ICE101C/D + PX-PRB101D08-QFP100-P-1818B-M
MAD00033EEM
MN101D09E
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
RCTLN
RCTLP
AVDD
CTLA
AVSS
VRI
VRO
AFG
FGF
YPG(↔PB7)
YFG(PFG)
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
FSCLPF(↔PB0)
FSCI(↔PB1)
AFCLPF(↔PB2)
AFCC(↔PB3)
VDD2
 Pin Assignment
MN101D09E
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
IRQ0(P64→)
IRQ1(P63↔)
IRQ2(P62↔)
IRQ3(P61↔)
IRQ4(P60↔)
N.C.
N.C.
N.C.
N.C.
N.C.
NSBT1(P07↔)
NSBI1(P06↔)
NSBO1(P05↔)
P02
P01
P00
SDA(P27↔)
SCK(P26↔)
HBUFD6(P46↔)
HBUFD4(P44↔)
HBUFD2(P42↔)
HBUFD0(P40↔)
HSW
VLP
NRST(P04←)
CO
N.C.
N.C.
AD10(↔PC2)
AD9(↔PC1)
AD8(↔PC0)
AD7(↔P87)
AD6(↔P86)
AD5(↔P85)
AD4(↔P84)
AD3(↔P83)
AD2(↔P82)
AD1(↔P81)
AD0(↔P80)
P77
P76
P75
P74
P73
P72
P71
P70
ROTA(↔P67)
HAMP(↔P66)
DENV(↔P65)
QFP100-P-1818B
MAD00033EEM
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
CVIN2(PB4↔)
CVIN(PB5↔)
VSS2
CVOUT(PB6↔)
N.C.
N.C.
N.C.
N.C.
SXI
XO(P23↔)
XI(P24↔)
VSS
OSCI
OSCO
VDD
PWM4(P25↔)
PWM0
PWM1
SBUFD1(P11↔)
SBUFD2(P12↔)
SBUFD3(P13↔)
SBUFD4(TC60, P14↔)
SBUFD5(P15↔)
SBUFD6(P16↔)
SBUFD7(OSCDIV, P17↔)
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd. Industrial Co., Ltd.